JP2002026467A - Electronic circuit board - Google Patents

Electronic circuit board

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Publication number
JP2002026467A
JP2002026467A JP2000199657A JP2000199657A JP2002026467A JP 2002026467 A JP2002026467 A JP 2002026467A JP 2000199657 A JP2000199657 A JP 2000199657A JP 2000199657 A JP2000199657 A JP 2000199657A JP 2002026467 A JP2002026467 A JP 2002026467A
Authority
JP
Japan
Prior art keywords
electronic circuit
circuit board
reinforcing member
reinforcing
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2000199657A
Other languages
Japanese (ja)
Other versions
JP2002026467A5 (en
Inventor
Shigetada Goto
茂忠 後藤
Sadahiro Yoshida
禎宏 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2000199657A priority Critical patent/JP2002026467A/en
Publication of JP2002026467A publication Critical patent/JP2002026467A/en
Publication of JP2002026467A5 publication Critical patent/JP2002026467A5/ja
Abandoned legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To suppress the flexure of an electronic circuit board low to prevent electronic components flat-mounted on the electronic circuit board from breaking and make the handling of the electronic circuit board convenient. SOLUTION: Reinforcing members 200 are laid on end portions of the upside and the downside of an electronic circuit board 100a and fixed by the adhering or other method to suppress the flexure of the electronic circuit board 100a low.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、電子部品が面実
装される電子回路基板に関する。
The present invention relates to an electronic circuit board on which electronic components are surface-mounted.

【0002】[0002]

【従来の技術】図12は従来の技術による電子回路基板
を示す図であり、図12(a)は電子回路基板100の
上面に電子部品101aが面実装された状態を示す斜視
図である。また、図12(b)は電子部品101aが面
実装された電子回路基板100に大きなたわみが生じた
場合を示す断面図である。図12(b)に示すように、
電子部品101aを面実装後に電子回路基板100に大
きなたわみが生じると電子部品101aが破損する恐れ
がある。そのため電子回路基板100を慎重に取り扱う
必要があった。
2. Description of the Related Art FIG. 12 is a view showing an electronic circuit board according to a conventional technique, and FIG. 12A is a perspective view showing a state in which an electronic component 101a is surface-mounted on an upper surface of an electronic circuit board 100. FIG. 12B is a cross-sectional view showing a case where a large deflection has occurred in the electronic circuit board 100 on which the electronic component 101a is surface-mounted. As shown in FIG.
If the electronic circuit board 100 is significantly bent after the electronic component 101a is surface-mounted, the electronic component 101a may be damaged. Therefore, it was necessary to handle the electronic circuit board 100 carefully.

【0003】また、別の従来の技術を示す文献として、
三菱マテリアルのDIA CAP(MDC)chip type
multilayer ceramic capacitorのカタログがあり、この
カタログの11ページの使用上の注意、実装の説明欄に
実装基板のたわみがチップ割れやクラックの原因となる
ことが示されている。また同欄に、実装時に電子回路基
板の端部を基板ガイドによって支持している図が示され
ているが、この基板ガイドは実装時にのみ用いる基板保
持のための部材であり、電子回路基板に固着しておら
ず、実装後の基板の補強に用いるものではない。
[0003] Further, as a document showing another conventional technique,
DIA CAP (MDC) chip type of Mitsubishi Materials
There is a catalog of multilayer ceramic capacitor, and on page 11 of this catalog, notes on use and mounting description indicate that the deflection of the mounting substrate causes chip cracking and cracking. In the same column, a diagram in which the end of the electronic circuit board is supported by a board guide at the time of mounting is shown, but this board guide is a member for holding the board used only at the time of mounting, and is used for the electronic circuit board. It is not fixed and is not used to reinforce the board after mounting.

【0004】[0004]

【発明が解決しようとする課題】この発明は上記のよう
な問題点を解決するためになされたものであり、電子回
路基板のたわみを防止して電子部品の破壊を防止し、以
って電子回路基板の信頼性の向上を図り、取り扱いの簡
便な電子回路基板を得ることを目的とするものである。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is intended to prevent the bending of an electronic circuit board to prevent the destruction of electronic components, thereby preventing the electronic components from being broken. It is an object of the present invention to improve the reliability of a circuit board and to obtain an electronic circuit board that is easy to handle.

【0005】[0005]

【課題を解決するための手段】この発明による電子回路
基板は、電子部品が面実装される電子回路基板に補強材
を固定させたものである。
An electronic circuit board according to the present invention has a reinforcing member fixed to an electronic circuit board on which electronic components are surface-mounted.

【0006】また、この発明による電子回路基板は、上
記のような構成において、補強材は一方向またはそれ以
上の方向に伸びる平面を有する部材であり、電子回路基
板の上面か裏面、もしくはその両面にそれぞれ上記補強
材の平面部を接着固定したものである。
In the electronic circuit board according to the present invention, the reinforcing member is a member having a flat surface extending in one or more directions in the above structure, and the upper surface or the rear surface of the electronic circuit substrate, or both surfaces thereof In this case, the flat part of the reinforcing material is bonded and fixed.

【0007】さらに、この発明による電子回路基板は、
上記のような構成において、補強材は電子回路基板の厚
みに相当する溝部が設けられた一方向またはそれ以上の
方向に伸びる部材であり、上記電子回路基板の端部を上
記補強材の溝部にはめ込み、接着固定したものである。
[0007] Further, the electronic circuit board according to the present invention comprises:
In the configuration as described above, the reinforcing material is a member extending in one or more directions provided with a groove corresponding to the thickness of the electronic circuit board, and the end of the electronic circuit board is formed in the groove of the reinforcing material. It was fitted and fixed with adhesive.

【0008】また、この発明による電子回路基板は、上
記のような構成において、補強材は絶縁性部材により構
成されるものである。
Further, in the electronic circuit board according to the present invention, in the above configuration, the reinforcing member is formed of an insulating member.

【0009】さらに、この発明による電子回路基板は、
上記のような構成において、補強材は電子回路基板の外
周を囲む形状であり、導電性部材により構成され、接地
されるものである。
Further, an electronic circuit board according to the present invention comprises:
In the above configuration, the reinforcing member has a shape surrounding the outer periphery of the electronic circuit board, is formed of a conductive member, and is grounded.

【0010】また、この発明による電子回路基板は、上
記のような構成に加え、電子回路基板の上面か裏面、も
しくはその両面に被着された補強材を貫通する穴部を設
け、上記穴部に取り付け部材を通して上記補強材を上記
電子回路基板に固定するものである。
The electronic circuit board according to the present invention may further comprise, in addition to the above-described configuration, a hole penetrating a reinforcing material attached to the upper surface, the rear surface, or both surfaces of the electronic circuit substrate. Then, the reinforcing material is fixed to the electronic circuit board through a mounting member.

【0011】さらに、この発明による電子回路基板は、
上記のような構成において、補強材は電子回路基板の厚
みに相当する溝部が設けられた一方向に伸びる部材四本
により構成され、上記電子回路基板の外周四辺を囲むよ
うに、上記電子回路基板の端部を上記補強材の溝部には
め込み、上記電子回路基板の四隅において隣接する上記
補強材同士をネジ止めして固定するものである。
Further, the electronic circuit board according to the present invention comprises:
In the above configuration, the reinforcing member is formed of four members extending in one direction provided with a groove corresponding to the thickness of the electronic circuit board, and the electronic circuit board is formed so as to surround four sides of the outer periphery of the electronic circuit board. Are inserted into the grooves of the reinforcing member, and the reinforcing members adjacent to each other at four corners of the electronic circuit board are fixed by screws.

