JP2001267451A - Wiring board with pin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pinned wiring board which is brazed at its pin junction to a pin with a highly reliable connection intensity. SOLUTION: Since a length W3 of a flange 123 of a pin 121 parallel to the major surface of a board is set to satisfy a predetermined condition, stress concentration less takes place at a brazing material between the side of the flange of the pin 121 and a junction part 11. Thus, even when an external force is applied to the pin 121, stress concentration less occurs and the brazed (joined) part is less destroyed. As a result, a high junction strength can be obtained and a pinned wiring board 100 having a highly reliable electric connection can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board with pins, and more particularly to a PGA (Pin Grid Array) for mounting and sealing electronic components such as semiconductor integrated circuit elements (ICs).
A wiring board formed mainly of an insulating material such as a resin or a ceramic like a wiring board of a type (IC package), and a plurality of pin joints (electrodes) formed on the main surface thereof are provided with pins ( The present invention relates to a wiring board to which input / output terminals are soldered.

[0002]

2. Description of the Related Art A PGA type wiring substrate (hereinafter, also simply referred to as a substrate) is provided with a large number of pad-like electrodes for bonding to an IC on one main surface and a motherboard on the other main surface. It has a number of lead pins (hereinafter simply referred to as pins) to be inserted into the provided socket. This pin has, for example, a nail shape having a shaft portion and a flange portion, and has a flange (collar) portion at its end portion (larger diameter portion than the shaft portion).
Is soldered so as to abut the pin joint of the substrate.

Conventionally, in the above-described wiring board with pins, when the bonding strength between the flange portion of the pin and the pin bonding portion is not sufficiently obtained, and the pin is pulled in the axial direction or the inclined direction, There has been a problem that the brazing material is peeled off between the brazing material and the pin joint portion or between the pin flange portion and the brazing material.

[Problems to be solved by the invention]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems in a wiring board with pins, and an object of the present invention is to provide a wiring board in which pins are soldered to a pin bonding part of a board. It is an object of the present invention to provide a pin-attached wiring board having high reliability in bonding strength with a wiring board.

[0005]

According to a first aspect of the present invention, there is provided:
A pin having a shaft portion and a flange portion, wherein the pin is provided on a main surface of the substrate, and a pin connection portion is brazed at the flange portion at the pin connection portion, and the main surface of the substrate at the flange portion of the pin; Let W1 be the length in the direction parallel to and the length of the pin joint in the direction parallel to the main surface of the substrate, and W1 and W2 satisfy the relationship of 0.7 ≦ W1 / W2 ≦ 1.0. There is provided a wiring board with pins.

Such a wiring board with pins of the present invention is
The length of the pin joint in the direction parallel to the main surface of the substrate and the length of the pin flange in the direction parallel to the main surface of the substrate are relatively close to each other. Stress concentration is less likely to occur in the brazing material between them. Therefore, even if an external force acts on the pin, stress concentration does not easily occur, and the brazed (joined) portion is not easily broken. Therefore, according to the present invention, a high bonding strength is obtained, and a wiring board with pins with high reliability of electrical connection can be formed. In this specification, the brazing material (brazing material) includes solder, and when it is referred to as solder, it refers to a brazing material having a melting point of about 450 degrees or less.

Here, if W1 / W2 <0.7,
The shape of the brazing material on the side surface of the flange of the pin, which is considered to be necessary for exhibiting sufficient bonding strength, cannot be obtained. As a result, stress concentrates on the brazing material, and the brazing material peels off when an external force acts. In the case of 1.0 <W1 / W2, the brazing material does not easily rise on the side surface of the flange portion of the pin, and the pin is easily peeled. Also preferably, 0.76 ≦
It is preferable that W1 / W2 ≦ 1.00. This is because the bonding strength becomes more sufficient.

In a second aspect of the present invention, a pin having a shaft portion and a flange portion is brazed at the flange portion to the pin joint portion provided on a main surface of a substrate having a solder resist layer. A wiring board, wherein the length of the flange portion of the pin in the direction parallel to the main surface of the substrate is W1, and the main surface of the substrate at a portion of the pin joint that is not covered by the solder resist layer. Assuming that the length in the parallel direction is W3, W1 and W3 are 0.7 ≦ W1 / W3 ≦ 1.0.
Is a wiring board with pins.

