JP2002026467A5 - - Google Patents
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- Publication number
- JP2002026467A5 JP2002026467A5 JP2000199657A JP2000199657A JP2002026467A5 JP 2002026467 A5 JP2002026467 A5 JP 2002026467A5 JP 2000199657 A JP2000199657 A JP 2000199657A JP 2000199657 A JP2000199657 A JP 2000199657A JP 2002026467 A5 JP2002026467 A5 JP 2002026467A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit board
- reinforcing material
- reinforcing
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000012779 reinforcing material Substances 0.000 description 100
- 239000000758 substrate Substances 0.000 description 49
- 230000003014 reinforcing effect Effects 0.000 description 46
- 230000002787 reinforcement Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000006378 damage Effects 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000199657A JP2002026467A (ja) | 2000-06-30 | 2000-06-30 | 電子回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000199657A JP2002026467A (ja) | 2000-06-30 | 2000-06-30 | 電子回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002026467A JP2002026467A (ja) | 2002-01-25 |
| JP2002026467A5 true JP2002026467A5 (enrdf_load_stackoverflow) | 2004-07-22 |
Family
ID=18697641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000199657A Abandoned JP2002026467A (ja) | 2000-06-30 | 2000-06-30 | 電子回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002026467A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE530261C2 (sv) * | 2006-12-01 | 2008-04-15 | Atlas Copco Tools Ab | Kraftverktyg med en elektronisk styrenhet |
| JP5308008B2 (ja) | 2007-11-06 | 2013-10-09 | 三菱重工業株式会社 | 車載空調装置用電動圧縮機 |
| CN104133314B (zh) | 2009-05-02 | 2019-07-12 | 株式会社半导体能源研究所 | 显示设备 |
| CN113327913A (zh) * | 2021-05-28 | 2021-08-31 | 四川省星时代智能卫星科技有限公司 | 一种卫星芯片抗辐照封装结构及其制作方法 |
| CN116017860A (zh) * | 2022-12-05 | 2023-04-25 | 惠州市三和盛科技有限公司 | 一种单面pcb印刷线路板加工工艺 |
-
2000
- 2000-06-30 JP JP2000199657A patent/JP2002026467A/ja not_active Abandoned
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