【0012】また、この発明による電子回路基板は、上
記のような構成において、補強材は導電性部材であり、
電子回路基板に設けられた0電位パターンと上記補強材
とが電気的に接続されるものである。
Further, in the electronic circuit board according to the present invention, in the above configuration, the reinforcing member is a conductive member,
The zero potential pattern provided on the electronic circuit board is electrically connected to the reinforcing material.

【0013】さらに、この発明による電子回路基板は、
上記のような構成において、補強材は一方向またはそれ
以上の方向に伸びる平面を有し、部分的に凸部が形成さ
れた導電性部材であり、電子回路基板を貫通して設けら
れた穴部に上記凸部を嵌合させ、上記補強材の平面と上
記電子回路基板の上面を合わせ、上記電子回路基板の裏
面側に突き出した上記凸部を上記電子回路基板に半田付
けして上記電子回路基板に固定するものである。
Further, an electronic circuit board according to the present invention comprises:
In the above configuration, the reinforcing member is a conductive member having a plane extending in one or more directions, a conductive member having a partially formed convex portion, and a hole provided through the electronic circuit board. The projection is fitted to the portion, the flat surface of the reinforcing material and the upper surface of the electronic circuit board are aligned, and the projection protruding to the back side of the electronic circuit board is soldered to the electronic circuit board to form the electronic component. It is to be fixed to a circuit board.

【0014】また、この発明による電子回路基板は、上
記のような構成において、補強材は電子回路基板の厚み
に相当する溝部が設けられた一方向に伸びる部材四本に
より構成され、上記補強材をあらかじめそれぞれの部材
が回動可能になるように一続きに接続し、上記電子回路
基板の外周四辺を四つの部材からなる上記補強材の溝に
それぞれはめ込み、一続きの上記補強材の両端部を固定
することで上記補強材を上記電子回路基板に固定するも
のである。
In the electronic circuit board according to the present invention, in the above structure, the reinforcing member is constituted by four members extending in one direction provided with a groove corresponding to the thickness of the electronic circuit board. Are connected in advance so that the respective members are rotatable, and the outer four sides of the electronic circuit board are fitted into the grooves of the reinforcing member composed of four members, respectively, and both ends of the continuous reinforcing member Is fixed to fix the reinforcing material to the electronic circuit board.

【0015】さらに、この発明による電子回路基板は、
上記のような構成において、補強材は電子回路基板の外
周を囲む枠状部材であり、上記電子回路基板の上面裏面
にそれぞれ配置され、重ね合わせられた上記電子回路基
板およびその上面裏面に配置された上記枠状部材を挟み
込む取り付け部材によって上記補強材を上記電子回路基
板に固定するものである。
Further, the electronic circuit board according to the present invention comprises:
In the configuration as described above, the reinforcing material is a frame-shaped member surrounding the outer periphery of the electronic circuit board, and is disposed on the upper surface and the lower surface of the electronic circuit substrate, respectively, and is disposed on the superposed electronic circuit substrate and the upper surface and the lower surface. The reinforcing member is fixed to the electronic circuit board by an attaching member that sandwiches the frame-shaped member.

【0016】また、この発明による電子回路基板は、上
記のような構成において、補強材は電子回路基板の厚み
に相当する溝部が設けられた一方向に伸びる部材であ
り、上記電子回路基板端部に設けられる固定用突起に嵌
合する嵌合部を有し、上記電子回路基板の端部を上記補
強材の溝部にはめ込んだ状態で上記電子回路基板の固定
用突起を上記補強材に嵌合させることで、上記補強材を
上記電子回路基板に固定するものである。
In the electronic circuit board according to the present invention, in the above configuration, the reinforcing member is a member extending in one direction provided with a groove corresponding to the thickness of the electronic circuit board. A fitting portion fitted to the fixing protrusion provided on the electronic circuit board, and the fixing protrusion of the electronic circuit board is fitted to the reinforcing material in a state where the end of the electronic circuit board is fitted in the groove of the reinforcing material. By doing so, the reinforcing material is fixed to the electronic circuit board.

【0017】[0017]

【発明の実施の形態】実施の形態1.図1はこの発明の
実施の形態1による電子回路基板を示すものであり、図
1(a)は電子部品101を電子回路基板100aの上
面に面実装した場合の斜視図を示すものであり、図1
(b)は電子回路基板100aの端部の断面構造を示す
断面図である。なお、符号200は電子回路基板100
aの端部に接着剤などを用いて固着させる補強材を示し
ている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 shows an electronic circuit board according to Embodiment 1 of the present invention. FIG. 1A shows an electronic component 101 with an electronic component 101 on the upper surface of an electronic circuit substrate 100a. FIG. 1 is a perspective view showing a case where the device is mounted, and FIG.
(B) is a sectional view showing a sectional structure of an end of the electronic circuit board 100a. Reference numeral 200 denotes the electronic circuit board 100
A reinforcing material is fixed to the end of FIG.

【0018】補強材200は図1に示すように、一方向
に伸び、電子回路基板100aの表面に密着させるため
の平面部を有する部材により構成され、電子回路基板1
00aの端部の上面および裏面に電子回路基板100a
を挟むように被着させる。図1(a)に示すように、電
子回路基板100aの端部を構成する4辺のうちの相対
向する位置となる2辺に補強材200を被着させること
で、補強材を用いない場合と比較して、電子回路基板1
00aにたわみが生じることを抑制することができ、面
実装される電子部品101に対するダメージを小さく抑
制することが可能となる。
As shown in FIG. 1, the reinforcing member 200 is formed of a member which extends in one direction and has a flat portion for adhering to the surface of the electronic circuit board 100a.
Electronic circuit board 100a
To be sandwiched. As shown in FIG. 1A, a case where the reinforcing material 200 is not used by attaching the reinforcing material 200 to two opposite sides of the four sides forming the end of the electronic circuit board 100a. Compared to the electronic circuit board 1
00a can be suppressed from occurring, and damage to the electronic component 101 to be surface-mounted can be suppressed to a small extent.

【0019】なお、補強材200を電子回路基板100
aに被着させるタイミングについてであるが、電子部品
101の実装前に補強材200を取り付ければ、電子部
品101の実装時における電子回路基板100aのたわ
みに依存するダメージを軽減することが可能となること
は言うまでもない。また、電子部品101の実装後に電
子回路基板100aの端部に補強材200を取り付けた
場合においても、その後の電子回路基板100aのたわ
みを小さく抑制することが可能であるために、これに伴
って面実装されている電子部品101が受けうるダメー
ジを小さく軽減することが可能となる。
The reinforcing member 200 is connected to the electronic circuit board 100.
Regarding the timing of attaching the electronic component 101 to the a, if the reinforcing member 200 is attached before the electronic component 101 is mounted, it is possible to reduce damage depending on the deflection of the electronic circuit board 100a when the electronic component 101 is mounted. Needless to say. Further, even when the reinforcing member 200 is attached to the end of the electronic circuit board 100a after the mounting of the electronic component 101, the subsequent bending of the electronic circuit board 100a can be suppressed to be small. Damage that can be received by the electronic component 101 mounted on the surface can be reduced.

