JP2002018760A - Electrostatic attracting plate for carrying electronic material - Google Patents

Electrostatic attracting plate for carrying electronic material

Info

Publication number
JP2002018760A
JP2002018760A JP2000210620A JP2000210620A JP2002018760A JP 2002018760 A JP2002018760 A JP 2002018760A JP 2000210620 A JP2000210620 A JP 2000210620A JP 2000210620 A JP2000210620 A JP 2000210620A JP 2002018760 A JP2002018760 A JP 2002018760A
Authority
JP
Japan
Prior art keywords
electronic material
suction
plate
electrostatic
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000210620A
Other languages
Japanese (ja)
Inventor
Yuji Takagami
裕二 高上
Kenji Hyodo
建二 兵頭
Toyoichi Komuro
豊一 小室
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Paper Mills Ltd
Original Assignee
Mitsubishi Paper Mills Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Paper Mills Ltd filed Critical Mitsubishi Paper Mills Ltd
Priority to JP2000210620A priority Critical patent/JP2002018760A/en
Publication of JP2002018760A publication Critical patent/JP2002018760A/en
Pending legal-status Critical Current

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  • Manipulator (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electrostatic attracting plate, capable of easily detecting whether a flat plate electronic material, when electrostatically attracted and carried, is surely attracted or not and surely separating the material, if desired. SOLUTION: The electrostatic attracting plate to be used for attraction carrying means for, at least, the flat plate electronic material has a grooved or holed cavity in an effective attraction range, where at least an electrode is arranged, excluding a portion closely adhered to an attracted material.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電気・電子機器に
用いられる平板状の電子材料、特にプリント配線板やシ
ャドウマスク等の小径孔を多数有する材料を、吸着して
搬送するための吸着搬送手段に用いられる静電吸着板に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction and transfer method for transferring a flat electronic material used in electric and electronic equipment, particularly a material having a large number of small-diameter holes such as a printed wiring board and a shadow mask. The present invention relates to an electrostatic attraction plate used for the means.

【0002】[0002]

【従来の技術】平板状の電子材料、例えばプリント配線
板やシャドウマスクのような薄板状でも多数の穴が空い
た材料の枚葉毎の搬送においては、穴の空いていない部
分を小径の吸着パッドを介して減圧吸着して搬送した
り、高流量のブロアを用いて多数吸着口を有する吸着面
で吸着して搬送する手段がとられていた。
2. Description of the Related Art In the transport of a flat electronic material, for example, a material having many holes even in a thin plate such as a printed wiring board or a shadow mask, a portion having no holes is adsorbed with a small diameter. Means have been adopted in which suction is performed under reduced pressure via a pad for conveyance, or suction and conveyance is performed using a suction surface having a large number of suction ports by using a high flow rate blower.

【0003】上記のような搬送手段では、搬送する電子
材料のロット替わりに際して、吸着パッド位置を調整が
必要であったり、また減圧するための高流量用の配管を
引き回す必要があるため設計上の制約が生じたり機械が
大型化するなど不都合を生じていた。
[0003] In the above-described conveying means, when changing the lot of the electronic material to be conveyed, it is necessary to adjust the position of the suction pad or to route a high-flow pipe for reducing the pressure. Inconveniences, such as restriction and enlargement of the machine, occurred.

【0004】そこで、吸着手段として、静電吸着方式に
よる薄板状の電子材料の搬送方法の提案もなされてい
る。しかしながら、減圧吸着方式では減圧度(真空度)
を減圧センサーにより容易に検知出来るのに対して、静
電吸着方式では、電子材料が吸着したかどうかの判断が
容易には出来ない欠点があった。
Therefore, a method of transporting a thin plate of electronic material by an electrostatic attraction method has been proposed as an attraction means. However, in the vacuum adsorption system, the degree of vacuum (vacuum)
In contrast, the electrostatic adsorption method has a drawback that it is not easy to judge whether or not the electronic material has been adsorbed.

