JP2701563B2 - External lead connection board mounting structure of display element - Google Patents
External lead connection board mounting structure of display elementInfo
- Publication number
- JP2701563B2 JP2701563B2 JP3052020A JP5202091A JP2701563B2 JP 2701563 B2 JP2701563 B2 JP 2701563B2 JP 3052020 A JP3052020 A JP 3052020A JP 5202091 A JP5202091 A JP 5202091A JP 2701563 B2 JP2701563 B2 JP 2701563B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- external lead
- display element
- connection
- lead connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、表示素子の外部リード
接続基板実装構造に関し、特にフレキシブル外部リード
接続基板実装構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for an external lead connection board of a display device, and more particularly to a flexible external lead connection board mounting structure.
【0002】[0002]
【従来の技術】従来の表示装置における外部リード接続
例を図5に示す。ここでは、プラズマディスプレイパネ
ルの後面電極端子とフレキシブル基板の接続を例にとっ
ている。2. Description of the Related Art An example of connection of external leads in a conventional display device is shown in FIG. Here, the connection between the rear electrode terminal of the plasma display panel and the flexible substrate is taken as an example.
【0003】フレキシブル基板16は、1層の信号配線
層4を持ち、プラズマディスプレイパネル11との接続
端子部を残し、その両端はポリイミド等の絶縁層3,5
で覆われている。信号配線層4は、プラズマディスプレ
イパネル11の後面電極9の複数の各端子と1対1で接
続がとれるように形成されている。信号配線層4と後面
電極9の接続は、異方性導電膜、半田づけ、クリップ等
による圧接など様々な方法がとられている。The flexible substrate 16 has one signal wiring layer 4 and leaves a connection terminal portion with the plasma display panel 11, and both ends thereof are insulating layers 3 and 5 made of polyimide or the like.
Covered with. The signal wiring layer 4 is formed so as to be able to make a one-to-one connection with a plurality of terminals of the rear electrode 9 of the plasma display panel 11. The connection between the signal wiring layer 4 and the rear surface electrode 9 is made by various methods such as anisotropic conductive film, soldering, press-fitting with a clip or the like.
【0004】[0004]
【発明が解決しようとする課題】近年、大容量かつ高精
細な表示装置の市場要求が高まることにより、表示素子
の接続端子数が増加すると共に、その端子数に対応する
ために高速なスイッチング素子が駆動回路に使用されつ
つある。In recent years, as the market demand for a large-capacity, high-definition display device has increased, the number of connection terminals of the display element has increased, and a high-speed switching element has been required to cope with the number of terminals. Are being used in drive circuits.
【0005】一方、電子機器の電磁放射ノイズに対する
問題意識も高まり、規制も厳しくなっているため、電子
回路から機械的構造に至るまで様々な対策が必要不可欠
になっている。[0005] On the other hand, awareness of the problem of electromagnetic radiation noise of electronic equipment has increased, and regulations have become stricter. Therefore, various measures have been indispensable from electronic circuits to mechanical structures.
【0006】ところが、前述した従来の表示装置では、
外部リード接続基板から表示領域にいたるまで、放射ノ
イズ対策が考慮されていないため、表示装置の筺体にシ
ールド効果を持たせる等の配慮が必要であった。However, in the above-mentioned conventional display device,
From the external lead connection board to the display area, no measures against radiation noise have been taken into consideration, so that consideration must be given to the display device housing to have a shielding effect.
【0007】[0007]
【課題を解決するための手段】本発明は、表示素子と外
部リード接続基板の接続において、外部リード接続基板
の配線層を2層構造とし、該配線層の第1層を表示素子
の端子との接続配線層、第2層の全面を接地層あるいは
電波吸収フィルム層とし、第2層を表示素子の端子部よ
り延長し、表示領域の近傍まで張り出させたことを特徴
とする。According to the present invention, in connection between a display element and an external lead connection board, a wiring layer of the external lead connection board has a two-layer structure, and a first layer of the wiring layer is connected to terminals of the display element. The entire surface of the connection wiring layer and the second layer is a ground layer or a radio wave absorbing film layer, and the second layer is extended from the terminal portion of the display element and extended to the vicinity of the display area.