In the present invention, similarly, the length of the pin joint in the direction parallel to the main surface of the substrate and the length of the flange portion of the pin in the direction parallel to the main surface of the substrate are relatively close. Stress concentration hardly occurs in the brazing material portion between the side surface of the flange portion and the pin joint portion. Therefore, the joining strength is increased, and even if an external force acts on the pin, stress concentration hardly occurs, and the brazed (joined) portion is hardly broken. Therefore, according to the present invention, a high bonding strength is obtained, and a wiring board with pins with high reliability of electrical connection can be formed.

Here, when W1 / W3 <0.7,
The shape of the brazing material on the side surface of the flange of the pin, which is considered to be necessary for exhibiting sufficient bonding strength, cannot be obtained. As a result, stress concentrates on the brazing material, and the brazing material peels off when an external force acts. In the case of 1.0 <W1 / W3, the brazing material does not easily rise on the side surface of the flange portion of the pin, and the pin is easily peeled. Also preferably, 0.76 ≦
It is preferable that W1 / W3 ≦ 1.00. This is because the bonding strength becomes more sufficient.

In each of the above-mentioned means, it is preferable that the end face of the flange portion of the pin on the side of the pin joint is convex.
This is because a sufficient amount of brazing material can be interposed between the pin joint on the substrate side and the flange of the pin, and the joining strength can be improved. Further, the end surface may have a spherical surface as a whole of the joining surface of the flange portion. The shape of the end face may be such that a sufficient amount of brazing material can be interposed between the pin joint on the substrate side and the flange of the pin, and therefore, a convex portion (hereinafter, also referred to as a convex portion) Is preferably provided such that the entire joint surface is tapered, such as a conical shape or a pyramid shape. However, such a shape that the entire joint surface is spherical is particularly preferable from the viewpoint of manufacturing the pin. .

Further, it is not always necessary to provide the convex portion on the entire joining surface of the flange portion, but it may be provided on a part thereof.
In that case, the shape may be a cylindrical shape, a prismatic shape, or the like, instead of the tapered shape. In the case where the convex portion is provided in the joint surface portion as described above, it is preferable to dispose the convex portion at the center on the joint surface side of the flange portion.

In each of the above means, the length of the flange portion of the pin in the direction parallel to the main surface of the substrate is W1, and the length of the flange portion in the direction perpendicular to the main surface of the substrate is W4. Then
When W1 and W4 are in a relationship of 1.0 ≦ W1 / W4 ≦ 4.5, the brazing material goes up the flange portion of the pin, so that the amount of the intervening brazing material increases, so that a more sufficient joining strength is obtained. can get. Here, if W1 / W4 <1.0, it is difficult to secure an amount of brazing material for obtaining a predetermined connection strength, and if 4.5 <W1 / W4, it is difficult to secure the amount of brazing material. , Stress is likely to be applied, and sufficient connection strength cannot be obtained.

Further, when an angle between a contour line of the brazing material on the side surface of the flange portion and a main surface of the substrate is defined as θ in a section cut along a plane including the axis of the shaft portion of the pin, 25
It is preferable that the relationship of ° ≦ θ ≦ 90 ° is satisfied.

Further, if the brazing material is interposed between the flange portion of the pin and the pin joint portion without directly contacting the flange portion of the pin and the pin joint portion, sufficient strength for joining is obtained. It is particularly preferable because a bonding area for this is secured.

Further, the present invention is particularly suitable for the case where the present invention is embodied in a wiring board using a resin as an insulating material. Also PGA
A type of wiring board is exemplified as a typical one,
It is not limited to this. Further, the wiring board in the present invention also includes a wiring board in which pins are soldered to pin bonding portions, such as an interposer which is bonded to a wiring board (IC package) and forms a bonding portion with a motherboard.