【0005】また、静電吸着方式では、吸着する材質や
印加する電圧や雰囲気温度・湿度等の環境条件等によっ
て、電子材料の離脱が印加電圧を遮断しても直ぐに成し
得ない場合があり、搬送制御の上で問題となっていた。
Further, in the electrostatic attraction method, there is a case where the detachment of the electronic material cannot be immediately performed even when the applied voltage is cut off, depending on a material to be adsorbed, an applied voltage, environmental conditions such as ambient temperature and humidity, and the like. However, there has been a problem in carrying control.

【0006】[0006]

【発明が解決しようとする課題】本発明の課題は、上記
問題点に鑑み、平板状の電子材料の静電吸着搬送におい
て、確実に吸着しているかの検知が容易に可能で、かつ
離脱させたい時に確実に離脱が成し得る静電吸着板を提
供することにある。
SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to make it possible to easily detect whether or not a flat electronic material is securely adsorbed and to remove the electronic material. An object of the present invention is to provide an electrostatic attraction plate that can be reliably detached when desired.

【0007】[0007]

【課題を解決するための手段】本発明者らは、上記課題
を解決するために鋭意検討した結果、以下の発明を見出
した。
Means for Solving the Problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, have found the following invention.

【0008】第一の発明は、少なくとも平板状の電子材
料の吸着搬送手段に用いる静電吸着板であって、少なく
とも電極が配置された有効吸着範囲内に被吸着物と密着
する部分以外の溝状もしくは穴形状の空隙を有すること
を特徴としている。
A first aspect of the present invention is an electrostatic attraction plate used for at least a plate-like electronic material for attracting and conveying an electronic material. It is characterized by having a void in the shape of a hole or a hole.

【0009】第二の発明は、前記空隙に電子材料の吸着
有無を確認するための検知手段を有することを特徴とし
ている。
A second aspect of the present invention is characterized in that a detecting means for confirming whether or not the electronic material is adsorbed in the gap is provided.

【0010】第三の発明は、前記空隙に吸着した電子材
料の離脱を促進させるための手段を有することを特徴と
している。
A third aspect of the present invention is characterized in that there is provided a means for accelerating the detachment of the electronic material adsorbed in the void.

【0011】本発明の静電吸着板では、平板状の電子材
料、特にスルーホール等の小径孔を多数を有するプリン
ト配線板やシャドウマスクであっても、減圧吸着の様に
小径孔を通じての漏洩するため、吸着に必要な減圧度が
なかなか達成出来ない欠点や一枚下の電子材料まで吸着
する欠点が解消され、容易に1枚毎の吸着及びその搬送
を行なわれる。また、電子材料を静電吸着がなされたか
どうか、設けられた溝状あるいは穴状の空隙に検知する
センサを設置することが容易に可能となり、さらに吸着
用の電圧印加を切断しても残存する静電気力により吸着
力が残存する場合においても溝状あるいは穴状の空隙か
らあることで離脱がしやすくなるし、また空隙を介し
て、例えば空気を流入させたり、アクチュエーターを装
着して吸着した電子材料の離脱を促進させる手段を設け
ることによりさらに脱離を確実に行える。
In the electrostatic chuck plate of the present invention, even if the flat plate-shaped electronic material, particularly a printed wiring board or a shadow mask having a large number of small holes such as through holes, leaks through the small holes as in vacuum suction. Therefore, the drawback that the degree of decompression required for suction cannot be easily achieved and the drawback of sucking electronic materials one sheet down are eliminated, and the suction and transfer of each sheet can be easily performed. Further, it is possible to easily install a sensor for detecting whether or not the electronic material has been electrostatically attracted, in the provided groove-like or hole-like space, and furthermore, it remains even after the application of the attracting voltage is cut off. Even if the adsorbing force remains due to electrostatic force, it is easy to separate from the groove-shaped or hole-shaped gap, and it is also possible to allow air to flow in through the gap or to attach the actuator and attach it to the electron. By providing a means for promoting the detachment of the material, the detachment can be performed more reliably.