【0008】[0008]
【実施例】次に本発明について図面を参照して説明す
る。図1は、本発明の第1の実施例の接続部の断面図、
図2はこの実施例の表示面側から見た図である。表示素
子は、XYマトリスク型プラズマディスプレイであり、
透明前面電極8と後面電極9の交点にあたる間隙が放電
空間、すなわち表示セルである。本実施例では、後面電
極9と接続するフレキシブル基板6が、銅などの金属の
接地パターン層2と信号配線層4の2層を有しており、
接地パターン層2は絶縁層3を介して信号配線層4の上
部全面に亘るベタパターンになっており、さらに、表示
領域の端まで延長し後面電極9を覆っている。このため
信号配線上の高周波成分が接地パターン層に吸収され、
放射ノイズが減少する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of a connecting portion according to a first embodiment of the present invention,
FIG. 2 is a diagram of this embodiment viewed from the display surface side. The display element is an XY matrice type plasma display,
The gap at the intersection of the transparent front electrode 8 and the rear electrode 9 is a discharge space, that is, a display cell. In the present embodiment, the flexible substrate 6 connected to the rear electrode 9 has two layers of the ground pattern layer 2 made of metal such as copper and the signal wiring layer 4.
The ground pattern layer 2 has a solid pattern over the entire upper surface of the signal wiring layer 4 via the insulating layer 3, and further extends to the end of the display area to cover the rear electrode 9. Therefore, the high frequency components on the signal wiring are absorbed by the ground pattern layer,
Radiated noise is reduced.
【0009】図3は本発明の第2の実施例の断面図であ
る。この実施例は、フレキシブル基板6をプラズマディ
スプレイパネル11の透明前面電極8に接続する例であ
り、第1の実施例と異なり前面ガラス板7が後面ガラス
板10より外部へ張り出しているため、信号配線層4と
透明前面電極8との接続方向が第1の実施例と逆になっ
ている。FIG. 3 is a sectional view of a second embodiment of the present invention. This embodiment is an example in which the flexible substrate 6 is connected to the transparent front electrode 8 of the plasma display panel 11. Unlike the first embodiment, the front glass plate 7 extends beyond the rear glass plate 10, so that the signal The connection direction between the wiring layer 4 and the transparent front electrode 8 is opposite to that of the first embodiment.
【0010】図4は、第1の実施例と第2の実施例を組
み合わせて構成した表示装置の例である。後面電極に走
査側駆動回路基板a(14)と走査側駆動回路基板b
(15)を接続し、透明前面電極にデータ側駆動回路基
板a(12)とデータ側駆動回路基板b(13)を接続
しているものであり、後面電極側の接続には第1の実施
例、透明前面電極側の接続には第2の実施例を用いてい
る。FIG. 4 shows an example of a display device constructed by combining the first embodiment and the second embodiment. The scanning-side driving circuit board a (14) and the scanning-side driving circuit board b are provided on the rear electrodes.
(15), and the data-side drive circuit board a (12) and the data-side drive circuit board b (13) are connected to the transparent front electrode. For example, the second embodiment is used for the connection on the transparent front electrode side.
【0011】[0011]
【発明の効果】以上説明したように、本発明は外部リー
ド接続基板に接地パターン層を設け、その接地パターン
層を表示領域の近傍まで伸ばしたので、接地パターン層
が信号配線上の高周波成分を吸収し、放射ノイズレベル
を低減するという効果を有する。As described above, according to the present invention, the ground pattern layer is provided on the external lead connection board and the ground pattern layer is extended to the vicinity of the display area. It has the effect of absorbing and reducing radiated noise levels.
【0012】また、以上述べた実施例の外部リード接続
基板において、接地パターン層をアモルファス磁性体や
フェライトなどを用いた電波吸収フィルム層に置き換え
ても同様の効果が得られる。Further, in the external lead connection board of the embodiment described above, the same effect can be obtained by replacing the ground pattern layer with a radio wave absorbing film layer using an amorphous magnetic material or ferrite.
【図1】本発明の第1の実施例の接続部の断面図であ
る。FIG. 1 is a sectional view of a connecting portion according to a first embodiment of the present invention.
【図2】図1に示した第1の実施例の表示面側から見た
図である。FIG. 2 is a view of the first embodiment shown in FIG. 1 as viewed from the display surface side.
【図3】本発明の第2の実施例の接続部の断面図であ
る。FIG. 3 is a sectional view of a connection portion according to a second embodiment of the present invention.
