JP2002026467A - 電子回路基板 - Google Patents
電子回路基板Info
- Publication number
- JP2002026467A JP2002026467A JP2000199657A JP2000199657A JP2002026467A JP 2002026467 A JP2002026467 A JP 2002026467A JP 2000199657 A JP2000199657 A JP 2000199657A JP 2000199657 A JP2000199657 A JP 2000199657A JP 2002026467 A JP2002026467 A JP 2002026467A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit board
- reinforcing member
- reinforcing
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 103
- 239000012779 reinforcing material Substances 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000006378 damage Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000199657A JP2002026467A (ja) | 2000-06-30 | 2000-06-30 | 電子回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000199657A JP2002026467A (ja) | 2000-06-30 | 2000-06-30 | 電子回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002026467A true JP2002026467A (ja) | 2002-01-25 |
JP2002026467A5 JP2002026467A5 (enrdf_load_stackoverflow) | 2004-07-22 |
Family
ID=18697641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000199657A Abandoned JP2002026467A (ja) | 2000-06-30 | 2000-06-30 | 電子回路基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002026467A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009060796A1 (ja) * | 2007-11-06 | 2009-05-14 | Mitsubishi Heavy Industries, Ltd. | 車載空調装置用電動圧縮機 |
JP2010511518A (ja) * | 2006-12-01 | 2010-04-15 | アトラス・コプコ・ツールス・アクチボラグ | 電子制御ユニットを備えた電動工具 |
JP2015207008A (ja) * | 2009-05-02 | 2015-11-19 | 株式会社半導体エネルギー研究所 | 表示装置 |
CN113327913A (zh) * | 2021-05-28 | 2021-08-31 | 四川省星时代智能卫星科技有限公司 | 一种卫星芯片抗辐照封装结构及其制作方法 |
CN116017860A (zh) * | 2022-12-05 | 2023-04-25 | 惠州市三和盛科技有限公司 | 一种单面pcb印刷线路板加工工艺 |
-
2000
- 2000-06-30 JP JP2000199657A patent/JP2002026467A/ja not_active Abandoned
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010511518A (ja) * | 2006-12-01 | 2010-04-15 | アトラス・コプコ・ツールス・アクチボラグ | 電子制御ユニットを備えた電動工具 |
WO2009060796A1 (ja) * | 2007-11-06 | 2009-05-14 | Mitsubishi Heavy Industries, Ltd. | 車載空調装置用電動圧縮機 |
JP2009114961A (ja) * | 2007-11-06 | 2009-05-28 | Mitsubishi Heavy Ind Ltd | 車載空調装置用電動圧縮機 |
US8435019B2 (en) | 2007-11-06 | 2013-05-07 | Mitsubishi Heavy Industries, Ltd. | Vehicle-air-conditioner electric compressor |
US9980389B2 (en) | 2009-05-02 | 2018-05-22 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US9397117B2 (en) | 2009-05-02 | 2016-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP2015207008A (ja) * | 2009-05-02 | 2015-11-19 | 株式会社半導体エネルギー研究所 | 表示装置 |
US10580796B2 (en) | 2009-05-02 | 2020-03-03 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US11215858B2 (en) | 2009-05-02 | 2022-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US11598982B2 (en) | 2009-05-02 | 2023-03-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US11809030B2 (en) | 2009-05-02 | 2023-11-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US12248210B2 (en) | 2009-05-02 | 2025-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
CN113327913A (zh) * | 2021-05-28 | 2021-08-31 | 四川省星时代智能卫星科技有限公司 | 一种卫星芯片抗辐照封装结构及其制作方法 |
CN116017860A (zh) * | 2022-12-05 | 2023-04-25 | 惠州市三和盛科技有限公司 | 一种单面pcb印刷线路板加工工艺 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A762 | Written abandonment of application |
Free format text: JAPANESE INTERMEDIATE CODE: A762 Effective date: 20040811 |