In each of the above means, the length of the flange portion of the pin in a direction parallel to the main surface of the substrate, the length of the pin joint portion in the direction parallel to the main surface of the substrate, and the length of the substrate of the flange portion The length in the direction perpendicular to the main surface is the maximum length. Also, the diameter of the brazing surface of the pin joint is
When the periphery of the pin joint is covered with the solder resist, it is the diameter of the portion not covered by the solder resist layer, that is, the diameter of the opening of the solder resist.
On the other hand, the diameter of the brazing surface of the pin joint is, if the periphery of the pin joint is not covered with solder resist,
This is the outer diameter of the pin joint. In other words, it means the size of the range in which the brazing material spreads.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment of a Wiring Board with Pins of the Present Invention
Embodiments will be described in detail with reference to the drawings. FIG.
1 is a side view (FIG. 1A) of a wiring board 100 with pins according to the present invention, and an enlarged cross-sectional view (FIG.
(B)). FIG. 2 is a further enlarged view of FIG. 1B, and FIG. 3 is an enlarged view of FIG. The wiring board 100 with pins is rectangular in plan view (each about 50 mm in length and width, and about 1 m in thickness).
m), and is mainly composed of a resin substrate 101 having a structure in which a plurality of resin insulating layers mainly composed of epoxy resin and a large number of internal wiring layers made of copper are laminated on a core substrate (about 0.8 mm). On the upper main surface 103, a large number of electrodes (not shown) for connecting a semiconductor integrated circuit element IC to be mounted are formed, and the internal wiring layers of the respective layers (not shown) are connected to each other. Are formed. A large number of circular conductor layers (copper) connected to vias in a plan view, for example, are formed on the lower main surface 104, and the surface thereof is nickel-plated and gold-plated to form a pin joint 111.

The upper and lower main surfaces 103 and 104 of the substrate 101 are covered with a solder resist layer 115 made of epoxy resin having a thickness of about 20 μm so as to cover substantially the entire surface.
m. However, in the present embodiment, the solder resist layer 115 is formed so as to cover the periphery of the surface of the pin joint 111 with a predetermined width and to be opened so as to concentrically expose the portion near the center of the pin joint 111. . In this example, the length D1 of the pin joint (conductor layer) 111 is set to about 1.5 mm, and the exposed portion thereof (the opening of the solder resist layer 115, that is, the pin joint is covered with the solder resist layer). The length W3 in the direction parallel to the main surface of the substrate (the portion not shown), that is, the diameter of the brazing surface is
It is set to 1.30 mm. Here, the length W3 of the pin joint in the direction parallel to the main surface of the substrate corresponds to the length W2 of the pin joint in the direction parallel to the main surface of the substrate.

On the other hand, the pin 121 joined in this embodiment has a round bar-shaped shaft portion (diameter of about 0.45 mm) 122 made of an iron-nickel alloy such as Kovar or 42 alloy or a copper alloy. It has a nail shape (total length about 3.18 mm). A circular flange 123 protruding in the radial direction is provided concentrically at the upper end, and nickel plating and gold plating are applied to the surface. However, the joining surface 124 of the flange portion 123 facing the pin joining portion 111 is formed in a spherical shape that is entirely convex, is disposed so as to abut on the pin joining portion 111 concentrically, and has an appropriate amount of solder 131. Soldered. The solder 131 has a composition having a melting point higher than the soldering temperature of the semiconductor integrated circuit element IC (for example, Sn 95%
/ Sb5%).

In this embodiment, the flange 1 of the pin 121 is used.
The outside diameter (length in the direction parallel to the main surface of the substrate) W1 of the substrate 23 is
1.1 mm, and the relationship between the length W3 (diameter of the opening of the solder resist layer 115) in the direction parallel to the main surface of the substrate of the pin joint portion is W1 / W3 = 0.85. Also,
The joining surface 124 that contacts the pin joining portion 111 is, for example, approximately 0.55 mm in R-sphere, and the total thickness of the flange portion 123 (the maximum length W4 of the pin flange portion in the direction parallel to the main surface of the substrate) is 0. .3
4 mm. That is, W1 / W4 = 2.94. The gold plating layer on the surface of the pin 121 is
0.04 μm or more (0.3 μm in this embodiment)
Then, the oxidation resistance and the reliability of connection with a socket or the like can be improved.