【0012】[0012]

【発明の実施の形態】本発明の一形態について図面を用
いて説明する。図1は本発明の静電吸着板の一例を示す
縦断面概略図である。吸着面シート1、絶縁層3、櫛歯
状電極2a、2b、近接センサ4、圧縮エア吐出口5か
ら構成され、櫛歯状電極2a、2bにはそれぞれ直流高
圧電源が接続されており、また近接センサ4および圧縮
エア吐出口5からそれそれ配線及び配管がなされてい
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic longitudinal sectional view showing an example of the electrostatic suction plate of the present invention. The suction surface sheet 1, the insulating layer 3, the comb-shaped electrodes 2 a and 2 b, the proximity sensor 4, and the compressed air discharge port 5 are connected to the comb-shaped electrodes 2 a and 2 b, respectively. Wiring and piping are respectively provided from the proximity sensor 4 and the compressed air discharge port 5.

【0013】図3は櫛歯状電極のパターンの一例を示す
概略図である。櫛歯状電極2a、2bは、それぞれ櫛歯
状に形成されてお互いに櫛歯が入れ込む形となってい
る。また設けられる空隙の近傍では空隙を避けて配置さ
れており、図中配線パターンが途切れた状態になってい
るが、図示しない配線で導通されている。
FIG. 3 is a schematic diagram showing an example of the pattern of the comb-like electrode. Each of the comb-shaped electrodes 2a and 2b is formed in a comb-tooth shape so that the comb-tooth is inserted into each other. In the vicinity of the provided gap, the wiring pattern is arranged so as to avoid the gap. In the drawing, the wiring pattern is broken, but it is electrically connected by wiring (not shown).

【0014】図2は本発明の静電吸着板の上面概略図で
ある。吸着面シート1の中央部に空隙があり絶縁層3が
露出している。絶縁層3に近接センサ4及び圧縮エア吐
出口5が取付られている。
FIG. 2 is a schematic top view of the electrostatic suction plate of the present invention. There is a gap at the center of the suction surface sheet 1 and the insulating layer 3 is exposed. The proximity sensor 4 and the compressed air discharge port 5 are attached to the insulating layer 3.

【0015】本発明の静電吸着板の作用について説明す
る。まず、吸着する電子材料に静電吸着板の吸着面シー
ト1を押しつけるなどして密着させる。櫛歯状電極2
a、2bに1〜6KVの電圧を印加すると吸着面シート
1に電荷が生じて吸着を開始する。吸着が開始されると
空隙内に配置された近接センサ4が、電子材料とともに
静電吸着板が移動している間、電子材料の存在を常に監
視を行う。次に目的場所にて電圧の印加を解除する。解
除した時点で圧縮エア吐出口5から圧縮空気を吹き出す
と共に、電子材料の静置位置から静電吸着板を少し移動
させて隙間をあけ、近接センサが電子材料の吸着有無を
確認する。
The operation of the electrostatic attraction plate of the present invention will be described. First, the adsorption surface sheet 1 of the electrostatic adsorption plate is brought into close contact with the electronic material to be adsorbed by pressing or the like. Comb-shaped electrode 2
When a voltage of 1 to 6 KV is applied to a and 2b, a charge is generated in the suction surface sheet 1 and suction is started. When the suction is started, the proximity sensor 4 arranged in the gap constantly monitors the presence of the electronic material while the electrostatic suction plate moves together with the electronic material. Next, the application of the voltage is released at the destination. At the time of release, the compressed air is blown out from the compressed air discharge port 5, and the electrostatic attraction plate is slightly moved from the stationary position of the electronic material to make a gap, and the proximity sensor confirms whether or not the electronic material is absorbed.

【0016】本発明の静電吸着板の吸着面シートとして
は、特公昭57−58872号公報、特開昭59−10
8915号公報に記載されている物が有効に利用でき
る。また吸着面シートの大きさは、吸着する電子材料の
面積以上をカバー出来ることが好ましく、設けられる空
隙は吸着平面の面積として、全体の50%以下とするこ
とが好ましい。また空隙の形状は問わず、連続していて
も、独立に複数存在していても良い。
The suction surface sheet of the electrostatic suction plate of the present invention is disclosed in JP-B-57-58872 and JP-A-59-10.
What is described in 8915 gazette can be used effectively. Further, the size of the suction surface sheet is preferably capable of covering at least the area of the electronic material to be adsorbed, and the space provided is preferably 50% or less of the total area of the adsorption plane. In addition, the shape of the void is not limited, and may be continuous or may be plural independently.

