JP2001526836A5 - - Google Patents

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Publication number
JP2001526836A5
JP2001526836A5 JP1998542782A JP54278298A JP2001526836A5 JP 2001526836 A5 JP2001526836 A5 JP 2001526836A5 JP 1998542782 A JP1998542782 A JP 1998542782A JP 54278298 A JP54278298 A JP 54278298A JP 2001526836 A5 JP2001526836 A5 JP 2001526836A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP1998542782A
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English (en)
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JP2001526836A (ja
JP4138891B2 (ja
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Priority claimed from US08/833,382 external-priority patent/US6492311B2/en
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Publication of JP2001526836A publication Critical patent/JP2001526836A/ja
Publication of JP2001526836A5 publication Critical patent/JP2001526836A5/ja
Application granted granted Critical
Publication of JP4138891B2 publication Critical patent/JP4138891B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

Figure 2001526836
Figure 2001526836
JP54278298A 1997-04-04 1998-03-17 エチレンジアミン四酢酸またはそのアンモニウム塩である半導体プロセス残渣除去組成物および方法 Expired - Fee Related JP4138891B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/833,382 US6492311B2 (en) 1990-11-05 1997-04-04 Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process
US08/833,382 1997-04-04
PCT/US1998/005150 WO1998045399A1 (en) 1997-04-04 1998-03-17 Ethylenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process

Publications (3)

Publication Number Publication Date
JP2001526836A JP2001526836A (ja) 2001-12-18
JP2001526836A5 true JP2001526836A5 (ja) 2005-11-10
JP4138891B2 JP4138891B2 (ja) 2008-08-27

Family

ID=25264284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54278298A Expired - Fee Related JP4138891B2 (ja) 1997-04-04 1998-03-17 エチレンジアミン四酢酸またはそのアンモニウム塩である半導体プロセス残渣除去組成物および方法

Country Status (9)

Country Link
US (2) US6492311B2 (ja)
EP (1) EP0975731B1 (ja)
JP (1) JP4138891B2 (ja)
KR (1) KR100386137B1 (ja)
AT (1) ATE340243T1 (ja)
DE (1) DE69835951T2 (ja)
SG (1) SG120055A1 (ja)
TW (1) TW416984B (ja)
WO (1) WO1998045399A1 (ja)

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US8178482B2 (en) * 2004-08-03 2012-05-15 Avantor Performance Materials, Inc. Cleaning compositions for microelectronic substrates
US20060094612A1 (en) * 2004-11-04 2006-05-04 Mayumi Kimura Post etch cleaning composition for use with substrates having aluminum
KR101050953B1 (ko) * 2004-12-30 2011-07-20 매그나칩 반도체 유한회사 티타늄 또는 탄탈륨계 폴리머 제거방법
KR101088568B1 (ko) * 2005-04-19 2011-12-05 아반토르 퍼포먼스 머티리얼스, 인크. 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼
CN100409416C (zh) * 2005-12-06 2008-08-06 上海华虹Nec电子有限公司 消除金属连线上铜颗粒的方法
EP2191041A4 (en) * 2007-09-06 2013-07-17 Ekc Technology Inc COMPOSITIONS AND PROCESS FOR TREATING COPPER SURFACE
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JP5646882B2 (ja) * 2009-09-30 2014-12-24 富士フイルム株式会社 洗浄組成物、洗浄方法、及び半導体装置の製造方法
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FR2965567B1 (fr) 2010-10-05 2013-12-27 Arkema France Composition de nettoyage de polymeres
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