JP2002127069A - Method for separating electronic material in electronic material carry using electrostatic attraction plate - Google Patents

Method for separating electronic material in electronic material carry using electrostatic attraction plate

Info

Publication number
JP2002127069A
JP2002127069A JP2000325443A JP2000325443A JP2002127069A JP 2002127069 A JP2002127069 A JP 2002127069A JP 2000325443 A JP2000325443 A JP 2000325443A JP 2000325443 A JP2000325443 A JP 2000325443A JP 2002127069 A JP2002127069 A JP 2002127069A
Authority
JP
Japan
Prior art keywords
electronic material
plate
electrostatic attraction
counter electrode
separating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000325443A
Other languages
Japanese (ja)
Inventor
Hideaki Ishiguro
秀明 石黒
Yuji Takagami
裕二 高上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Paper Mills Ltd
Original Assignee
Mitsubishi Paper Mills Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Paper Mills Ltd filed Critical Mitsubishi Paper Mills Ltd
Priority to JP2000325443A priority Critical patent/JP2002127069A/en
Publication of JP2002127069A publication Critical patent/JP2002127069A/en
Pending legal-status Critical Current

Links

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Manipulator (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a separating method for optionally and surely attracting and separating an electronic material in an electrostatic attraction carry of the plate-like electronic material. SOLUTION: In this separating method of the plate-like electronic material attracted to an electrostatic attraction plate containing a counter electrode by impressing high voltage, supply of the high voltage to the counter electrode is stopped, and the counter electrode is short-circuited.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電気・電子機器に
用いられる平板状の電子材料、特にプリント配線板やシ
ャドウマスク、アパーチャグリル等の小径孔を多数有す
る電子材料を、吸着して搬送するための吸着搬送手段に
おける、吸着した電子材料の円滑な脱離方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat plate-shaped electronic material used for electric and electronic equipment, particularly an electronic material having a large number of small-diameter holes, such as a printed wiring board, a shadow mask, and an aperture grill, which are conveyed. For smooth desorption of the electronic material adsorbed by the adsorption transport means for the purpose.

【0002】[0002]

【従来の技術】平板状の電子材料、例えばプリント配線
板やシャドウマスクのような薄板状でも多数の穴が空い
た材料の枚葉毎の搬送においては、穴の空いていない部
分を小径の吸着パッドを介して減圧吸着して搬送した
り、高流量のブロアを用いて多数吸着口を有する吸着面
で吸着して搬送する手段がとられていた。
2. Description of the Related Art In transporting a flat electronic material, for example, a material having many holes even in a thin plate such as a printed wiring board or a shadow mask, a portion having no holes is adsorbed with a small diameter. Means have been adopted in which suction is performed under reduced pressure via a pad for conveyance, or suction and conveyance is performed using a suction surface having a large number of suction ports by using a high flow rate blower.

【0003】上記のような搬送手段では、搬送する電子
材料のロット替わりに際して、吸着パッド位置を調整が
必要であったり、また減圧するための高流量用の配管を
引き回す必要があるため設計上の制約が生じたり機械が
大型化するなど不都合を生じていた。
[0003] In the above-described transfer means, when changing the lot of the electronic material to be transferred, it is necessary to adjust the position of the suction pad or to route a high flow pipe for reducing the pressure. Inconveniences, such as restriction and enlargement of the machine, occurred.

【0004】そこで、吸着手段として、静電吸着方式に
よる薄板状の電子材料の搬送方法の提案もなされてい
る。静電吸着方式では、減圧吸着方式に比べ、小径孔を
多数有するプリント配線板やシャドウマスクを効率よく
吸着することが可能で、大流量の配管等の取り回しがい
らないため、搬送装置の設計の自由度も向上する。しか
し、吸着した電子材料を脱離させる時には印加電圧を切
断しても、電子材料の材質、質量、吸着面積、また静電
吸着板の表面吸着層の材質及び誘電率や抵抗率、あるい
は使用環境下の温湿度等の要因によって、吸着面に電荷
が残存し、電子材料等の吸着物が任意に脱離出来ない場
合があった。
Therefore, a method of transporting a thin plate of electronic material by an electrostatic attraction method has been proposed as an attraction means. Compared to the vacuum suction method, the electrostatic suction method can efficiently adsorb a printed wiring board or a shadow mask having a large number of small-diameter holes, and eliminates the need for routing large-volume pipes. The degree also improves. However, even if the applied voltage is cut off when the adsorbed electronic material is desorbed, the material, mass, and adsorption area of the electronic material, the material and dielectric constant and resistivity of the surface adsorption layer of the electrostatic adsorption plate, or the operating environment Due to factors such as the temperature and humidity below, charges may remain on the adsorption surface, and adsorbed substances such as electronic materials may not be arbitrarily desorbed.

【0005】[0005]

【発明が解決しようとする課題】本発明の課題は、上記
問題点に鑑み、平板状の電子材料の静電吸着搬送におい
て、任意に、確実に脱離を行う脱離方法を提供すること
にある。
SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a desorption method for arbitrarily and reliably desorbing a plate-shaped electronic material in electrostatic attraction conveyance. is there.

