JP2001341843A - Attraction carrying method is printed circuit board manufacturing process - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a attraction carrying method which can reliably attract and carry a printed circuit board one by one in the attraction carrying of a manufacturing process of the printed circuit board. SOLUTION: In this attraction carrying method for manufacturing the printed circuit board 1 having a conductive layer on an insulating base material, an electrostatic attraction mechanism with the variable applied voltage is employed in an attraction means 3 of the printed circuit board 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed wiring board used in electric and electronic equipment, and more particularly to a method of sucking and transporting a printed wiring board during and after each process. .

[0002]

2. Description of the Related Art For a method of manufacturing a printed wiring board,
For example, a desired wiring pattern is formed by a subtractive method or the like in which an etching resist is provided on a copper-clad laminate in the form of a wiring pattern and unnecessary copper foil is removed by etching. After that, through many processes such as removal of etching resist, lamination of inner layer board, drilling of through-hole, through-hole plating, solder resist installation, and component layout drawing printing, it is finally completed as a printed wiring board product.

[0003] During the above-mentioned steps and during the movement between the steps, the printed wiring boards being manufactured are transported one by one by a transport means having a suction mechanism. According to such a transporting means, the transporting member can be prevented from inadvertently rubbing the surface of the printed wiring board, and transport jams and displacement can be suppressed. Is widely used in the manufacturing process of a printed wiring board.

As the suction means, fine holes or grooves are provided on the suction surface which is in close contact with the printed wiring board, and air is suctioned by a fan, a blower or an aspirator through the holes or the like to depressurize the printed wiring board and the suction surface. A technique of providing a suction mechanism and performing suction is used.

[0005] In the case of this reduced pressure suction mechanism, for example, air flows in from a through hole in a printed wiring board having a through hole, and flatness decreases in a printed wiring board provided with a solder resist. When the required decompression is hindered and the adsorption efficiency is reduced, or when a plurality of stacked sheets are adsorbed and removed one by one,
If the stacking accuracy is poor, the position of the through-hole is shifted, which may cause the lower printed circuit board to be sucked, which hinders the work.

[0006]

SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a suction-conveying method capable of surely adsorbing one sheet at a time in a suction-conveying process in a printed wiring board manufacturing process. To provide.

[0007]

Means for Solving the Problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, have found the following invention.

According to a first aspect of the present invention, there is provided a method for manufacturing a printed wiring board having a conductive layer on at least an insulating base material, wherein the suction means for the printed wiring board is an electrostatic suction mechanism. It is characterized by:

A second invention is characterized in that the electrostatic suction means has a plurality of electrostatic suction mechanisms.

A third aspect of the present invention is characterized in that the applied voltage of the electrostatic attraction mechanism is individually variable.

A fourth aspect of the present invention is characterized in that, in the electrostatic attraction means, a voltage level for expressing at least the electrostatic attraction capability is variable in two or more steps.

The fifth invention is characterized in that the difference between the applied voltage levels is 500 V or more.

In the method of the present invention, even if the printed wiring board has through holes, the electrostatic attraction is performed.
Unlike vacuum suction, it does not cause vacuum destruction through through holes and does not adsorb to the printed wiring board one sheet below.
The suction conveyance is performed for each sheet. In addition, since it has multiple electrostatic suction mechanisms and can change the applied voltage, it is easy to set a large number of printed wiring boards to be suctioned one by one. Since the force can be strengthened, falling off during transportation is suppressed.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view showing an example of the suction conveyance means of the present invention. According to a conventional method (for example, a manufacturing method described in “Printed Circuit Technology Handbook” (edited by the Printed Circuit Society), p. 57 et seq.), A through-hole in which a wiring pattern conductive layer forming step is completed on an insulating base material is completed. A printed wiring board 1 having a hole is placed still on a pallet 2. The printed wiring board 1 is mounted on a solder resist coating device 6 for performing a solder resist installation process, which is a resin film that is heat-resistant and insulating and prevents solder adhesion.
Are picked up one by one from the uppermost sheet by the suction and conveyance means 3 having an electrostatic suction mechanism, and are moved in the horizontal direction by the moving means 4 to arrange the printed wiring board 1 on the belt conveyor 5. I have.

FIG. 2 is a schematic view of the suction conveyance means 3 of the present invention as viewed from the suction surface side. The first electrostatic attraction mechanism 10 is arranged at the center, and the second electrostatic attraction mechanism 11 is arranged at the outside. FIG. 3 is a schematic cross-sectional view thereof. In the electrostatic attraction mechanisms 10 and 11, a comb-shaped flat electrode 13 is adhered to the back surface of an attraction surface sheet 14, and an insulating back plate 12 is adhered. Further, a wiring from a voltage supply device (not shown) to the comb-like electrode is provided. The suction surface sheet 14 is disclosed in
What is described in 108915 gazette can be used effectively. In addition, the size of the suction surface sheet is only required to cover at least 20% of the area of the printed wiring board to be sucked, and preferably at least 50%.

The attracting / conveying means 3 descends to a position in contact with the uppermost printed wiring board 1, and applies a voltage to the comb-shaped flat electrode 13 of the first electrostatic attraction mechanism 10 to apply a voltage to the printed wiring board 1.
Is adsorbed by one sheet. Next, when the suction and conveyance means 3 starts to rise, a voltage is also applied to the second electrostatic attraction mechanism 11 to enhance the electrostatic attraction force and prevent falling off during the conveyance.

After the suction / transport mechanism 3 completes ascending, it moves laterally,
When the belt reaches the fixed position of the belt conveyor 5, it descends, stops supplying voltage to the electrostatic chucking mechanisms 10 and 11, and places the printed wiring board 1 on the belt conveyor 5.

