CA2254354A1 - Reactive magnetron sputtering apparatus and method - Google Patents

Reactive magnetron sputtering apparatus and method Download PDF

Info

Publication number
CA2254354A1
CA2254354A1 CA002254354A CA2254354A CA2254354A1 CA 2254354 A1 CA2254354 A1 CA 2254354A1 CA 002254354 A CA002254354 A CA 002254354A CA 2254354 A CA2254354 A CA 2254354A CA 2254354 A1 CA2254354 A1 CA 2254354A1
Authority
CA
Canada
Prior art keywords
substrate
magnetron
chamber
gas
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002254354A
Other languages
English (en)
French (fr)
Inventor
Michael A. Scobey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Oca Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2254354A1 publication Critical patent/CA2254354A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0047—Activation or excitation of reactive gases outside the coating chamber
    • C23C14/0052—Bombardment of substrates by reactive ion beams
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0063—Reactive sputtering characterised by means for introducing or removing gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06—Sources
    • H01J2237/08—Ion sources

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CA002254354A 1996-06-10 1996-06-10 Reactive magnetron sputtering apparatus and method Abandoned CA2254354A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1996/009742 WO1997047781A1 (en) 1996-06-10 1996-06-10 Reactive magnetron sputtering apparatus and method

Publications (1)

Publication Number Publication Date
CA2254354A1 true CA2254354A1 (en) 1997-12-18

Family

ID=22255287

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002254354A Abandoned CA2254354A1 (en) 1996-06-10 1996-06-10 Reactive magnetron sputtering apparatus and method

Country Status (4)

Country Link
EP (1) EP0956375A1 (de)
JP (1) JP2001502754A (de)
CA (1) CA2254354A1 (de)
WO (1) WO1997047781A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4678996B2 (ja) * 2001-06-28 2011-04-27 株式会社アルバック 誘電体膜の成膜方法及び成膜装置
US6500676B1 (en) * 2001-08-20 2002-12-31 Honeywell International Inc. Methods and apparatus for depositing magnetic films
KR20040046571A (ko) * 2002-11-27 2004-06-05 주식회사 피앤아이 이온빔을 이용한 재료의 표면 처리 장치
EP1628322A1 (de) * 2004-08-17 2006-02-22 Applied Films GmbH & Co. KG Haltevorrichtung für eine Blende

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3331707A1 (de) * 1983-09-02 1985-03-21 Leybold-Heraeus GmbH, 5000 Köln Verfahren und vorrichtung zum reaktiven aufstaeuben von verbindungen von metallen und halbleitern
US4716340A (en) * 1985-12-10 1987-12-29 Denton Vacuum Inc Pre-ionization aided sputter gun
US4931158A (en) * 1988-03-22 1990-06-05 The Regents Of The Univ. Of Calif. Deposition of films onto large area substrates using modified reactive magnetron sputtering
DE3920835C2 (de) * 1989-06-24 1997-12-18 Leybold Ag Einrichtung zum Beschichten von Substraten

Also Published As

Publication number Publication date
WO1997047781A1 (en) 1997-12-18
JP2001502754A (ja) 2001-02-27
EP0956375A1 (de) 1999-11-17

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Legal Events

Date Code Title Description
FZDE Discontinued