【0020】図1においては、補強材200を電子回路
基板100aの外周を構成する4辺のうち相対向する2
辺に沿って配置する場合について例示しているが、他の
2辺にも同様に補強材を配置することで、電子回路基板
100aのたわみをさらに小さくすることが可能とな
る。また、図1では電子回路基板100aの端部を挟む
ように補強材200を被着させるが、電子回路基板10
0aの中央部に補強材を被着させたり、電子回路基板1
00aの上面か裏面どちらかのみ補強材を被着させた場
合でも、電子回路基板100aのたわみを小さくするこ
とが可能である。なお、図1(a)では補強材200は
一方向に伸びているが、複数の方向のたわみを抑制する
ため、多方向に伸びた補強材を用いることも可能である
ことは言うまでもない。
In FIG. 1, the reinforcing member 200 is provided on two opposing sides of the four sides constituting the outer periphery of the electronic circuit board 100a.
Although the case of arranging along the side is illustrated, by arranging the reinforcing material on the other two sides similarly, it is possible to further reduce the deflection of the electronic circuit board 100a. In FIG. 1, the reinforcing member 200 is attached so as to sandwich the end of the electronic circuit board 100a.
A reinforcing material is applied to the center of the electronic circuit board 1a.
Even when a reinforcing material is applied to only the upper surface or the back surface of the electronic circuit board 100a, the deflection of the electronic circuit board 100a can be reduced. In FIG. 1A, the reinforcing member 200 extends in one direction, but it goes without saying that a reinforcing member extending in multiple directions can be used in order to suppress deflection in a plurality of directions.

【0021】実施の形態2.先述の実施の形態1におい
ては、補強材200は一方向に伸びる平板状の部材であ
る例を示したが、この実施の形態2では、図2に示すよ
うに補強材200aが電子回路基板100bの厚みに相
当する溝部1aが設けられた一方向に伸びる部材であ
り、電子回路基板100bの端部を補強材200aの溝
部1aにはめ込んで接着固定する例を示す。図2(a)
はこの実施の形態2による電子回路基板の斜視図を、図
2(b)は電子回路基板端部の断面構造を示す断面図を
示すものである。
Embodiment 2 In Embodiment 1 described above, an example is shown in which the reinforcing member 200 is a plate-like member extending in one direction. In Embodiment 2, as shown in FIG. An example is shown in which a reinforcing member 200a is a member extending in one direction provided with a groove 1a corresponding to the thickness of the electronic circuit board 100b, and an end of the electronic circuit board 100b is fitted and fixed to the groove 1a of the reinforcing member 200a. . FIG. 2 (a)
2 is a perspective view of an electronic circuit board according to the second embodiment, and FIG. 2B is a cross-sectional view showing a cross-sectional structure of an end of the electronic circuit board.

【0022】図2に示すように、補強材200aの溝部
1aに電子回路基板100bの端部をはめ込み、接着剤
などで固定する方法で電子回路基板100bのたわみを
抑制するための補強を行うことも可能である。なお、図
2(a)においては、電子回路基板100bの外周を構
成する4辺のうちの相対向する2辺に沿って補強材20
0aを被着させる場合を示しているが、これ以外に、外
周を完全に囲むように四つの補強材200aを組合わせ
て用いることも可能であることは言うまでもない。ま
た、図2(a)では補強材200aは一方向に伸びてい
るが、電子回路基板100bの外周を構成する互いに隣
り合う2辺を補強する、二方向に伸びた補強材を用いる
ことも可能であることは言うまでもない。
As shown in FIG. 2, the end of the electronic circuit board 100b is fitted into the groove 1a of the reinforcing member 200a and is reinforced by an adhesive or the like to suppress the deflection of the electronic circuit board 100b. Is also possible. In FIG. 2A, the reinforcing member 20 extends along two opposing sides of the four sides constituting the outer periphery of the electronic circuit board 100b.
Although the case where 0a is adhered is shown, it goes without saying that it is also possible to use a combination of four reinforcing members 200a so as to completely surround the outer periphery. In FIG. 2A, the reinforcing member 200a extends in one direction, but a reinforcing member extending in two directions, which reinforces two adjacent sides constituting the outer periphery of the electronic circuit board 100b, may be used. Needless to say,

【0023】実施の形態3.次に、この発明の実施の形
態3について図3を用いて説明する。図3(a)はこの
発明による実施の形態3の電子回路基板の斜視図、図3
(b)は電子回路基板端部の断面構造を示す断面図であ
る。先述の実施の形態2においては補強材200aの材
質については特に限定しなかったが、この実施の形態3
では絶縁性物質によって構成された絶縁性補強材201
を用いて電子回路基板100bを補強している場合につ
いて説明する。なお、絶縁性補強材201の形状は実施
の形態2の補強材200aと同じとする。
Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 3A is a perspective view of an electronic circuit board according to Embodiment 3 of the present invention.
(B) is a sectional view showing a sectional structure of an end portion of the electronic circuit board. In the second embodiment, the material of the reinforcing member 200a is not particularly limited.
Insulating reinforcing material 201 made of an insulating material
The case where the electronic circuit board 100b is reinforced by using the above will be described. The shape of the insulating reinforcing material 201 is the same as that of the reinforcing material 200a of the second embodiment.

【0024】図3(a)に示すように、電子回路基板1
00bの近傍に高電圧配線300が配置されている場
合、電子回路基板100bの外周に絶縁性補強材201
を配置固定することによって、電子回路基板100bと
高電圧配線300との絶縁性を向上させることが可能と
なる。また、図3では実施の形態2に対して絶縁性補強
材を用いた場合を示しているが、実施の形態1に対して
絶縁性補強材を用いた場合でも電子回路基板と高電圧配
線との絶縁性を向上させることが可能となる。
As shown in FIG. 3A, the electronic circuit board 1
In the case where the high-voltage wiring 300 is disposed near the electronic circuit board 100b, the insulating reinforcing material 201
By disposing and fixing, it is possible to improve the insulation between the electronic circuit board 100b and the high-voltage wiring 300. FIG. 3 shows a case where an insulating reinforcing material is used in the second embodiment. However, even when an insulating reinforcing material is used in the first embodiment, the electronic circuit board and the high-voltage wiring are not used. Can be improved in insulation.

【0025】実施の形態4.次に、この発明の実施の形
態4について図4を用いて説明する。図4(a)はこの
発明による実施の形態4の電子回路基板の斜視図、図4
(b)は電子回路基板の断面構造を示す断面図である。
図4において、符号202a、202bは導電性物質か
らなる導電性補強材であり、一方向に伸び、電子回路基
板100bの厚みに相当する溝1aが切られており、電
子回路基板100bの外周を覆うように4つの部材を組
合わせることで枠状に取り付けられている。
Embodiment 4 Next, Embodiment 4 of the present invention will be described with reference to FIG. FIG. 4A is a perspective view of an electronic circuit board according to Embodiment 4 of the present invention.
(B) is a sectional view showing a sectional structure of the electronic circuit board.
In FIG. 4, reference numerals 202a and 202b denote conductive reinforcing members made of a conductive substance, extend in one direction, have grooves 1a corresponding to the thickness of the electronic circuit board 100b, and extend along the outer periphery of the electronic circuit board 100b. It is attached in a frame shape by combining four members so as to cover it.

