JP2001345411A - リードフレームとそれを用いた半導体装置及びその生産方法 - Google Patents

リードフレームとそれを用いた半導体装置及びその生産方法

Info

Publication number
JP2001345411A
JP2001345411A JP2000162340A JP2000162340A JP2001345411A JP 2001345411 A JP2001345411 A JP 2001345411A JP 2000162340 A JP2000162340 A JP 2000162340A JP 2000162340 A JP2000162340 A JP 2000162340A JP 2001345411 A JP2001345411 A JP 2001345411A
Authority
JP
Japan
Prior art keywords
lead frame
die pad
leads
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000162340A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001345411A5 (enExample
Inventor
Koji Nose
幸之 野世
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000162340A priority Critical patent/JP2001345411A/ja
Publication of JP2001345411A publication Critical patent/JP2001345411A/ja
Publication of JP2001345411A5 publication Critical patent/JP2001345411A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2000162340A 2000-05-31 2000-05-31 リードフレームとそれを用いた半導体装置及びその生産方法 Pending JP2001345411A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000162340A JP2001345411A (ja) 2000-05-31 2000-05-31 リードフレームとそれを用いた半導体装置及びその生産方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000162340A JP2001345411A (ja) 2000-05-31 2000-05-31 リードフレームとそれを用いた半導体装置及びその生産方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2008024408A Division JP4901776B2 (ja) 2008-02-04 2008-02-04 リードフレームとそれを用いた半導体装置及びその生産方法
JP2010291888A Division JP2011066455A (ja) 2010-12-28 2010-12-28 リードフレームを用いた半導体装置

Publications (2)

Publication Number Publication Date
JP2001345411A true JP2001345411A (ja) 2001-12-14
JP2001345411A5 JP2001345411A5 (enExample) 2007-01-11

Family

ID=18666250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000162340A Pending JP2001345411A (ja) 2000-05-31 2000-05-31 リードフレームとそれを用いた半導体装置及びその生産方法

Country Status (1)

Country Link
JP (1) JP2001345411A (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3500361B2 (ja) 2001-02-14 2004-02-23 松下電器産業株式会社 リードフレーム及びその製造方法
JP3500362B2 (ja) 2001-02-14 2004-02-23 松下電器産業株式会社 樹脂封止型半導体装置及びその製造方法
US6720207B2 (en) 2001-02-14 2004-04-13 Matsushita Electric Industrial Co., Ltd. Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
JP2004134573A (ja) * 2002-10-10 2004-04-30 Renesas Technology Corp 半導体装置およびその製造方法
US6909168B2 (en) * 2001-07-23 2005-06-21 Matsushita Electric Industrial Co., Ltd. Resin encapsulation semiconductor device utilizing grooved leads and die pad
JP2006222471A (ja) * 2006-05-29 2006-08-24 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置
US7858937B2 (en) 2006-05-30 2010-12-28 Shimadzu Corporation Mass spectrometer
JP2012015191A (ja) * 2010-06-29 2012-01-19 Shinko Electric Ind Co Ltd 半導体パッケージの製造方法及び半導体パッケージ
US8193091B2 (en) 2002-01-09 2012-06-05 Panasonic Corporation Resin encapsulated semiconductor device and method for manufacturing the same
JP2016066790A (ja) * 2014-09-16 2016-04-28 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
CN107818963A (zh) * 2016-09-14 2018-03-20 富士电机株式会社 半导体装置及半导体装置的制造方法
KR102271093B1 (ko) * 2021-01-25 2021-07-02 에스앤피티(주) 반도체 패키징용 서브스트레이트

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3500362B2 (ja) 2001-02-14 2004-02-23 松下電器産業株式会社 樹脂封止型半導体装置及びその製造方法
US6720207B2 (en) 2001-02-14 2004-04-13 Matsushita Electric Industrial Co., Ltd. Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
US6984880B2 (en) 2001-02-14 2006-01-10 Matsushita Electric Industrial Co., Ltd. Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
JP3500361B2 (ja) 2001-02-14 2004-02-23 松下電器産業株式会社 リードフレーム及びその製造方法
US6909168B2 (en) * 2001-07-23 2005-06-21 Matsushita Electric Industrial Co., Ltd. Resin encapsulation semiconductor device utilizing grooved leads and die pad
US7338838B2 (en) 2001-07-23 2008-03-04 Matsushita Electric Industrial Co., Ltd. Resin-encapsulation semiconductor device and method for fabricating the same
US8193091B2 (en) 2002-01-09 2012-06-05 Panasonic Corporation Resin encapsulated semiconductor device and method for manufacturing the same
JP2004134573A (ja) * 2002-10-10 2004-04-30 Renesas Technology Corp 半導体装置およびその製造方法
JP2006222471A (ja) * 2006-05-29 2006-08-24 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置
US7858937B2 (en) 2006-05-30 2010-12-28 Shimadzu Corporation Mass spectrometer
JP2012015191A (ja) * 2010-06-29 2012-01-19 Shinko Electric Ind Co Ltd 半導体パッケージの製造方法及び半導体パッケージ
JP2016066790A (ja) * 2014-09-16 2016-04-28 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
CN107818963A (zh) * 2016-09-14 2018-03-20 富士电机株式会社 半导体装置及半导体装置的制造方法
CN107818963B (zh) * 2016-09-14 2023-08-29 富士电机株式会社 半导体装置及半导体装置的制造方法
KR102271093B1 (ko) * 2021-01-25 2021-07-02 에스앤피티(주) 반도체 패키징용 서브스트레이트

Similar Documents

Publication Publication Date Title
JP3619773B2 (ja) 半導体装置の製造方法
US6638790B2 (en) Leadframe and method for manufacturing resin-molded semiconductor device
US7109067B2 (en) Semiconductor device and method for fabricating same
US7125751B2 (en) Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions
US8420452B2 (en) Fabrication method of leadframe-based semiconductor package
EP0977251A1 (en) Resin sealed semiconductor device and method for manufacturing the same
US8981575B2 (en) Semiconductor package structure
JP2006516812A (ja) 部分的にパターン形成されたリードフレームならびに半導体パッケージングにおけるその製造および使用方法
JP2000188366A (ja) 半導体装置
JP2021027116A (ja) 半導体装置
JP2001345411A (ja) リードフレームとそれを用いた半導体装置及びその生産方法
US6692991B2 (en) Resin-encapsulated semiconductor device and method for manufacturing the same
JP2002110718A (ja) 半導体装置の製造方法
CN100568498C (zh) 半导体器件及其制造方法
JP4901776B2 (ja) リードフレームとそれを用いた半導体装置及びその生産方法
JP7460051B2 (ja) 半導体装置
US20210098358A1 (en) Semiconductor package
KR100692325B1 (ko) 반도체 장치 및 그 제조 방법
JP3153197B2 (ja) 半導体装置
JP2011066455A (ja) リードフレームを用いた半導体装置
JP4140012B2 (ja) チップ状電子部品、その製造方法及び実装構造
JP2000150725A (ja) 半導体装置およびその製造方法
CN222720429U (zh) 混合四方扁平无引线qfn和四方扁平封装qfp集成电路封装
KR100290783B1 (ko) 반도체 패키지
CN120127012A (zh) 用于制造电子组件的工艺

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060223

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20060223

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060821

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061121

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20061121

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071204

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080204

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090106

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090205

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20090313

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20090515