As shown in FIG. 3, the solder (brazing material) 13 when cut along a plane including the axis G of the shaft portion 122 is formed.
1 is substantially linear, and the angle between the main surface 104 of the substrate 101 and the contour S is θ, that is, the axis G of the shaft 122 of the pin. In the present embodiment, when the angle between the contour line of the brazing material on the side surface of the flange portion and the main surface of the substrate is θ, a setting is made such that θ = 74 degrees. . As described above, the solder (brazing material) conditions are sufficient for securing the joining strength between the pin flange and the pin joint.
The pin flange 123 and the pin joint 111 are not directly in contact with the pin flange 123 and the pin joint 111.
And the brazing material 123 of the pin and the pin joining portion 111 are joined. The pin collar 12
It is preferable from the viewpoint of securing the joining area that the pin joining portion 111 and the pin joining portion 111 do not directly contact each other. However, the present invention is not limited to this. May be in direct contact.

The solder 1 joining the pins 121
Since 31 is not attached to the shaft portion 122, there is no hindrance when the IC 121 is mounted and sealed to form a semiconductor device, and then the pins 121 are inserted and set in sockets of a motherboard (not shown). . Also, the solder 131
Is that the wetting spread end 131a of the wax exceeds the outermost peripheral edge 127 on the opposite surface 126, that is, the intersection ridge of the side surface 125 and the opposite surface 126 in the present embodiment, and is an amount sufficient for securing the bonding strength. I have. In the present embodiment,
The solder 131 extends beyond the outermost peripheral edge 127 of the flange portion and spreads in the direction of the shaft portion 122 of the pin, but is not limited to this, and stops at the side surface 125 up to near the outermost peripheral edge 127 of the flange portion. Is also good.

[0024]

Here, specific examples of the wiring board with pins of the present invention will be described together with comparative examples. The pin of the present invention made of Kovar described in FIGS. 1 to 3 (length of the flange portion of the pin in the direction parallel to the main surface of the substrate: 1.1 mm, total length of about 3.18 m)
m, diameter of shaft: 0.45 mm, thickness of collar of pin:
0.34 mm, the whole of the flange portion of the pin on the pin joint side was spherical. ) Was designated as Sample No. 1. As a comparative example, only the length of the flange portion of the pin in the direction parallel to the main surface of the substrate was 0.89.
mm, a pin similar to that of sample No. 1 was used as sample No. 2, and the length of the pin flange in the direction parallel to the main surface of the substrate was 0.89 mm. The whole was a flat surface substantially parallel to the main surface of the pin joint (main surface of the substrate), and the other pins were the same as Sample No. 1 as Sample No. 3. A sample having a large number of pins, in which pins of sample Nos. 1 to 3 are brazed to a pin joint having a length of 1.30 mm in a direction parallel to the main surface of the substrate not covered with the solder resist layer. Three substrates were prepared, and the bonding strength of ten pins on each sample substrate was confirmed.

The bonding strength is 3 with respect to the axial direction of the pin.
This is the breaking load of the solder or the breaking load in the vicinity of the solder joint when pulled in the direction inclined at 0 degrees. The results are as shown in Table 1. About joining strength (kg)
The average value of 30 pieces is ave, the maximum value is max, and the minimum value is m
In is shown as each. In the condition (A), the pin is brazed to the pin joint, and in the condition (B), after the pin is brazed to the pin joint, a maximum of 22
At 0 ° C, hold at 190 ° C or higher for 60 seconds, for a total of about 1
After heating for 0 minutes three times, under the condition (C), after the pin is brazed to the pin joint, at a maximum of 220 ° C.
After holding at 190 ° C. or higher for 60 seconds and heating for a total of about 10 minutes three times, the T / S (from −55 ° C. to 1
This is a measured value of the bonding strength in a state after 100 cycles of (25 minutes of temperature cycle for 10 minutes).

[0026]

[Table 1]

As shown in Table 1, in the case of sample No. 1, the bonding strength was 5.times.
It was more than 00 kg. On the other hand, sample No. 2 had an average value of about 3.00 kg. Sample No. 3 had an average value of 3.0 under condition (B).
It fell below 0 kg. Therefore, as in the present invention, by increasing the length of the pin flange in the direction parallel to the main surface of the substrate, the joining strength between the pin flange and the pin joint can be significantly improved. You can see that. Further, it is found that it is preferable that the whole of the flange portion of the pin on the side of the pin joint is spherical because the joint strength is improved as compared with a flat surface.