【0026】図4(a)、(b)に示すように、導電性
補強材202a、202bを接地することで、電子回路
基板100bの帯電防止が可能であり、さらに外部から
のノイズなどの電気的悪影響があった場合においても、
その悪影響を軽減することができ、さらに、先述の実施
の形態1〜3の場合と同様に、電子回路基板100bの
たわみを防止することも可能である。また、図4では実
施の形態2に対して導電性補強材を用いた場合を示して
いるが、実施の形態1に対して導電性補強材を用いた場
合でも同様の効果を得ることが可能である。
As shown in FIGS. 4 (a) and 4 (b), by grounding the conductive reinforcing members 202a and 202b, it is possible to prevent the electronic circuit board 100b from being charged, and furthermore, to prevent electric noise such as external noise. If there is a negative impact,
The adverse effect can be reduced, and the bending of the electronic circuit board 100b can be prevented as in the first to third embodiments. FIG. 4 shows the case where the conductive reinforcing material is used in the second embodiment. However, the same effect can be obtained when the conductive reinforcing material is used in the first embodiment. It is.

【0027】実施の形態5.次に、この発明の実施の形
態5について図5を用いて説明する。図5(a)はこの
発明による電子回路基板の斜視図であり、図5(b)は
電子回路基板端部の断面構造を示す断面図である。先述
の実施の形態1では平板状の補強材200を電子回路基
板100cの端部の上面裏面に接着剤などで固定する例
を示したが、同じ平板状の補強材200bを用い、取り
付け部材400によって固定する場合について説明す
る。
Embodiment 5 Next, Embodiment 5 of the present invention will be described with reference to FIG. FIG. 5A is a perspective view of an electronic circuit board according to the present invention, and FIG. 5B is a cross-sectional view showing a cross-sectional structure of an end of the electronic circuit board. In the above-described first embodiment, an example in which the flat reinforcing material 200 is fixed to the back surface of the upper surface of the end of the electronic circuit board 100c with an adhesive or the like has been described. A description will be given of the case of fixing by.

【0028】図5(b)の断面図に示すように、補強材
200bと電子回路基板100cを貫通する貫通穴2a
を設け、この貫通穴2aに取り付け部材400の一端を
通し、その先端部を潰すなどして補強材200bと電子
回路基板100cとの固定を行う。このように補強材2
00bを取り付け部材400によって電子回路基板10
0cに固定することでも、実施の形態1の場合と同様に
電子回路基板100cのたわみを抑制することが可能と
なり、また接着固定に要する時間を短縮できる。また、
図5では電子回路基板100cの端部を挟むように補強
材200bを固定するが、電子回路基板100cの中央
部に補強材を被着させたり、電子回路基板100cの上
面か裏面どちらかのみ補強材を固定した場合でも、電子
回路基板100cのたわみを小さくすることが可能であ
る。
As shown in the sectional view of FIG. 5B, a through hole 2a penetrating through the reinforcing member 200b and the electronic circuit board 100c.
The reinforcing member 200b and the electronic circuit board 100c are fixed by passing one end of the mounting member 400 through the through hole 2a and crushing the tip. Thus, the reinforcing material 2
00b is attached to the electronic circuit board 10 by the attaching member 400.
By fixing to 0c, the bending of the electronic circuit board 100c can be suppressed as in the first embodiment, and the time required for bonding and fixing can be reduced. Also,
In FIG. 5, the reinforcing member 200b is fixed so as to sandwich the end of the electronic circuit board 100c. However, the reinforcing member is applied to the center of the electronic circuit board 100c, or only the upper surface or the back surface of the electronic circuit substrate 100c is reinforced. Even when the material is fixed, the deflection of the electronic circuit board 100c can be reduced.

【0029】実施の形態6.次に、この発明の実施の形
態6について図6を用いて説明する。図6(a)はこの
発明による電子回路基板の斜視図であり、図6(b)は
電子回路基板の外周を囲む補強材の外周角部での接続状
態を示す図である。この実施の形態6における補強材2
03aは電子回路基板100bの外周の長辺方向の端部
に配置され、電子回路基板100bの端部をはめ込むた
めの溝部1aを有する部材であり、基板のコーナー部に
おいてもう一方の補強材203bと接続するために端部
にネジを通すための貫通穴3aが形成されている。
Embodiment 6 Next, Embodiment 6 of the present invention will be described with reference to FIG. FIG. 6A is a perspective view of an electronic circuit board according to the present invention, and FIG. 6B is a view showing a connection state at an outer peripheral corner of a reinforcing member surrounding the outer periphery of the electronic circuit board. Reinforcing member 2 in Embodiment 6
Reference numeral 03a denotes a member which is disposed at an end of the outer periphery of the electronic circuit board 100b in the long side direction and has a groove 1a for fitting the end of the electronic circuit board 100b, and another reinforcing member 203b at a corner of the board. A through hole 3a through which a screw is inserted is formed at the end for connection.

【0030】また、補強材203bは電子回路基板10
0bの外周の短辺方向の端部に配置され、電子回路基板
100bの端部をはめ込むための溝部は有しておらず、
貫通穴3aにつづく位置にネジ加工部3bが形成されて
いる。実施の形態4においては、接着剤などを用いて電
子回路基板100bに補強材202a、202bを接着
して固定する例を示したが、この図6に示すように、ネ
ジ500を用いて電子回路基板100bの角部において
接する二つの補強材203a、203bをネジ止めして
固定することでも同様の効果を得ることが可能である。
The reinforcing member 203b is provided on the electronic circuit board 10
0b is disposed at the end in the short side direction of the outer periphery and has no groove for fitting the end of the electronic circuit board 100b,
A threaded portion 3b is formed at a position following the through hole 3a. In the fourth embodiment, an example is shown in which the reinforcing members 202a and 202b are bonded and fixed to the electronic circuit board 100b using an adhesive or the like. However, as shown in FIG. A similar effect can be obtained by fixing the two reinforcing members 203a and 203b that are in contact at the corners of the substrate 100b with screws.

【0031】実施の形態7.次にこの発明の実施の形態
7について図7を用いて説明する。図7において符号2
04は電子回路基板100dの厚みに相当する溝1aが
切られた導電性物質により構成された導電性補強材であ
り、600は電子回路基板100dの上面に形成された
0電位パターンであり、0電位パターン600はワイヤ
によって導電性補強材204に電気的に接続された状態
となっている。0電位パターン600と導電性補強材2
04をワイヤを介するなどして電気的に接続することに
よって電源の0電位の変動を抑制することができ、ノイ
ズ対策の強化が可能となる。なお、電子回路基板100
dのたわみを小さく抑制できることは言うまでもない。
Embodiment 7 Next, Embodiment 7 of the present invention will be described with reference to FIG. In FIG.
Reference numeral 04 denotes a conductive reinforcing material made of a conductive material having a groove 1a corresponding to the thickness of the electronic circuit board 100d, and reference numeral 600 denotes a zero potential pattern formed on the upper surface of the electronic circuit board 100d. The potential pattern 600 is in a state of being electrically connected to the conductive reinforcing member 204 by a wire. Zero potential pattern 600 and conductive reinforcing material 2
By electrically connecting 04 through a wire or the like, fluctuations in the 0 potential of the power supply can be suppressed, and noise countermeasures can be strengthened. The electronic circuit board 100
It goes without saying that the deflection of d can be suppressed small.