【0017】本発明の静電吸着板に使用される吸着を有
無を確認する検知手段としては、光を用いた反射型光電
センサ、磁界を利用した高周波発振形、差動コイル形、
磁気形等の近接センサや電界を利用した静電容量形の近
接センサ、接触を検知するマイクロスイッチや変位セン
サ、超音波センサ、CCDを利用した視覚認識センサ、
またレーザ光を使った厚みセンサ等が使用できる。
The detecting means used in the electrostatic attraction plate of the present invention for confirming the presence or absence of attraction is a reflection type photoelectric sensor using light, a high frequency oscillation type using a magnetic field, a differential coil type, or the like.
Proximity sensor such as magnetic type, capacitance type proximity sensor using electric field, micro switch and displacement sensor for detecting contact, ultrasonic sensor, visual recognition sensor using CCD,
Further, a thickness sensor using laser light or the like can be used.

【0018】本発明の静電吸着板に使用される吸着した
電子材料の脱離を促進するための手段としては、空気も
しくは圧縮空気の吹き込み方式、エアあるいは電動式の
アクチュエーターによる押し出し方式等が挙げられる。
Means for promoting the desorption of the adsorbed electronic material used in the electrostatic adsorption plate of the present invention include a method of blowing air or compressed air, and a method of extruding air or an electric actuator. Can be

【0019】本発明の静電吸着板の櫛歯状電極に供給す
る電圧としては、吸着搬送する電子材料の大きさ、厚
み、重量にもよるが、500V〜6KVの範囲で用いる
ことが出来る。搬送する電子材料が小さく、また軽い場
合には印加する電圧が高すぎる場合には複数枚吸着する
恐れがあり、事前に適正な電圧を簡単な実験により求め
ることが望ましい。
The voltage supplied to the comb-shaped electrodes of the electrostatic chuck plate of the present invention can be used in the range of 500 V to 6 KV, though it depends on the size, thickness and weight of the electronic material to be sucked and conveyed. If the electronic material to be conveyed is small and light, the applied voltage may be too high, and if the applied voltage is too high, a plurality of sheets may be adsorbed.

【0020】また、高電圧を印加する電圧供給装置とし
ては、数Vの電圧を数KVに昇圧出来るDC−DCコン
バーターを用いることが出来る。出力電圧を連続的に可
変出来るもの、一定の電圧を出力するものなど用いるこ
とが出来る。
As a voltage supply device for applying a high voltage, a DC-DC converter capable of increasing a voltage of several volts to several kV can be used. A device that can continuously vary the output voltage, a device that outputs a constant voltage, and the like can be used.

【0021】[0021]

【実施例】以下本発明を実施例により詳説するが、本発
明はその趣旨を逸脱しない限り、下記実施例に限定され
るものではない。
EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited to the following examples unless departing from the gist of the invention.

【0022】実施例 図1〜図4を用いて説明する。電子材料として、両面銅
張り積層板(500×600mm)を使用し、常法に従
って、穴径0.8mm及び0.5mmのスルーホールを有す
る配線パターン形成し、プリント配線板1を作製した。
An embodiment will be described with reference to FIGS. A printed circuit board 1 was prepared by using a double-sided copper-clad laminate (500 × 600 mm) as an electronic material and forming a wiring pattern having through-holes with a hole diameter of 0.8 mm and 0.5 mm according to a conventional method.

【0023】プリント配線板100を50枚、パレット
102上に積載し、吸着搬送手段103を用いて次工程
であるソルダレジスト塗布装置106に導入するための
ベルトコンベア105に、プリント配線板100を1枚
毎に吸着搬送を行った。
Fifty printed wiring boards 100 are stacked on a pallet 102, and one printed wiring board 100 is placed on a belt conveyor 105 to be introduced into a solder resist coating device 106, which is the next step, by using a suction conveyance means 103. Suction conveyance was performed for each sheet.

【0024】吸着搬送手段103は、静電吸着板101
と上下動させるための機構(ここではエアシリンダーを
用いた)、横方向への移動手段としてエア駆動を有する
ガイドレール104から構成されている。
The suction and conveyance means 103 includes an electrostatic suction plate 101.
And a mechanism for moving up and down (here, an air cylinder is used), and a guide rail 104 having pneumatic drive as a lateral moving means.