The voltage supplied to the comb-shaped electrode of the electrostatic chucking mechanism of the present invention depends on the size, thickness, number of finishing steps and weight of the printed wiring board to be conveyed, but can be used in the range of 500 V to 5 KV. . If the printed wiring board to be conveyed is small and light, the applied voltage may be too high and a plurality of sheets may be attracted. Therefore, it is desirable to determine the appropriate voltage in advance by performing a simple experiment.

Further, as the voltage supply device, a DC converter capable of boosting a voltage of several V to several KV can be used. It is preferable that the output voltage can be continuously varied. However, in consideration of the cost, a plurality of devices that output a constant voltage may be used and may be switched by the control device.

[0020]

EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited to the following examples unless departing from the gist of the invention.

An embodiment will be described with reference to FIGS. A printed circuit board 1 was prepared by using a double-sided copper-clad laminate (500 × 600 mm) as a substrate and forming a wiring pattern having through-holes with a hole diameter of 0.8 mm and 0.5 mm according to a conventional method.

A belt conveyor 5 for loading 50 printed wiring boards 1 on a pallet 2 and introducing them into a solder resist coating device 6 which is the next step by using a suction conveyance means 3.
Then, the printed wiring board 1 was suction-conveyed one by one.

The suction and conveyance means 3 includes an electrostatic suction mechanism 10, 1
1 and a mechanism for moving up and down (here, an air cylinder is used), and a guide rail 4 having an air drive as a moving means in the lateral direction.

The electrostatic attraction mechanism 10 is disposed at the center, and the second electrostatic attraction mechanism 11 is disposed at the outside.
FIG. 3 is a schematic cross-sectional view of the electrostatic adsorption mechanism 1.
Reference numerals 0 and 11 denote the back surface of the suction surface sheet 14 as disclosed in JP-A-6-275.
No. 45, a comb-shaped flat electrode 13 is bonded, and an insulating back plate 12 is bonded. Further, a wiring from a voltage supply device (not shown) to the comb-like electrode is provided.

The operation of the suction and conveyance means 3 will be described.
The suction conveyance means 3 descends to a position where the suction conveyance means 3 comes into contact with the uppermost printed wiring board 1, and the comb-shaped flat electrode 1 of the electrostatic suction mechanism 10 is moved.
A voltage (1 KV) is applied to 3 to attract one printed wiring board 1. Next, when the suction conveyance means 3 starts to rise, a voltage (2 KV) is also applied to the electrostatic suction mechanism 11. The electrostatic attraction force is strengthened to prevent falling off during conveyance. After the suction and transport mechanism 3 completes ascending, it moves laterally, and when it reaches a fixed position on the belt conveyor 5, it descends and stops supplying voltage to the electrostatic suction mechanisms 10 and 11;
The printed wiring board 1 is set on the belt conveyor 5.

The voltage to be supplied to the comb-shaped electrodes of the electrostatic suction mechanism of the present invention is applied in four steps of 500 V, 1 KV, 1.5 KV and 2 KV by bringing the printed wiring board 1 into contact with the electrostatic suction mechanism 10. Tested and decided. At 500 V, adsorption was not possible, and at 1.5 KV or more, a plurality of sheets were sometimes adsorbed.

Using the above-mentioned suction and transfer means 3, the suction and transfer of the printed wiring boards for five pallets were successively performed, but no suction error and suction of a plurality of sheets were found.

[0028]

As described above, according to the suction transfer method of the present invention, when a printed wiring board is transferred while being suctioned, the printed wiring board having through holes is formed by performing electrostatic suction. However, unlike the case of vacuum suction, vacuum suction through through holes and suction to the printed circuit board one sheet below are not performed, and the suction transfer can be easily performed for each sheet. In addition, it is possible to have a plurality of electrostatic chucking mechanisms and to change the applied voltage, so that it is easy to set a large number of printed wiring boards to be sucked one by one, and furthermore, during conveyance, Since the suction force can be strengthened, falling off during transportation can be suppressed, and production efficiency can be improved. Further, since there is no need for a fan, a blower, and a pipe as compared with reduced pressure adsorption, there is an excellent effect that the adsorption device can be downsized.

[Brief description of the drawings]

FIG. 1 is a schematic view illustrating an example of a suction conveyance method in a printed wiring board manufacturing process of the present invention.

FIG. 2 is a schematic plan view illustrating an example of an electrostatic suction mechanism of a suction and transfer method in a printed wiring board manufacturing process of the present invention.

FIG. 3 is a schematic side sectional view illustrating an example of an electrostatic suction mechanism of a suction and transfer method in a printed wiring board manufacturing process of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Pallet 3 Electrostatic adsorption means 4 Moving means 5 Belt conveyor 6 Solder resist coating device 10 Electrostatic adsorption mechanism 11 Electrostatic adsorption mechanism 12 Back plate 13 Comb-shaped flat electrode 14 Adsorption surface sheet

Claims (5)

[Claims] 1. A method for manufacturing a printed wiring board having a conductive layer on at least an insulating substrate, wherein the suction means for the printed wiring board is an electrostatic suction mechanism. Suction conveyance method in the printed wiring board manufacturing process. 2. The method according to claim 1, wherein the electrostatic attraction means has a plurality of electrostatic attraction mechanisms. 3. The method according to claim 2, wherein the applied voltage of the electrostatic suction mechanism is individually variable. 4. The method according to claim 1, wherein the electrostatic attraction means has at least two or more variable voltage levels for expressing the electrostatic attraction capability. Transport method. 5. The method according to claim 1, wherein the difference between the applied voltage levels is 50.
5. The method according to claim 4, wherein the voltage is 0 V or more.