【0032】実施の形態8.次に、この発明の実施の形
態8について図8を用いて説明する。図8(a)はこの
発明による電子回路基板の斜視図であり、図8(b)は
電子回路基板と補強材との接続状態を示す断面図であ
る。導電性補強材205は一方向に伸びる平板状の部材
であり、複数個の凸部4aが設けられており、電子回路
基板100eに凸部4aに嵌合する穴部が設けられてお
り、その穴に凸部4aを嵌合させた状態で、裏面側から
凸部4aを電子回路基板100eに半田4bによって半
田付けすることで導電性補強材205と電子回路基板1
00eとを固定している。このように、導電性補強材2
05を半田付けにより電子回路基板100eに固定して
も電子回路基板100eのたわみを小さく抑制すること
ができる。また、図8では電子回路基板100eの端部
に補強材205を固定するが、電子回路基板100eの
中央部に補強材を被着させた場合でも、電子回路基板1
00eのたわみを小さくすることが可能である。
Embodiment 8 Next, Embodiment 8 of the present invention will be described with reference to FIG. FIG. 8A is a perspective view of an electronic circuit board according to the present invention, and FIG. 8B is a cross-sectional view showing a connection state between the electronic circuit board and a reinforcing member. The conductive reinforcing member 205 is a plate-shaped member extending in one direction, is provided with a plurality of protrusions 4a, and has a hole that fits into the protrusions 4a on the electronic circuit board 100e. With the protrusion 4a fitted into the hole, the protrusion 4a is soldered to the electronic circuit board 100e from the back side with the solder 4b, so that the conductive reinforcing material 205 and the electronic circuit board 1 are soldered.
00e. Thus, the conductive reinforcing material 2
Even if the electronic circuit board 05 is fixed to the electronic circuit board 100e by soldering, the bending of the electronic circuit board 100e can be reduced. Although the reinforcing member 205 is fixed to the end of the electronic circuit board 100e in FIG. 8, even when the reinforcing member is attached to the center of the electronic circuit board 100e, the electronic circuit board 1
00e can be reduced.

【0033】実施の形態9.次に、この発明の実施の形
態9について図9を用いて説明する。図9(a)はこの
発明による電子回路基板の斜視図であり、図9(b)は
電子回路基板の外周を囲む補強材206の電子回路基板
100bへの取り付け前の段階での構成図であり、電子
回路基板100bの外周4辺を囲むための4つの部材か
らなる補強材206はあらかじめ一続きとなるように端
部を回動可能な状態に接続している。
Ninth Embodiment Next, a ninth embodiment of the present invention will be described with reference to FIG. FIG. 9A is a perspective view of an electronic circuit board according to the present invention, and FIG. 9B is a configuration diagram at a stage before the reinforcing member 206 surrounding the outer periphery of the electronic circuit board is attached to the electronic circuit board 100b. In addition, the reinforcing member 206 made of four members for surrounding the four sides of the outer periphery of the electronic circuit board 100b is connected in advance in a rotatable manner so as to be continuous.

【0034】補強材206同士を接続するためには、重
なり合う補強材206に対して貫通穴を形成し、先述の
実施の形態5において示した取り付け部材400を用い
て両者を回動可能に固定する。なお、補強材206には
電子回路基板100bの厚みに相当する溝が切られてお
り、その溝に電子回路基板100bの端部をはめ込む構
成である。一続きとなった4つの補強材206を電子回
路基板100bの外周に順次巻きつけるように取り付
け、最後に、固定されていない補強材206の端部同士
を重ね合わせ取り付け部材400によって固定する。こ
のような構成であっても電子回路基板100bのたわみ
を小さく抑制することが可能となる。
In order to connect the reinforcing members 206 to each other, a through hole is formed in the overlapping reinforcing members 206, and the two are rotatably fixed using the mounting member 400 described in the fifth embodiment. . A groove corresponding to the thickness of the electronic circuit board 100b is cut in the reinforcing member 206, and the end of the electronic circuit board 100b is fitted into the groove. The continuous four reinforcing members 206 are attached so as to be sequentially wound around the outer periphery of the electronic circuit board 100 b, and finally, the ends of the unfixed reinforcing members 206 are overlapped and fixed by the mounting member 400. Even with such a configuration, the deflection of the electronic circuit board 100b can be suppressed to be small.

【0035】実施の形態10.次に、この発明の実施の
形態10について図10を用いて説明する。図10
(a)は電子回路基板100aの上面および裏面に枠状
の補強材207を配置し、電子回路基板100aとその
上面裏面に位置する2枚の補強材207を外周側から取
り付け部材400aで挟み込んで固定する場合の斜視図
を、図10(b)は取り付け部材400aによって、重
ね合わせられた電子回路基板100aと補強材207と
を固定している箇所の断面構造を示す断面図を示すもの
である。
Embodiment 10 Next, Embodiment 10 of the present invention will be described with reference to FIG. FIG.
9A, a frame-shaped reinforcing member 207 is arranged on the upper and lower surfaces of the electronic circuit board 100a, and the electronic circuit board 100a and the two reinforcing members 207 located on the upper and lower surfaces of the electronic circuit board 100a are sandwiched between mounting members 400a from the outer periphery. FIG. 10 (b) is a perspective view of the case where the electronic circuit board 100a and the reinforcing member 207 are fixed by the mounting member 400a. .

【0036】取り付け部材400aは枠状部材である補
強材207の四つの辺の中央部にそれぞれ取り付けるこ
とで安定した固定が可能である。また取り付け部材40
0aは金属製とするなどバネ性を有する材料によって構
成されるものが適しており、その場合あらかじめ形を作
っておき、電子回路基板100aの上面および裏面側に
補強材207を配置後、補強材207にはめ込むように
して取り付けることができる。このように、取り付け部
材400aによって補強材207を電子回路基板100
aに取り付けても、電子回路基板100aのたわみを小
さく抑制することが可能である。
The attachment member 400a can be stably fixed by attaching it to the center of four sides of the reinforcing member 207, which is a frame-shaped member. The mounting member 40
The material 0a is preferably made of a material having a spring property such as a metal. In this case, the shape is formed in advance, and the reinforcing material 207 is disposed on the upper surface and the back surface of the electronic circuit board 100a. 207 can be attached so as to fit. Thus, the reinforcing member 207 is attached to the electronic circuit board 100 by the attachment member 400a.
a, the bending of the electronic circuit board 100a can be suppressed to a small value.

