JP2001511315A5 - - Google Patents

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Publication number
JP2001511315A5
JP2001511315A5 JP1998534944A JP53494498A JP2001511315A5 JP 2001511315 A5 JP2001511315 A5 JP 2001511315A5 JP 1998534944 A JP1998534944 A JP 1998534944A JP 53494498 A JP53494498 A JP 53494498A JP 2001511315 A5 JP2001511315 A5 JP 2001511315A5
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JP
Japan
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JP1998534944A
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English (en)
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JP5054255B2 (ja
JP2001511315A (ja
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Priority claimed from US08/795,135 external-priority patent/US6570185B1/en
Priority claimed from US08/797,535 external-priority patent/US6180958B1/en
Application filed filed Critical
Priority claimed from PCT/US1998/002384 external-priority patent/WO1998035390A1/en
Publication of JP2001511315A publication Critical patent/JP2001511315A/ja
Publication of JP2001511315A5 publication Critical patent/JP2001511315A5/ja
Application granted granted Critical
Publication of JP5054255B2 publication Critical patent/JP5054255B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Figure 2001511315
Figure 2001511315
Figure 2001511315
Figure 2001511315
Figure 2001511315
Figure 2001511315
Figure 2001511315
JP53494498A 1997-02-07 1998-02-06 シリコン・カーバイド・パワー・トランジスタの最大電圧を増大させるための構造 Expired - Lifetime JP5054255B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US08/795,135 US6570185B1 (en) 1997-02-07 1997-02-07 Structure to reduce the on-resistance of power transistors
US08/795,135 1997-02-07
US08/797,535 US6180958B1 (en) 1997-02-07 1997-02-07 Structure for increasing the maximum voltage of silicon carbide power transistors
US08/797,535 1997-02-07
PCT/US1998/002384 WO1998035390A1 (en) 1997-02-07 1998-02-06 Structure for increasing the maximum voltage of silicon carbide power transistors

Publications (3)

Publication Number Publication Date
JP2001511315A JP2001511315A (ja) 2001-08-07
JP2001511315A5 true JP2001511315A5 (ja) 2005-10-06
JP5054255B2 JP5054255B2 (ja) 2012-10-24

Family

ID=27121597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53494498A Expired - Lifetime JP5054255B2 (ja) 1997-02-07 1998-02-06 シリコン・カーバイド・パワー・トランジスタの最大電圧を増大させるための構造

Country Status (7)

Country Link
EP (1) EP0966763B1 (ja)
JP (1) JP5054255B2 (ja)
AT (1) ATE287127T1 (ja)
AU (1) AU6272798A (ja)
DE (1) DE69828588T2 (ja)
ES (1) ES2236887T3 (ja)
WO (1) WO1998035390A1 (ja)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3716490B2 (ja) 1996-04-05 2005-11-16 トヨタ自動車株式会社 制動力制御装置
WO1998039185A1 (fr) 1997-03-06 1998-09-11 Toyota Jidosha Kabushiki Kaisha Regulateur de freinage
US6313482B1 (en) 1999-05-17 2001-11-06 North Carolina State University Silicon carbide power devices having trench-based silicon carbide charge coupling regions therein
US6392273B1 (en) * 2000-01-14 2002-05-21 Rockwell Science Center, Llc Trench insulated-gate bipolar transistor with improved safe-operating-area
JP4738562B2 (ja) * 2000-03-15 2011-08-03 三菱電機株式会社 半導体装置の製造方法
JP4865166B2 (ja) * 2001-08-30 2012-02-01 新電元工業株式会社 トランジスタの製造方法、ダイオードの製造方法
SE525574C2 (sv) 2002-08-30 2005-03-15 Okmetic Oyj Lågdopat kiselkarbidsubstrat och användning därav i högspänningskomponenter
JP4564362B2 (ja) * 2004-01-23 2010-10-20 株式会社東芝 半導体装置
GB0417749D0 (en) * 2004-08-10 2004-09-08 Eco Semiconductors Ltd Improved bipolar MOSFET devices and methods for their use
JP4802542B2 (ja) * 2005-04-19 2011-10-26 株式会社デンソー 炭化珪素半導体装置
JP2008016747A (ja) * 2006-07-10 2008-01-24 Fuji Electric Holdings Co Ltd トレンチmos型炭化珪素半導体装置およびその製造方法
JP5444608B2 (ja) * 2007-11-07 2014-03-19 富士電機株式会社 半導体装置
JP4640436B2 (ja) * 2008-04-14 2011-03-02 株式会社デンソー 炭化珪素半導体装置の製造方法
WO2012077617A1 (ja) * 2010-12-10 2012-06-14 三菱電機株式会社 半導体装置およびその製造方法
JP6197995B2 (ja) 2013-08-23 2017-09-20 富士電機株式会社 ワイドバンドギャップ絶縁ゲート型半導体装置
US10453951B2 (en) 2014-09-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device having a gate trench and an outside trench
JP6698697B2 (ja) * 2015-01-27 2020-05-27 アーベーベー・シュバイツ・アーゲー 絶縁ゲートパワー半導体デバイスおよびそのデバイスの製造方法
DE112016002613B4 (de) 2015-06-09 2022-04-28 Mitsubishi Electric Corporation Leistungs-Halbleiterbauelement
WO2017064887A1 (ja) 2015-10-16 2017-04-20 三菱電機株式会社 半導体装置
US10559652B2 (en) 2016-02-09 2020-02-11 Mitsubishi Electric Corporation Semiconductor device
US9728599B1 (en) 2016-05-10 2017-08-08 Fuji Electric Co., Ltd. Semiconductor device
JP6855793B2 (ja) 2016-12-28 2021-04-07 富士電機株式会社 半導体装置
JP7067021B2 (ja) 2017-11-07 2022-05-16 富士電機株式会社 絶縁ゲート型半導体装置及びその製造方法
GB2572442A (en) * 2018-03-29 2019-10-02 Cambridge Entpr Ltd Power semiconductor device with a double gate structure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4941026A (en) * 1986-12-05 1990-07-10 General Electric Company Semiconductor devices exhibiting minimum on-resistance
JPH0783118B2 (ja) * 1988-06-08 1995-09-06 三菱電機株式会社 半導体装置およびその製造方法
US5168331A (en) * 1991-01-31 1992-12-01 Siliconix Incorporated Power metal-oxide-semiconductor field effect transistor
JP2682272B2 (ja) * 1991-06-27 1997-11-26 三菱電機株式会社 絶縁ゲート型トランジスタ
US5233215A (en) * 1992-06-08 1993-08-03 North Carolina State University At Raleigh Silicon carbide power MOSFET with floating field ring and floating field plate
JP2883501B2 (ja) * 1992-09-09 1999-04-19 三菱電機株式会社 トレンチ絶縁ゲート型バイポーラトランジスタおよびその製造方法
US5506421A (en) * 1992-11-24 1996-04-09 Cree Research, Inc. Power MOSFET in silicon carbide
US5488236A (en) * 1994-05-26 1996-01-30 North Carolina State University Latch-up resistant bipolar transistor with trench IGFET and buried collector
US5688725A (en) * 1994-12-30 1997-11-18 Siliconix Incorporated Method of making a trench mosfet with heavily doped delta layer to provide low on-resistance

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