JP2001502754A - リアクティブ・マグネトロンスパッタリング装置および方法 - Google Patents

リアクティブ・マグネトロンスパッタリング装置および方法

Info

Publication number
JP2001502754A
JP2001502754A JP10501529A JP50152998A JP2001502754A JP 2001502754 A JP2001502754 A JP 2001502754A JP 10501529 A JP10501529 A JP 10501529A JP 50152998 A JP50152998 A JP 50152998A JP 2001502754 A JP2001502754 A JP 2001502754A
Authority
JP
Japan
Prior art keywords
magnetron
substrate
chamber
gas
torr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP10501529A
Other languages
English (en)
Japanese (ja)
Inventor
エイ スコービー，マイケル
Original Assignee
コーニング オーシーエイ コーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コーニング オーシーエイ コーポレーション filed Critical コーニング オーシーエイ コーポレーション
Publication of JP2001502754A publication Critical patent/JP2001502754A/ja
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0047—Activation or excitation of reactive gases outside the coating chamber
    • C23C14/0052—Bombardment of substrates by reactive ion beams
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0063—Reactive sputtering characterised by means for introducing or removing gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06—Sources
    • H01J2237/08—Ion sources

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP10501529A 1996-06-10 1996-06-10 リアクティブ・マグネトロンスパッタリング装置および方法 Ceased JP2001502754A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1996/009742 WO1997047781A1 (en) 1996-06-10 1996-06-10 Reactive magnetron sputtering apparatus and method

Publications (1)

Publication Number Publication Date
JP2001502754A true JP2001502754A (ja) 2001-02-27

Family

ID=22255287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10501529A Ceased JP2001502754A (ja) 1996-06-10 1996-06-10 リアクティブ・マグネトロンスパッタリング装置および方法

Country Status (4)

Country Link
EP (1) EP0956375A1 (de)
JP (1) JP2001502754A (de)
CA (1) CA2254354A1 (de)
WO (1) WO1997047781A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003013217A (ja) * 2001-06-28 2003-01-15 Ulvac Japan Ltd 誘電体膜の成膜方法及び成膜装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6500676B1 (en) * 2001-08-20 2002-12-31 Honeywell International Inc. Methods and apparatus for depositing magnetic films
KR20040046571A (ko) * 2002-11-27 2004-06-05 주식회사 피앤아이 이온빔을 이용한 재료의 표면 처리 장치
EP1628322A1 (de) * 2004-08-17 2006-02-22 Applied Films GmbH & Co. KG Haltevorrichtung für eine Blende

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3331707A1 (de) * 1983-09-02 1985-03-21 Leybold-Heraeus GmbH, 5000 Köln Verfahren und vorrichtung zum reaktiven aufstaeuben von verbindungen von metallen und halbleitern
US4716340A (en) * 1985-12-10 1987-12-29 Denton Vacuum Inc Pre-ionization aided sputter gun
US4931158A (en) * 1988-03-22 1990-06-05 The Regents Of The Univ. Of Calif. Deposition of films onto large area substrates using modified reactive magnetron sputtering
DE3920835C2 (de) * 1989-06-24 1997-12-18 Leybold Ag Einrichtung zum Beschichten von Substraten

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003013217A (ja) * 2001-06-28 2003-01-15 Ulvac Japan Ltd 誘電体膜の成膜方法及び成膜装置
JP4678996B2 (ja) * 2001-06-28 2011-04-27 株式会社アルバック 誘電体膜の成膜方法及び成膜装置

Also Published As

Publication number Publication date
WO1997047781A1 (en) 1997-12-18
EP0956375A1 (de) 1999-11-17
CA2254354A1 (en) 1997-12-18

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