【0037】実施の形態11.次に、この発明の実施の
形態11について図11を用いて説明する。図11
(a)は、電子回路基板100fの厚みに相当する溝部
1aが設けられた一方向に伸びる補強材208を、電子
回路基板100fの端部に設けられた補強材208との
固定用の先端部がカギ状に折れ曲がった突起5aに嵌合
させて固定する電子回路基板100fの斜視図であり、
図10(b)は電子回路基板100fの端部から突き出
すように形成された突起5aと、この突起5aが嵌合す
る補強材208の嵌合部5bの部分的な上面図および補
強材208の断面図を示すものである。
Embodiment 11 Next, Embodiment 11 of the present invention will be described with reference to FIG. FIG.
(A) is a front end for fixing a reinforcing member 208 extending in one direction provided with a groove 1a corresponding to the thickness of the electronic circuit board 100f to a reinforcing member 208 provided at an end of the electronic circuit board 100f. Is a perspective view of an electronic circuit board 100f fitted and fixed to the projection 5a bent in a key shape,
FIG. 10B is a partial top view of a protrusion 5a formed so as to protrude from an end of the electronic circuit board 100f, a fitting portion 5b of the reinforcing member 208 to which the protrusion 5a is fitted, and FIG. FIG.

【0038】このように構成された電子回路基板100
fの端部の突起5aを補強材208の溝部1aにはめ込
み補強材208の嵌合部5bに嵌合させ、補強材208
を電子回路基板100fの外周に沿ってスライドさせて
はめこむことで、電子回路基板100fと補強材208
を固定でき、他の実施の形態の場合と同様に電子回路基
板100fのたわみを小さく抑制することが可能とな
る。
The electronic circuit board 100 thus configured
The projection 5a at the end of the f is fitted into the groove 1a of the reinforcing member 208 to be fitted into the fitting portion 5b of the reinforcing member 208.
Is slid along the outer periphery of the electronic circuit board 100f and fitted therein, so that the electronic circuit board 100f and the reinforcing member 208
Can be fixed, and the bending of the electronic circuit board 100f can be suppressed to be small as in the other embodiments.

【0039】[0039]

【発明の効果】この発明によれば、電子回路基板は補強
材を備えたことにより、たわみを小さく抑制することが
可能であり、面実装される電子部品の破壊を防止するこ
とができる。従って電子回路基板の信頼性向上が可能で
あり、また取り扱いの簡便な電子回路基板を得ることが
できる。
According to the present invention, since the electronic circuit board is provided with the reinforcing material, it is possible to suppress the deflection to a small extent and to prevent the electronic components mounted on the surface from being broken. Therefore, the reliability of the electronic circuit board can be improved, and an electronic circuit board that is easy to handle can be obtained.

【0040】さらに、この発明による電子回路基板は、
その補強材に基板取り付け用の、電子回路基板の厚みに
相当する溝部を形成したため、その溝部に電子回路基板
をはめ込んで接着することで安定して固定することがで
きる。さらに、取り付けに必要な部品を補強材のみであ
るので部品点数を減らすことができる。
Further, the electronic circuit board according to the present invention comprises:
Since a groove corresponding to the thickness of the electronic circuit board for mounting the substrate is formed in the reinforcing member, the electronic circuit board can be stably fixed by fitting the electronic circuit board into the groove and bonding. Furthermore, since the only components required for attachment are the reinforcing members, the number of components can be reduced.

【0041】また、この発明による電子回路基板は、そ
の補強材を絶縁性の部材で構成したため、電子回路基板
と補強材外縁部分との間の耐圧が高くなり、補強材の近
傍に高電圧の配線を配置しても問題なく、電子回路基板
を組み込む装置内部の部品をより密集して配置すること
ができる。
In the electronic circuit board according to the present invention, since the reinforcing member is formed of an insulating member, the withstand voltage between the electronic circuit board and the outer edge of the reinforcing member increases, and a high voltage near the reinforcing member increases. Even if the wiring is arranged, there is no problem, and the components inside the device incorporating the electronic circuit board can be arranged more densely.

【0042】さらに、この発明による電子回路基板は、
電子回路基板の外周を囲むように導電性部材で構成され
た補強材を備え、その補強材を接地しているため、電子
回路基板周囲の電位を地面と同電位にすることができ、
それにより電子回路基板外部からの電磁雑音が基板に与
える影響を減らすことができる。
Further, the electronic circuit board according to the present invention comprises:
A reinforcing member made of a conductive member is provided so as to surround the outer periphery of the electronic circuit board, and since the reinforcing member is grounded, the potential around the electronic circuit board can be set to the same potential as the ground,
Thus, the influence of electromagnetic noise from outside the electronic circuit board on the board can be reduced.

【0043】また、この発明による電子回路基板は、電
子回路基板と補強材に取り付け部材挿入用の穴部を設け
この穴部に挿入する取り付け部材にて電子回路基板と補
強材を固定できるようにしたので、接着のみの場合に比
べて速やかに電子回路基板と補強材とを固定することが
できる。
Further, the electronic circuit board according to the present invention has a hole for inserting a mounting member in the electronic circuit board and the reinforcing member so that the electronic circuit board and the reinforcing member can be fixed by the mounting member inserted into the hole. Therefore, the electronic circuit board and the reinforcing material can be fixed more quickly than in the case of only bonding.

【0044】さらに、この発明による電子回路基板は、
電子回路基板取り付けようの溝を形成された補強材を電
子回路基板に取り付けた後、ネジ止めにて固定するよう
にしたので接着作業が不要となり、作業が容易となると
ともに、作業時間の短縮が可能である。
Further, the electronic circuit board according to the present invention comprises:
After attaching the reinforcing material with the groove for mounting the electronic circuit board to the electronic circuit board, it is fixed with screws, so the bonding work is not required, making the work easier and shortening the work time. It is possible.

【0045】また、この発明による電子回路基板は、導
電性補強材を電子回路基板に固定した後、導電性補強材
と電子回路基板の0電位パターンとを接続することで、
電源の0電位の変動が抑制され、ノイズ対策の強化が可
能となる。
In the electronic circuit board according to the present invention, after the conductive reinforcing material is fixed to the electronic circuit board, the conductive reinforcing material is connected to the zero potential pattern of the electronic circuit board.
Fluctuations in the 0 potential of the power supply are suppressed, and noise countermeasures can be strengthened.

【0046】さらに、この発明による電子回路基板は、
導電性部材で構成された補強材の凸部を電子回路基板に
設けられた穴部に通し、半田付けによって凸部と電子回
路基板との固定を可能としたので、ネジや接着剤などは
不用であり、固定作業の簡単化が図れる。
Further, the electronic circuit board according to the present invention comprises:
The protrusions of the reinforcing material made of conductive material are passed through the holes provided in the electronic circuit board, and the protrusions and the electronic circuit board can be fixed by soldering, so screws and adhesives are unnecessary. Thus, the fixing operation can be simplified.

【0047】また、この発明による電子回路基板は、電
子回路基板取り付け用の溝部が形成された補強材を4本
あらかじめ一続きに接続したものを準備しておき電子回
路基板外周に巻きつけ、取り付けた後で、補強材の両端
を固定するため、固定作業が容易となる。
Further, the electronic circuit board according to the present invention is prepared by connecting a series of four reinforcing members each having a groove for mounting the electronic circuit board in advance and winding them around the outer periphery of the electronic circuit board. After that, since both ends of the reinforcing member are fixed, the fixing operation becomes easy.