【0006】[0006]

【課題を解決するための手段】本発明者らは、上記課題
を解決するために鋭意検討した結果、以下の発明を見出
した。
Means for Solving the Problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, have found the following invention.

【0007】本発明は、対向電極を内包する静電吸着板
に、高電圧を印加して吸着された平板状の電子材料の脱
離方法において、該対向電極を短絡させることを特徴と
している。
The present invention is characterized in that, in a method for removing a flat plate-shaped electronic material which has been attracted by applying a high voltage to an electrostatic attracting plate containing the opposed electrode, the opposed electrode is short-circuited.

【0008】[0008]

【発明の実施の形態】本発明の脱離方法では、平板状の
電子材料、特にプリント配線板やシャドウマスクが静電
吸着なされた後に脱離させる時に、印加電圧の供給を電
圧供給回路を遮断することで停止し、対向電極間を短絡
させるものである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS In the desorption method of the present invention, when a flat electronic material, particularly a printed wiring board or a shadow mask is desorbed after being electrostatically attracted, supply of an applied voltage is cut off by a voltage supply circuit. By doing so, it stops and shorts between the counter electrodes.

【0009】これは電圧印加時に対向電極に対応して静
電吸着板の表面には静電誘導により電荷が生じており、
これが吸着力となっている。しかし脱離時に電圧印加を
停止しても静電吸着板表面の電荷が直ぐには消失ぜず、
漸次減衰するため回路遮断から脱離するまでに遅延が生
じている。本発明では電圧印加停止後、印加していた対
向電極を短絡させることで吸着層表面の電荷を素早く消
失させることで、タイミング良く脱離させることができ
る。
This is because electric charges are generated by electrostatic induction on the surface of the electrostatic attraction plate corresponding to the counter electrode when voltage is applied.
This is the attraction force. However, even if the voltage application is stopped during desorption, the charge on the surface of the electrostatic attraction plate does not disappear immediately,
Due to the gradual attenuation, a delay occurs before the circuit departs from the circuit interruption. In the present invention, after the voltage application is stopped, the charge on the surface of the adsorbing layer is quickly eliminated by short-circuiting the applied counter electrode, so that the adsorbed layer can be desorbed with good timing.

【0010】対向電極間を短絡させるためには、電圧供
給回路の遮断すと連動するスイッチで対向電極間の短絡
回路を形成させることや、リレーやSSR(ソリッドス
テートリレー)を介して短絡回路を形成させても良い。
In order to short-circuit between the opposing electrodes, a short-circuit between the opposing electrodes can be formed by a switch that works in conjunction with the interruption of the voltage supply circuit, or the short-circuit can be established via a relay or SSR (solid state relay). It may be formed.

【0011】次に本発明に係る静電吸着板について説明
する。本発明に用いられる静電吸着板は、例えば特公昭
57−58872号公報、特開昭59−108915号
公報に記載されているように、吸着面シートとして10
8〜1012Ωcm程度の電気抵抗率を有したプラステッ
クシートと電気抵抗率1015Ωcm以上の絶縁物の間
に、櫛歯状で互いに入れ子となった対向電極が設けられ
て構成されたものである。
Next, the electrostatic attraction plate according to the present invention will be described. As described in Japanese Patent Publication No. 57-58872 and Japanese Patent Laid-Open Publication No. Sho 59-108915, for example, the electrostatic attraction plate used in the present invention has a 10
A structure in which opposing electrodes nested in a comb shape are provided between a plastic sheet having an electric resistivity of about 8 to 10 12 Ωcm and an insulator having an electric resistivity of 10 15 Ωcm or more. It is.

【0012】上記のような静電吸着板の対向電極に高圧
電源が接続され、電極間に100V〜10KVの高電圧
が印加されて静電吸着力(クーロン力)が発現するよう
になっている。この高圧電源には通常、自励発振方式の
DC−DCコンバータが用いられており、数V程度の入
力で上記高電圧が得られるようになっている。出力電圧
は可変のものが好ましいが、出力電圧が固定のものを複
数用いて切り替えて使用することも出来る。
A high-voltage power supply is connected to the opposite electrode of the above-mentioned electrostatic attraction plate, and a high voltage of 100 V to 10 KV is applied between the electrodes so that an electrostatic attraction force (Coulomb force) is developed. . Usually, a self-excited oscillation type DC-DC converter is used for the high-voltage power supply, and the high voltage can be obtained with an input of about several volts. The output voltage is preferably variable, but a plurality of output voltages having a fixed output voltage can be used by switching.

【0013】[0013]

【実施例】以下本発明を実施例により詳説するが、本発
明はその趣旨を逸脱しない限り、下記実施例に限定され
るものではない。
EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited to the following examples unless departing from the gist of the invention.

【0014】実施例 電子材料として、両面銅張り積層板(500×600m
m)を使用し、常法に従って配線パターン形成し、プリ
ント配線板を作製した。
Example As an electronic material, a double-sided copper-clad laminate (500 × 600 m
Using m), a wiring pattern was formed according to a conventional method to produce a printed wiring board.

