JP2001345411A - リードフレームとそれを用いた半導体装置及びその生産方法 - Google Patents

リードフレームとそれを用いた半導体装置及びその生産方法

Info

Publication number
JP2001345411A
JP2001345411A JP2000162340A JP2000162340A JP2001345411A JP 2001345411 A JP2001345411 A JP 2001345411A JP 2000162340 A JP2000162340 A JP 2000162340A JP 2000162340 A JP2000162340 A JP 2000162340A JP 2001345411 A JP2001345411 A JP 2001345411A
Authority
JP
Japan
Prior art keywords
lead frame
die pad
leads
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000162340A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001345411A5 (https=
Inventor
Koji Nose
幸之 野世
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000162340A priority Critical patent/JP2001345411A/ja
Publication of JP2001345411A publication Critical patent/JP2001345411A/ja
Publication of JP2001345411A5 publication Critical patent/JP2001345411A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2000162340A 2000-05-31 2000-05-31 リードフレームとそれを用いた半導体装置及びその生産方法 Pending JP2001345411A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000162340A JP2001345411A (ja) 2000-05-31 2000-05-31 リードフレームとそれを用いた半導体装置及びその生産方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000162340A JP2001345411A (ja) 2000-05-31 2000-05-31 リードフレームとそれを用いた半導体装置及びその生産方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2008024408A Division JP4901776B2 (ja) 2008-02-04 2008-02-04 リードフレームとそれを用いた半導体装置及びその生産方法
JP2010291888A Division JP2011066455A (ja) 2010-12-28 2010-12-28 リードフレームを用いた半導体装置

Publications (2)

Publication Number Publication Date
JP2001345411A true JP2001345411A (ja) 2001-12-14
JP2001345411A5 JP2001345411A5 (https=) 2007-01-11

Family

ID=18666250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000162340A Pending JP2001345411A (ja) 2000-05-31 2000-05-31 リードフレームとそれを用いた半導体装置及びその生産方法

Country Status (1)

Country Link
JP (1) JP2001345411A (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3500362B2 (ja) 2001-02-14 2004-02-23 松下電器産業株式会社 樹脂封止型半導体装置及びその製造方法
JP3500361B2 (ja) 2001-02-14 2004-02-23 松下電器産業株式会社 リードフレーム及びその製造方法
US6720207B2 (en) 2001-02-14 2004-04-13 Matsushita Electric Industrial Co., Ltd. Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
JP2004134573A (ja) * 2002-10-10 2004-04-30 Renesas Technology Corp 半導体装置およびその製造方法
US6909168B2 (en) * 2001-07-23 2005-06-21 Matsushita Electric Industrial Co., Ltd. Resin encapsulation semiconductor device utilizing grooved leads and die pad
JP2006222471A (ja) * 2006-05-29 2006-08-24 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置
US7858937B2 (en) 2006-05-30 2010-12-28 Shimadzu Corporation Mass spectrometer
JP2012015191A (ja) * 2010-06-29 2012-01-19 Shinko Electric Ind Co Ltd 半導体パッケージの製造方法及び半導体パッケージ
US8193091B2 (en) 2002-01-09 2012-06-05 Panasonic Corporation Resin encapsulated semiconductor device and method for manufacturing the same
JP2016066790A (ja) * 2014-09-16 2016-04-28 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
CN107818963A (zh) * 2016-09-14 2018-03-20 富士电机株式会社 半导体装置及半导体装置的制造方法
KR102271093B1 (ko) * 2021-01-25 2021-07-02 에스앤피티(주) 반도체 패키징용 서브스트레이트

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3500361B2 (ja) 2001-02-14 2004-02-23 松下電器産業株式会社 リードフレーム及びその製造方法
US6720207B2 (en) 2001-02-14 2004-04-13 Matsushita Electric Industrial Co., Ltd. Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
US6984880B2 (en) 2001-02-14 2006-01-10 Matsushita Electric Industrial Co., Ltd. Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
JP3500362B2 (ja) 2001-02-14 2004-02-23 松下電器産業株式会社 樹脂封止型半導体装置及びその製造方法
US6909168B2 (en) * 2001-07-23 2005-06-21 Matsushita Electric Industrial Co., Ltd. Resin encapsulation semiconductor device utilizing grooved leads and die pad
US7338838B2 (en) 2001-07-23 2008-03-04 Matsushita Electric Industrial Co., Ltd. Resin-encapsulation semiconductor device and method for fabricating the same
US8193091B2 (en) 2002-01-09 2012-06-05 Panasonic Corporation Resin encapsulated semiconductor device and method for manufacturing the same
JP2004134573A (ja) * 2002-10-10 2004-04-30 Renesas Technology Corp 半導体装置およびその製造方法
JP2006222471A (ja) * 2006-05-29 2006-08-24 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置
US7858937B2 (en) 2006-05-30 2010-12-28 Shimadzu Corporation Mass spectrometer
JP2012015191A (ja) * 2010-06-29 2012-01-19 Shinko Electric Ind Co Ltd 半導体パッケージの製造方法及び半導体パッケージ
JP2016066790A (ja) * 2014-09-16 2016-04-28 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
CN107818963A (zh) * 2016-09-14 2018-03-20 富士电机株式会社 半导体装置及半导体装置的制造方法
CN107818963B (zh) * 2016-09-14 2023-08-29 富士电机株式会社 半导体装置及半导体装置的制造方法
KR102271093B1 (ko) * 2021-01-25 2021-07-02 에스앤피티(주) 반도체 패키징용 서브스트레이트

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