【0048】さらに、この発明による電子回路基板は、
枠状の補強材を電子回路基板の上面裏面に配置し、電子
回路基板を挟んだ状態で補強材を取り付け部材にて挟み
込んで固定するようにしたので、補強材2枚で電子回路
基板の外周を覆うように固定でき、接着作業も不要とな
り、作業が容易となる。
Further, the electronic circuit board according to the present invention comprises:
Since the frame-shaped reinforcing member is arranged on the back surface of the upper surface of the electronic circuit board, and the electronic circuit substrate is sandwiched between the reinforcing members, the reinforcing member is sandwiched and fixed by the mounting member. Can be fixed so as to cover, and the bonding work is not required, and the work becomes easy.

【0049】また、この発明による電子回路基板は、電
子回路基板の端部に突起を形成し、補強材側には突起に
嵌合する嵌合形成し、突起を嵌合部に嵌合させて、補強
材を電子回路基板の外周に沿ってスライドさせてはめこ
み固定するようにしたので、接着作業が不要となり、作
業が容易になる。
In the electronic circuit board according to the present invention, a projection is formed at an end of the electronic circuit board, a fitting is formed on the reinforcing material side to fit the projection, and the projection is fitted to the fitting portion. In addition, the reinforcing member is slid along the outer periphery of the electronic circuit board to be fitted and fixed, so that the bonding work is not required and the work becomes easy.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 この発明の実施の形態1による電子回路基板
を示す図である。
FIG. 1 is a diagram showing an electronic circuit board according to Embodiment 1 of the present invention.

【図2】 この発明の実施の形態2による電子回路基板
を示す図である。
FIG. 2 is a view showing an electronic circuit board according to Embodiment 2 of the present invention.

【図3】 この発明の実施の形態3による電子回路基板
を示す図である。
FIG. 3 is a view showing an electronic circuit board according to Embodiment 3 of the present invention.

【図4】 この発明の実施の形態4による電子回路基板
を示す図である。
FIG. 4 is a diagram showing an electronic circuit board according to Embodiment 4 of the present invention.

【図5】 この発明の実施の形態5による電子回路基板
を示す図である。
FIG. 5 is a view showing an electronic circuit board according to Embodiment 5 of the present invention.

【図6】 この発明の実施の形態6による電子回路基板
を示す図である。
FIG. 6 is a view showing an electronic circuit board according to Embodiment 6 of the present invention.

【図7】 この発明の実施の形態7による電子回路基板
を示す図である。
FIG. 7 is a view showing an electronic circuit board according to Embodiment 7 of the present invention.

【図8】 この発明の実施の形態8による電子回路基板
を示す図である。
FIG. 8 is a view showing an electronic circuit board according to Embodiment 8 of the present invention.

【図9】 この発明の実施の形態9による電子回路基板
を示す図である。
FIG. 9 is a view showing an electronic circuit board according to Embodiment 9 of the present invention.

【図10】 この発明の実施の形態10による電子回路
基板を示す図である。
FIG. 10 is a diagram showing an electronic circuit board according to Embodiment 10 of the present invention.

【図11】 この発明の実施の形態11による電子回路
基板を示す図である。
FIG. 11 is a view showing an electronic circuit board according to Embodiment 11 of the present invention.

【図12】 従来の技術による電子回路基板を示す図で
ある。
FIG. 12 is a view showing an electronic circuit board according to a conventional technique.

【符号の説明】[Explanation of symbols]

1a. 溝部 2a、3a. 貫通穴 3b. ネジ加工部
4a. 凸部 4b. 半田 5a. 突起 5b. 嵌合部 100a、100b、100c、100d、100e、
100f. 電子回路基板 101. 電子部品 200、200a、200b、203a、203b、2
06、207、208.補強材 202a、202b、204、205. 導電性補強材 300. 高電圧配線 400、400a. 取り付け部材
500. ネジ 600. 0電位パターン。
1a. Grooves 2a, 3a. Through holes 3b. Threaded parts
4a. Convex part 4b. Solder 5a. Projection 5b. Fitting part 100a, 100b, 100c, 100d, 100e,
100f. Electronic circuit board 101. Electronic component 200, 200a, 200b, 203a, 203b, 2
06, 207, 208. Reinforcing material 202a, 202b, 204, 205. Conductive reinforcing material 300. High voltage wiring 400, 400a. Mounting member 500. Screw 60.0. 0 potential pattern.

Claims (12)