【図4】第1の実施例と第2の実施例を組み合わせて構
成した表示装置を示す斜視図である。FIG. 4 is a perspective view showing a display device configured by combining the first embodiment and the second embodiment.
【図5】従来の表示装置における接続部の断面図であ
る。FIG. 5 is a cross-sectional view of a connection portion in a conventional display device.
1,3,5 絶縁層 2 接地パターン層 4 信号配線層 6 フレキシブル基板 7 前面ガラス板 8 透明前面電極 9 後面電極 10 後面ガラス板 11 プラズマディスプレイパネル 12 データ側駆動回路基板a 13 データ側駆動回路基板b 14 走査側駆動回路基板a 15 走査側駆動回路基板b 16 表示領域 1, 3, 5 Insulating layer 2 Ground pattern layer 4 Signal wiring layer 6 Flexible substrate 7 Front glass plate 8 Transparent front electrode 9 Rear electrode 10 Rear glass plate 11 Plasma display panel 12 Data side drive circuit board a 13 Data side drive circuit board b 14 scanning-side driving circuit board a 15 scanning-side driving circuit board b 16 display area
Claims (1)
基板の接続において、フレキシブル外部リード接続基板
の配線層を2層構造とし、該配線層の第1層を表示素子
の端子との接続配線層、第2層の全面を接地層あるいは
電波吸収フィルム層とし、第2層を表示素子の端子部よ
り延長し、表示領域の近傍まで張り出させたことを特徴
とする表示素子の外部リード接続基板実装構造。1. A connection between a display element and a flexible external lead
In the connection of the substrate , the wiring layer of the flexible external lead connection substrate has a two-layer structure, the first layer of the wiring layer is a connection wiring layer to the terminal of the display element, and the entire surface of the second layer is a ground layer or An external lead connection board mounting structure for a display element, wherein the second layer is extended from a terminal portion of the display element and protrudes to the vicinity of a display area.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3052020A JP2701563B2 (en) | 1991-03-18 | 1991-03-18 | External lead connection board mounting structure of display element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3052020A JP2701563B2 (en) | 1991-03-18 | 1991-03-18 | External lead connection board mounting structure of display element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04287397A JPH04287397A (en) | 1992-10-12 |
JP2701563B2 true JP2701563B2 (en) | 1998-01-21 |
Family
ID=12903133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3052020A Expired - Fee Related JP2701563B2 (en) | 1991-03-18 | 1991-03-18 | External lead connection board mounting structure of display element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2701563B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100706738B1 (en) * | 2000-09-08 | 2007-04-11 | 삼성전자주식회사 | Display unit for a flat panel display apparatus |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3289684B2 (en) * | 1998-09-11 | 2002-06-10 | 日本電気株式会社 | Plasma display panel, plasma display module and driving method thereof |
JP2007140107A (en) * | 2005-11-18 | 2007-06-07 | Epson Imaging Devices Corp | Electrooptical device, packaging structure, method for manufacturing electrooptical device, and electronic apparatus |
JP5196290B2 (en) * | 2007-01-25 | 2013-05-15 | 日本精機株式会社 | Display device |
WO2011158561A1 (en) * | 2010-06-14 | 2011-12-22 | シャープ株式会社 | Electromagnetic wave-absorbing sheet, display device, and television receiver |
JP5973761B2 (en) | 2012-03-27 | 2016-08-23 | オリンパス株式会社 | Cable connection structure |
JP6513134B2 (en) * | 2017-05-26 | 2019-05-15 | レノボ・シンガポール・プライベート・リミテッド | Cable connection structure and cable connection method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6468998A (en) * | 1987-09-09 | 1989-03-15 | Matsushita Electric Ind Co Ltd | Signal connection device |
JPS6484220A (en) * | 1987-09-28 | 1989-03-29 | Matsushita Electric Ind Co Ltd | Liquid crystal display module |
JPH01281423A (en) * | 1988-05-09 | 1989-11-13 | Seiko Epson Corp | Panel mounting board |
JPH02111180U (en) * | 1989-02-22 | 1990-09-05 |
-
1991
- 1991-03-18 JP JP3052020A patent/JP2701563B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100706738B1 (en) * | 2000-09-08 | 2007-04-11 | 삼성전자주식회사 | Display unit for a flat panel display apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH04287397A (en) | 1992-10-12 |
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