JP2002050674A - Delivery method in transfer of electronic material using electrostatic suction plate and dismounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an arbitrary, reliable sucking/dismounting method and a transfer method in electrostatic suction transfer of an electronic material in the form of a flat plate. SOLUTION: The method for delivery transfer at least a flat-plate like electronic material via a plurality of electrostatic suction means includes the steps of contacting and energizing the suction surface side of a second electrostatic suction transfer means with a suction surface of a first electrostatic suction transfer means having the electronic material sucked thereon, and applying a voltage which is higher than the voltage applied to the first transfer means to the second transfer means for detaching the first and second transfer means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction device for suctioning and transporting flat electronic materials used in electric and electronic equipment, particularly electronic materials having a large number of small-diameter holes, such as printed wiring boards and shadow masks. The present invention relates to a delivery method and a desorption method using a plurality of electrostatic suction means used for a transfer means.

[0002]

2. Description of the Related Art In the transport of a flat electronic material, for example, a material having many holes even in a thin plate such as a printed wiring board or a shadow mask, a portion having no holes is adsorbed with a small diameter. Means have been adopted in which suction is performed under reduced pressure via a pad for conveyance, or suction and conveyance is performed using a suction surface having a large number of suction ports by using a high flow rate blower.

[0003] In the above-described conveying means, when changing the lot of the electronic material to be conveyed, it is necessary to adjust the position of the suction pad or to route a high-flow pipe for reducing the pressure. Inconveniences, such as restriction and enlargement of the machine, occurred.

Therefore, a method of transporting a thin plate of electronic material by an electrostatic attraction method has been proposed as an attraction means. Compared to the vacuum suction method, the electrostatic suction method can efficiently adsorb a printed wiring board or a shadow mask having a large number of small-diameter holes, and eliminates the need for routing large-volume pipes. The degree also improves. However, even when the applied voltage is cut off when the adsorbed electronic material is desorbed, charges may remain on the adsorbing surface due to factors such as ambient temperature and humidity, and the adsorbed material such as the electronic material may not be desorbed arbitrarily. there were. Also, when performing delivery with the suction surfaces facing each other via a plurality of electrostatic suction conveyance means, the residual potential may be higher than the applied voltage on the receiver side even if the power supply on the sending side is turned off, There were cases where it could not be delivered successfully.

[0005]

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a desorption method and a delivery method for arbitrarily and surely adsorbing and desorbing a plate-shaped electronic material in electrostatic adsorption conveyance. To provide.

[0006]

Means for Solving the Problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, have found the following invention.

According to the present invention, in a method of transporting at least a flat plate-shaped electronic material while delivering it via a plurality of electrostatic attraction / conveying means, the suction surface of the first electrostatic attraction / transporting means which has absorbed the electronic material is The contact surface of the second electrostatic attraction and conveying means is urged in contact with the second electrostatic attraction and conveying means, and the voltage applied to the second electrostatic attraction and conveying means is made higher than the voltage applied to the first electrostatic attraction means. The first and second electrostatic attraction means are separated from each other.

According to a second aspect of the present invention, when detaching the lithographic electronic material adsorbed on the electrostatic attraction plate, the applied voltage supply circuit for supplying a high voltage to the electrostatic attraction plate is not instantaneously shut off. To
The output voltage of the applied voltage supply circuit is reduced.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the delivery method of the present invention, when a delivery is performed with a plurality of electrostatic suction means with suction surfaces facing each other, the applied voltage is lowered without cutting off the power supply on the sending side. Alternatively, by increasing the applied voltage on the receiving side, the electrostatic charge on the suction surface can be controlled, so that the suction transfer can be performed satisfactorily. Also, in the desorption method, when a flat electronic material, particularly a printed wiring board or a shadow mask is desorbed after being electrostatically adsorbed, an applied voltage at which the adsorbed substance is desorbed is measured in advance, and the desorption is desired. By falling to the voltage at the timing, desorption can be performed.

The electrostatic attraction plate used in the present invention is disclosed, for example, in JP-B-57-58872 and JP-A-59-1089.
As described in Japanese Patent Publication No. 15, a comb-shaped electrode is formed between a plastic sheet having an electric resistivity of about 10 ⁸ to 10 ¹² Ωcm as an adsorption surface sheet and an insulator having an electric resistivity of 10 ¹⁵ Ωcm or more. Is provided.