【0025】静電吸着板101は、吸着面シート1、絶
縁層3、櫛歯状電極2a、2b、近接センサ4、圧縮エ
ア吐出口5から構成され、櫛歯状電極2a、2bにはそ
れぞれ図示しない直流高圧電源が接続されており、また
近接センサ4および圧縮エア吐出口5からそれそれ図示
しない制御部に配線及び空気源に配管がなされている。
The electrostatic attraction plate 101 comprises an attraction surface sheet 1, an insulating layer 3, comb-like electrodes 2a and 2b, a proximity sensor 4, and a compressed air discharge port 5, and the comb-like electrodes 2a and 2b respectively have A DC high-voltage power supply (not shown) is connected, and wiring is provided from the proximity sensor 4 and the compressed air discharge port 5 to a control unit (not shown) and a pipe to an air source.

【0026】櫛歯状電極のパターンは図3に示したよう
に、櫛歯状電極2a、2bは、それぞれ櫛歯状に形成さ
れてお互いに櫛歯が入れ込む形となっている。また設け
られる空隙の近傍では空隙を避けて配置されており、図
中配線パターンが途切れた状態になっているが、図示し
ない配線で導通されている。
As shown in FIG. 3, the pattern of the comb-like electrodes 2a and 2b is formed in a comb-like shape and the comb-like electrodes are inserted into each other. In the vicinity of the provided gap, the wiring pattern is arranged so as to avoid the gap. In the drawing, the wiring pattern is broken, but it is electrically connected by wiring (not shown).

【0027】吸着搬送手段103の動作について説明す
る。吸着搬送手段103は、最上枚のプリント配線板1
00に接する位置まで下降し、静電吸着板101の櫛歯
状平面電極2a、2bに電圧を印加してプリント配線板
100を1枚吸着する。次に吸着搬送手段103が上昇
し始めると、近接センサ4がプリント配線板100の吸
着有無を監視するようになっている。吸着が確認出来な
かった場合には、再度吸着搬送手段103が下降して吸
着動作を繰り返すようになっている。
The operation of the suction conveyance means 103 will be described. The suction conveyance means 103 is provided with the uppermost printed wiring board 1.
Then, a voltage is applied to the comb-shaped flat electrodes 2a and 2b of the electrostatic chucking plate 101 to suck one printed wiring board 100. Next, when the suction conveyance means 103 starts to move up, the proximity sensor 4 monitors whether or not the printed wiring board 100 is suctioned. If suction cannot be confirmed, the suction transporting means 103 descends again and repeats the suction operation.

【0028】吸着搬送手段103が上昇完了後、横移動
し、ベルトコンベア105の定位置上に達すれば、下降
し、静電吸着板101への電圧供給を停止して、圧縮エ
ア吐出口5から空気を吹き出し、ベルトコンベア105
にプリント配線板100を静置するようになっている。
After the suction and conveyance means 103 completes ascending, it moves laterally, and when it reaches a fixed position on the belt conveyor 105, it descends, stops supplying voltage to the electrostatic suction plate 101, and outputs the compressed air from the compressed air discharge port 5. Air is blown out and the belt conveyor 105
The printed wiring board 100 is set to rest.

【0029】上述の吸着搬送手段103を使用して、連
続して5パレット分のプリント配線板を吸着搬送した
が、吸脱着ミス及び複数枚吸着は見られなかった。
Using the above-mentioned suction and conveyance means 103, the printed wiring boards for five pallets were continuously suctioned and conveyed, but no adsorption / desorption error and suction of a plurality of sheets were found.

【0030】[0030]