【特許請求の範囲】[Claims] 【請求項1】 電子部品が面実装される電子回路基板に
補強材を固定させたことを特徴とする電子回路基板。
1. An electronic circuit board, wherein a reinforcing material is fixed to an electronic circuit board on which electronic components are surface-mounted.
【請求項2】 補強材は一方向またはそれ以上の方向に
伸びる平面を有する部材であり、電子回路基板の上面か
裏面、もしくはその両面にそれぞれ上記補強材の平面部
を接着固定したことを特徴とする請求項1記載の電子回
路基板。
2. The reinforcing member is a member having a plane extending in one or more directions, and the flat part of the reinforcing member is bonded and fixed to the upper surface, the back surface, or both surfaces of the electronic circuit board. The electronic circuit board according to claim 1, wherein
【請求項3】 補強材は電子回路基板の厚みに相当する
溝部が設けられた一方向またはそれ以上の方向に伸びる
部材であり、上記電子回路基板の端部を上記補強材の溝
部にはめ込み、接着固定したことを特徴とする請求項1
記載の電子回路基板。
3. The reinforcing member is a member that extends in one or more directions provided with a groove corresponding to the thickness of the electronic circuit board, and fits an end of the electronic circuit board into the groove of the reinforcing member. 2. The method according to claim 1, wherein the adhesive is fixed.
An electronic circuit board as described in claim 1.
【請求項4】 補強材は絶縁性部材により構成されるこ
とを特徴とする請求項1記載の電子回路基板。
4. The electronic circuit board according to claim 1, wherein the reinforcing member is formed of an insulating member.
【請求項5】 補強材は電子回路基板の外周を囲む形状
であり、導電性部材により構成され、接地されることを
特徴とする請求項1記載の電子回路基板。
5. The electronic circuit board according to claim 1, wherein the reinforcing member has a shape surrounding the outer periphery of the electronic circuit board, is formed of a conductive member, and is grounded.
【請求項6】 電子回路基板の上面か裏面、もしくはそ
の両面に被着された補強材を貫通する穴部を設け、上記
穴部に取り付け部材を通して上記補強材を上記電子回路
基板に固定することを特徴とする請求項2記載の電子回
路基板。
6. An electronic circuit board having a hole penetrating a reinforcing material attached to the upper surface, the rear surface, or both surfaces thereof, and fixing the reinforcing material to the electronic circuit substrate through a mounting member in the hole. 3. The electronic circuit board according to claim 2, wherein:
【請求項7】 補強材は電子回路基板の厚みに相当する
溝部が設けられた一方向に伸びる部材四本により構成さ
れ、上記電子回路基板の外周四辺を囲むように、上記電
子回路基板の端部を上記補強材の溝部にはめ込み、上記
電子回路基板の四隅において隣接する上記補強材同士を
ネジ止めして固定することを特徴とする請求項1記載の
電子回路基板。
7. The reinforcing member is composed of four members extending in one direction provided with a groove corresponding to the thickness of the electronic circuit board, and is provided at an end of the electronic circuit board so as to surround four sides of the outer periphery of the electronic circuit board. 2. The electronic circuit board according to claim 1, wherein a portion is fitted into a groove of the reinforcing material, and the reinforcing materials adjacent to each other at four corners of the electronic circuit board are fixed by screws.
【請求項8】 補強材は導電性部材であり、電子回路基
板に設けられた0電位パターンと上記補強材とが電気的
に接続されることを特徴とする請求項1記載の電子回路
基板。
8. The electronic circuit board according to claim 1, wherein the reinforcing material is a conductive member, and the zero potential pattern provided on the electronic circuit board is electrically connected to the reinforcing material.
【請求項9】 補強材は一方向またはそれ以上の方向に
伸びる平面を有し、部分的に凸部が形成された導電性部
材であり、電子回路基板を貫通して設けられた穴部に上
記凸部を嵌合させ、上記補強材の平面と上記電子回路基
板の上面を合わせ、上記電子回路基板の裏面側に突き出
した上記凸部を上記電子回路基板に半田付けして上記電
子回路基板に固定することを特徴とする請求項1記載の
電子回路基板。
9. The reinforcing member is a conductive member having a flat surface extending in one or more directions and having a convex portion formed partially, and is provided in a hole provided through the electronic circuit board. The convex portion is fitted, the plane of the reinforcing member and the upper surface of the electronic circuit board are aligned, and the convex portion protruding to the back surface side of the electronic circuit board is soldered to the electronic circuit board to form the electronic circuit board. The electronic circuit board according to claim 1, wherein the electronic circuit board is fixed to the electronic circuit board.
【請求項10】 補強材は電子回路基板の厚みに相当す
る溝部が設けられた一方向に伸びる部材四本により構成
され、上記補強材をあらかじめそれぞれの部材が回動可
能になるように一続きに接続し、上記電子回路基板の外
周四辺を四つの部材からなる上記補強材の溝にそれぞれ
はめ込み、一続きの上記補強材の両端部を固定すること
で上記補強材を上記電子回路基板に固定することを特徴
とする請求項1記載の電子回路基板。
10. The reinforcing member is constituted by four members extending in one direction provided with a groove corresponding to the thickness of the electronic circuit board, and the reinforcing member is stretched in advance so that each member can be rotated in advance. The four sides of the outer periphery of the electronic circuit board are fitted into the grooves of the reinforcing member made of four members, and the reinforcing member is fixed to the electronic circuit board by fixing both ends of the continuous reinforcing member. The electronic circuit board according to claim 1, wherein:
【請求項11】 補強材は電子回路基板の外周を囲む枠
状部材であり、上記電子回路基板の上面裏面にそれぞれ
配置され、重ね合わせられた上記電子回路基板およびそ
の上面裏面に配置された上記枠状部材を挟み込む取り付
け部材によって上記補強材を上記電子回路基板に固定す
ることを特徴とする請求項1記載の電子回路基板。
11. The reinforcing member is a frame-like member surrounding the outer periphery of the electronic circuit board. The reinforcing member is disposed on the upper and lower surfaces of the electronic circuit substrate, respectively. 2. The electronic circuit board according to claim 1, wherein the reinforcing member is fixed to the electronic circuit board by a mounting member that sandwiches a frame-shaped member.
【請求項12】 補強材は電子回路基板の厚みに相当す
る溝部が設けられた一方向に伸びる部材であり、上記電
子回路基板端部に設けられる固定用突起に嵌合する嵌合
部を有し、上記電子回路基板の端部を上記補強材の溝部
にはめ込んだ状態で上記電子回路基板の固定用突起を上
記補強材に嵌合させることで、上記補強材を上記電子回
路基板に固定することを特徴とする請求項1記載の電子
回路基板。
12. The reinforcing member is a member extending in one direction provided with a groove corresponding to the thickness of the electronic circuit board, and has a fitting portion fitted to a fixing projection provided at an end of the electronic circuit board. Then, the reinforcing member is fixed to the electronic circuit board by fitting the fixing protrusion of the electronic circuit board to the reinforcing member while the end of the electronic circuit board is fitted in the groove of the reinforcing member. The electronic circuit board according to claim 1, wherein:
JP2000199657A 2000-06-30 2000-06-30 Electronic circuit board Abandoned JP2002026467A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000199657A JP2002026467A (en) 2000-06-30 2000-06-30 Electronic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000199657A JP2002026467A (en) 2000-06-30 2000-06-30 Electronic circuit board

Publications (2)

Publication Number Publication Date
JP2002026467A true JP2002026467A (en) 2002-01-25
JP2002026467A5 JP2002026467A5 (en) 2004-07-22

Family

ID=18697641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000199657A Abandoned JP2002026467A (en) 2000-06-30 2000-06-30 Electronic circuit board

Country Status (1)

Country Link
JP (1) JP2002026467A (en)

Cited By (4)

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Publication number Priority date Publication date Assignee Title
WO2009060796A1 (en) * 2007-11-06 2009-05-14 Mitsubishi Heavy Industries, Ltd. Electric compressor for vehicle-mounted air conditioner
JP2010511518A (en) * 2006-12-01 2010-04-15 アトラス・コプコ・ツールス・アクチボラグ Electric tool with electronic control unit
JP2015207008A (en) * 2009-05-02 2015-11-19 株式会社半導体エネルギー研究所 display device
CN113327913A (en) * 2021-05-28 2021-08-31 四川省星时代智能卫星科技有限公司 Anti-irradiation packaging structure of satellite chip and manufacturing method thereof

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010511518A (en) * 2006-12-01 2010-04-15 アトラス・コプコ・ツールス・アクチボラグ Electric tool with electronic control unit
WO2009060796A1 (en) * 2007-11-06 2009-05-14 Mitsubishi Heavy Industries, Ltd. Electric compressor for vehicle-mounted air conditioner
JP2009114961A (en) * 2007-11-06 2009-05-28 Mitsubishi Heavy Ind Ltd Electric compressor for on-vehicle air-conditioner
US8435019B2 (en) 2007-11-06 2013-05-07 Mitsubishi Heavy Industries, Ltd. Vehicle-air-conditioner electric compressor
JP2015207008A (en) * 2009-05-02 2015-11-19 株式会社半導体エネルギー研究所 display device
US9397117B2 (en) 2009-05-02 2016-07-19 Semiconductor Energy Laboratory Co., Ltd. Display device
US9980389B2 (en) 2009-05-02 2018-05-22 Semiconductor Energy Laboratory Co., Ltd. Display device
US10580796B2 (en) 2009-05-02 2020-03-03 Semiconductor Energy Laboratory Co., Ltd. Display device
US11215858B2 (en) 2009-05-02 2022-01-04 Semiconductor Energy Laboratory Co., Ltd. Display device
US11598982B2 (en) 2009-05-02 2023-03-07 Semiconductor Energy Laboratory Co., Ltd. Display device
US11809030B2 (en) 2009-05-02 2023-11-07 Semiconductor Energy Laboratory Co., Ltd. Display device
CN113327913A (en) * 2021-05-28 2021-08-31 四川省星时代智能卫星科技有限公司 Anti-irradiation packaging structure of satellite chip and manufacturing method thereof

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Date Code Title Description
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Effective date: 20040811