A high-voltage power supply is connected to the comb-like electrodes of the above-mentioned electrostatic attraction plate, and a high voltage of 100 V to 10 KV is applied between the electrodes, so that an electrostatic attraction force (Coulomb force) is developed. ing. Usually, a self-excited oscillation type DC-DC converter is used for the high-voltage power supply, and the high voltage can be obtained with an input of about several volts. The output voltage is preferably variable, but a plurality of output voltages having a fixed output voltage can be used by switching.

It is preferable that the voltage lowered at the time of desorption is continuously reduced so as to be 50% or less, preferably 20% or less of the voltage at the time of adsorption. When the voltage is gradually lowered, the voltage may be finally turned off at 0 V or the power supply may be cut off.

[0013]

EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited to the following examples unless departing from the gist of the invention.

Example As an electronic material, a double-sided copper-clad laminate (500 × 600 m
Using m), a wiring pattern was formed according to a conventional method to produce a printed wiring board.

As an electrostatic attraction plate, a single-sided copper-clad printed wiring board (copper thickness 1) of a glass epoxy base material (0.1 mm thick) is used.
8 μm) to form a comb-shaped electrode by etching copper into a comb-shaped electrode, and a polyvinyl chloride resin plate (plate thickness 2)
mm) was used. The comb-shaped electrode has a variable output high voltage output power supply (610B manufactured by Trek).
Connected.

When the printed wiring board was brought into contact with the electrostatic attraction plate and a voltage of 3 KV was applied to the electrostatic attraction plate, the printed circuit board was attracted. When the switch of the high-voltage output power supply was turned off with the electrostatic chucking plate vertical, the printed wiring board was still sucked and detached after 30 seconds. Next, after the adsorption was performed in the same manner, when the applied voltage was lowered without shutting off the switch, the printed wiring board was detached at 1 KV. It was confirmed that desorption occurred when the applied voltage was set to 1 KV by repeatedly adsorbing in the same manner.

Using two sets of the above-mentioned electrostatic chucking plates, a printed wiring board is sucked to one of the electrostatic chucking plates at an applied voltage of 3 KV, and the other is applied with a voltage of 5 KV so that the sucking surfaces face each other. It was brought into contact with the adsorbed printed wiring board. After that, when these two sets of electrostatic suction plates were separated,
It was confirmed that the printed wiring board was attracted to the electrostatic attraction plate to which 5 KV was applied.

[0018]

As described above, according to the delivery method and the detachment method for transporting electronic materials using the electrostatic chucking plate of the present invention, electronic materials, particularly printed wiring boards and shadow masks having a large number of small-diameter holes, can be used. When the electrostatic adsorption is surely performed and the desorption is desired, the desorption can be arbitrarily and surely performed with good timing. Even when at least a flat electronic material is conveyed while being transferred via a plurality of electrostatic suction conveyance means, it is possible to reliably transfer the adsorbed material from the sender side to the receiver side. Therefore, the use of the method of the present invention brings about an excellent effect that the transfer, transfer, and desorption can be reliably performed regardless of factors such as the temperature and humidity of the atmosphere and the surface condition of the suction transfer object.

Claims (2)

[Claims] In a method of transporting at least a flat plate-shaped electronic material while delivering it via a plurality of electrostatic attraction / conveying means, a second electrostatic adsorption / transporting means on which the electronic material is adsorbed has a second electrostatic attraction surface. Contact urging the suction surface side of the electrostatic suction and conveyance means of the first, the voltage applied to the second electrostatic suction and conveyance means higher than the voltage applied to the first electrostatic suction means, the first and the A delivery method in electronic material conveyance using an electrostatic attraction plate, wherein the second electrostatic attraction means is separated. 2. A method for supplying an applied voltage without instantaneously shutting off an applied voltage supply circuit for supplying a high voltage to the electrostatic attraction plate when detaching the lithographic electronic material attracted to the electrostatic attraction plate. A desorption method in electronic material conveyance using an electrostatic attraction plate, characterized by lowering an output voltage of a circuit.