【発明の効果】以上説明したごとく、本発明の静電吸着
板によれば、平板状の電子材料、特に小径孔を多数有す
るプリント配線板やシャドウマスクを静電吸着しながら
搬送を行う場合に、減圧吸着の様にスルーホールを通じ
ての減圧破壊や一枚下のプリント配線板まで吸着するこ
とがなく、容易に1枚毎の吸着搬送を行うことができ、
また脱離もミス無く確実に行える。また、電子材料を静
電吸着がなされたかどうか、設けられた溝状あるいは穴
状の空隙に検知するセンサを設置することが容易に可能
となる。
As described above, according to the electrostatic chucking plate of the present invention, when a flat electronic material, particularly a printed wiring board or a shadow mask having a large number of small-diameter holes, is transported while being electrostatically sucked. As in the case of vacuum suction, vacuum suction through through holes and adsorption to the printed wiring board one sheet below can be easily performed, and suction conveyance of each sheet can be easily performed.
In addition, desorption can be performed without error. Further, it is possible to easily install a sensor for detecting whether or not the electronic material has been electrostatically attracted, in the provided groove-shaped or hole-shaped gap.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の静電吸着板の一例を示す縦断面概略図
である。
FIG. 1 is a schematic longitudinal sectional view showing an example of an electrostatic suction plate of the present invention.

【図2】本発明の静電吸着板の一例を示す上面概略図で
ある。
FIG. 2 is a schematic top view showing an example of the electrostatic suction plate of the present invention.

【図3】本発明の静電吸着板の櫛歯状電極パターンの一
例を示す概略図である。
FIG. 3 is a schematic diagram showing an example of a comb-like electrode pattern of the electrostatic chuck plate of the present invention.

【図4】本発明の静電吸着板の実施例を示す概略図であ
る。
FIG. 4 is a schematic view showing an embodiment of the electrostatic suction plate of the present invention.

【符号の説明】[Explanation of symbols]

1 吸着面シート 2a、2b 櫛歯状電極 3 絶縁層 4 近接センサ 5 圧縮エア吐出口 100 プリント配線板 101 静電吸着板 102 パレット 103 静電吸着手段 104 移動手段 105 ベルトコンベア 106 ソルダレジスト塗布装置 DESCRIPTION OF SYMBOLS 1 Adsorption surface sheet 2a, 2b Comb-shaped electrode 3 Insulation layer 4 Proximity sensor 5 Compressed air discharge port 100 Printed wiring board 101 Electrostatic adsorption plate 102 Pallet 103 Electrostatic adsorption means 104 Moving means 105 Belt conveyor 106 Solder resist coating device

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3F061 AA01 CA00 DB04 DB06 DC03 DD03 3F101 LA16 LB10  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3F061 AA01 CA00 DB04 DB06 DC03 DD03 3F101 LA16 LB10

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも平板状の電子材料の吸着搬送
手段に用いる静電吸着板であって、少なくとも電極が配
置された有効吸着範囲内に被吸着物と密着する部分以外
の溝状もしくは穴形状の空隙を有することを特徴とする
電子材料搬送用静電吸着板。
1. An electrostatic attraction plate used for at least a plate-like electronic material attraction and conveyance means, wherein a groove or a hole shape other than a portion which is in close contact with an object to be attracted in at least an effective attraction area in which electrodes are arranged. An electrostatic attraction plate for transporting electronic materials, characterized by having a void.
【請求項2】 前記空隙に電子材料の吸着有無を確認す
るための検知手段を有することを特徴とする請求項1記
載の電子材料搬送用静電吸着板。
2. The electrostatic attraction plate for transporting electronic materials according to claim 1, further comprising detection means for confirming whether or not electronic materials are adsorbed in said gaps.
【請求項3】 前記空隙に吸着した電子材料の離脱を促
進させるための手段を有することを特徴とする請求項1
または2いずれか記載の電子材料搬送用静電吸着板。
3. A device according to claim 1, further comprising means for accelerating the detachment of the electronic material adsorbed in said gap.
Or the electrostatic attraction plate for transporting electronic materials according to any of 2.
JP2000210620A 2000-07-12 2000-07-12 Electrostatic attracting plate for carrying electronic material Pending JP2002018760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000210620A JP2002018760A (en) 2000-07-12 2000-07-12 Electrostatic attracting plate for carrying electronic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000210620A JP2002018760A (en) 2000-07-12 2000-07-12 Electrostatic attracting plate for carrying electronic material

Publications (1)

Publication Number Publication Date
JP2002018760A true JP2002018760A (en) 2002-01-22

Family

ID=18706859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000210620A Pending JP2002018760A (en) 2000-07-12 2000-07-12 Electrostatic attracting plate for carrying electronic material

Country Status (1)

Country Link
JP (1) JP2002018760A (en)

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