【0015】静電吸着板として、ガラスエポキシ基材
(0.1mm厚)の片面銅張りプリント配線板(銅厚1
8μm)を用いて銅箔を櫛歯状にエッチングして対向電
極とし、この対向電極上面にナイロン板(板厚1mm)
を接着して作製したものを用いた(図1)。対向電極に
は高電圧出力電源(トレック社製610B)を接続し
た。
As an electrostatic attraction plate, a single-sided copper-clad printed wiring board (copper thickness 1) of a glass epoxy base material (0.1 mm thick) is used.
8 μm) to form a counter electrode by etching the copper foil into a comb shape, and a nylon plate (plate thickness 1 mm) is formed on the upper surface of the counter electrode.
(FIG. 1). A high-voltage output power supply (610B, manufactured by Trek) was connected to the counter electrode.

【0016】上記プリント配線板を静電吸着板に接触さ
せて、静電吸着板に4KVの電圧を印加したところ、吸
着した。この静電吸着板を垂直にして、高電圧出力電源
のスイッチを遮断したところ、プリント配線板は吸着さ
れたままであり、30秒後に脱離した。次に同様に吸着
させた後にスイッチを遮断すると共に、対向電極の端子
間を短絡させたところ、直ちにプリント配線板が落下し
た。
When the printed wiring board was brought into contact with the electrostatic attraction plate and a voltage of 4 KV was applied to the electrostatic attraction plate, the printed circuit board was attracted. When the switch of the high-voltage output power supply was turned off with the electrostatic chucking plate vertical, the printed wiring board was still sucked and detached after 30 seconds. Next, the switch was cut off after the same suction, and the terminals of the counter electrode were short-circuited. As a result, the printed wiring board immediately fell.

【0017】[0017]

【発明の効果】以上説明したごとく、本発明の静電吸着
板を用いた電子材料搬送における受け渡し方法及び脱離
方法によれば、電子材料、特に小径孔を多数有するプリ
ント配線板やシャドウマスクが確実に静電吸着され、ま
た脱離させたい時に、任意に、また確実にタイミング良
く脱離させることが出来る。従って本発明の方法を用い
れば、雰囲気温湿度、また静電吸着板や吸着搬送物の材
質、表面状態等の要因によらず確実に脱離が出来る秀逸
な効果をもたらす。
As described above, according to the delivery method and the detachment method for transporting electronic materials using the electrostatic chucking plate of the present invention, electronic materials, particularly printed wiring boards and shadow masks having a large number of small-diameter holes, can be used. When the electrostatic adsorption is surely performed and the desorption is desired, the desorption can be arbitrarily and surely performed with good timing. Therefore, the use of the method of the present invention provides an excellent effect that the desorption can be surely performed irrespective of factors such as the temperature and humidity of the atmosphere and the material and surface condition of the electrostatic suction plate and the suction conveyance object.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係わる静電吸着板の櫛歯状の対向電極
の一例を示す概略図である。
FIG. 1 is a schematic view showing an example of a comb-shaped counter electrode of an electrostatic suction plate according to the present invention.

【符号の説明】[Explanation of symbols]

1 基材 2a、2b 対向電極 1 base material 2a, 2b counter electrode

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 対向電極を内包する静電吸着板に、高電
圧を印加して吸着された平板状の電子材料の脱離方法に
おいて、該対向電極を短絡させることを特徴とする静電
吸着板を用いた電子材料搬送における電子材料の脱離方
法。
1. A method for desorbing a flat plate-shaped electronic material which is applied by applying a high voltage to an electrostatic attraction plate including an opposing electrode, wherein the opposing electrode is short-circuited. A method for detaching an electronic material in transporting the electronic material using a plate.
JP2000325443A 2000-10-25 2000-10-25 Method for separating electronic material in electronic material carry using electrostatic attraction plate Pending JP2002127069A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000325443A JP2002127069A (en) 2000-10-25 2000-10-25 Method for separating electronic material in electronic material carry using electrostatic attraction plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000325443A JP2002127069A (en) 2000-10-25 2000-10-25 Method for separating electronic material in electronic material carry using electrostatic attraction plate

Publications (1)

Publication Number Publication Date
JP2002127069A true JP2002127069A (en) 2002-05-08

Family

ID=18802805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000325443A Pending JP2002127069A (en) 2000-10-25 2000-10-25 Method for separating electronic material in electronic material carry using electrostatic attraction plate

Country Status (1)

Country Link
JP (1) JP2002127069A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200040152A (en) * 2018-10-08 2020-04-17 한국생산기술연구원 Electro-adhesion gripper and method for preparing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200040152A (en) * 2018-10-08 2020-04-17 한국생산기술연구원 Electro-adhesion gripper and method for preparing the same
KR102253843B1 (en) * 2018-10-08 2021-05-20 한국생산기술연구원 Electro-adhesion gripper and method for preparing the same

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