Now, the method of joining the pins 121 will be described in detail as follows. However, the length of the flange portion of the pin in the direction parallel to the main surface of the substrate, and the portion of the pin joint portion not covered by the solder resist layer, There is no difference from the conventional method of manufacturing a wiring board with pins, except that pins having a predetermined relationship with the plane and the length in the parallel direction are joined. The amount of solder is preferably set so that the end 131a of the spread solder is located at the middle of the opposite surface 126 of the flange in the radial direction. Depending on the diameter of the pin joint (the brazing surface that is the opening when solder resist is coated), the diameter and thickness of the flange, and the shape and size of the convex part on the joint surface side, It can be set by soldering while adjusting the amount so that the wet spread end is at a desired position.

The internal wiring layer of the substrate 101 (before joining the pins) before the pin joining is formed by a subtractive method using copper plating, a semi-additive method, a full additive method, or the like. The resin insulating layer may be formed by laminating a resin that has been made into a film in advance on the surface of the core substrate or the lower substrate, or by applying a liquid resin with a roll coater or the like. The via formation of the resin insulating layer may be performed by laser processing if the material is a non-photosensitive resin, or may be formed by photolithography technology if the material is a photosensitive resin. May be dawn.

Thereafter, for example, a photosensitive solder resist layer is applied by using a photolithography technique, and is exposed, developed and cured by using a mask pattern formed so that the center of the pin joint 111 is opened. A layer 115 is formed. Thereafter, nickel plating and gold plating are applied to the exposed metal portion such as the pin joint portion, and the above-described amount of solder paste is printed on the pin joint portion 111 by screen printing.

On the other hand, a predetermined plate-like jig (not shown) provided with a number of small holes through which the pins 121 can be inserted, corresponding to the arrangement of the pin joint portions 111 of the substrate 101, is used. Nickel-plated and gold-plated pins 121
Is inserted with the flange 123 up. Next, the substrate 101 is positioned and mounted thereon, and each pin joint 1
11 is set so that the joint surface 124 of the flange portion of the pin 121 abuts, and the solder paste is heated and melted. By doing so, the large number of pins 121 are soldered to the pin joint 111 at once. Thus, the wiring board of the present invention is manufactured.

The joining surface 1 of the flange 123 of the pin 121
It is not always necessary to form the spherical portion of the convex portion 24 from the same material as the pin main body, and the solder having a melting point that does not melt at the soldering temperature of the pin is reflowed to form a spherical shape (welding). ). Such a pin can be easily manufactured using a nail-shaped pin having a flange (head) having a flat end as a material. The flange portion 123 of the pin 121 of the present embodiment is a mold having a spherical shape in which one end of a shaft material (wire) is concave corresponding to a spherical surface forming a convex portion, and is pressed in the axial direction. Can be formed.

Also, a solder for soldering the pins.
May be selected from those that do not melt at the soldering temperature of electronic components such as ICs, depending on the material of the wiring board and the like. For example, in a resin wiring board, Pb
-Sn-based solder (37Pb-73Sn eutectic solder, 50
Pb-50Sn solder, 82Pb-10Sn-8Sb solder, etc.), Sn-Ag based solder (96.5Sn-3.5)
Ag-based solder, etc.), Sn-Sb-based solder (95Sn-5)
Sb solder) and the like. In the case of a ceramic wiring board, a silver brazing material such as Ag-Cu, Au-S
i, Au-Sn, Au-Ge and other gold-based brazing materials, 95Pb
High temperature solder such as -5Sn and 90Pb-10Sn.

The planar shape of the pin joint and the shape of the flange viewed from the axial direction of the pin are usually circular as in the present embodiment, but the shape is not limited to a circle. Further, the joining surface on the tip end side of the flange does not need to be entirely spherical as in the above embodiment. As shown by a two-dot chain line in FIG. 2, a part of the flat joint surface 224 may be formed as a convex spherical surface 225. As described above, a convex polyhedron may be used instead of a spherical shape, or a convex portion such as a tapered cone or a column that can increase the amount of solder interposed between the pin joint and the flange portion may be used. In addition, making the soldering surface,
More preferably, the joining surface of the flange portion is roughened so as to increase the joining area.

The end face of the flange portion of the pin is preferably convex or spherical, but is not limited to this. The length of the pin joint portion in the direction parallel to the main surface of the substrate is smaller than that of the pin. It is sufficient that the length in the direction parallel to the main surface of the substrate has a predetermined relationship. For example, the flange of the pin may be a flat surface that is substantially parallel to the main surface of the pin joint (the main surface of the substrate).

Next, another embodiment of the present invention will be described with reference to FIG. However, in this embodiment, the pin joint 21
1 is not covered with the solder resist layer 215. That is, before pinning, the pin joint 2
Reference numeral 11 indicates a state where the solder resist layer 215 is completely exposed in the opening. There is no essential difference from the above-described embodiment, only the difference is that the pin flange portion 123 is brazed to the pin joint portion 211 via the brazing material 231. Therefore, only the differences will be described, and the same portions will be denoted by the same reference numerals.

In the present embodiment, the brazing material 231 spreads only at a portion in contact with the pin joint 211. The length of the pin flange 123 in the direction parallel to the main surface of the substrate is W1 (1.2 mm in this case), and the pin joint 2
Assuming that the length of the substrate 11 in the direction parallel to the main surface is W2 (1.30 mm in this case), these relations are expressed as W1 /
W2 = 0.92. That is, W1 and W2
Are in a relationship of 0.7 ≦ W1 / W2 ≦ 1.0, and have the same effect as the above-described embodiment. Here, since the length W2 in the direction parallel to the main surface of the substrate of the pin bonding portion corresponds to a portion not covered by the solder resist layer, the main surface of the substrate of the pin bonding portion according to claim 2 is referred to. It also corresponds to the length W3 in the parallel direction.

In the above description, the wiring board with pins is embodied as a PGA type epoxy resin wiring board, but the board of the present invention is embodied irrespective of the material of the board such as polyimide resin, BT resin and PPE resin. It goes without saying that you can do it. Also, the core substrate is made of metal,
The present invention can be applied to a wiring substrate having a so-called metal core substrate or a so-called coreless wiring substrate without a core substrate. The present invention can be applied not only to the wiring board made of resin but also to a wiring board made of ceramic or glass ceramic, and impregnated with the above-mentioned resin into an organic fiber such as glass-resin (epoxy resin, BT resin). The present invention can also be applied to a wiring board made of a composite material such as a composite material. Further, the present invention can be applied regardless of the material of the substrate and regardless of the single-layer or multilayer structure. Further, the present invention is not limited to the PGA type, but can be widely embodied in a wiring board in which lead pins are brazed to pin joints, and is not limited to the above-described embodiment, and is not limited to the gist thereof. It can be embodied by appropriately changing the design.

[0039]

As is apparent from the above description, according to the present invention, since the length of the pin flange in the direction parallel to the main surface of the substrate satisfies a predetermined condition, the pin is joined to the side of the pin flange. Stress concentration is less likely to occur in the brazing material between the portions.
Therefore, even if an external force acts on the pin, stress concentration hardly occurs, and the brazed (joined) portion is hardly broken. Therefore, according to the present invention, a high bonding strength is obtained, and a wiring board with pins with high reliability of electrical connection can be formed.

Further, since the end surface of the pin flange on the pin joint side is convex, a sufficient amount of brazing can be interposed between the pin joint on the substrate side and the flange of the pin. The bonding strength can be improved. Further, in the case where the convex portion has a spherical joint surface as a whole, a sufficient amount of solder is interposed between the pin joint portion on the substrate side and the flange portion of the pin. And connection strength is improved.

Further, as described above, the wiring board of the present invention can be applied to boards made of any material such as ceramic and resin, but the effect is particularly great when the present invention is embodied of a resin. This is because, as described above, since the resin wiring board is forced to use low-melting solder for brazing the pins, the joining strength of the pins tends to be particularly low, but according to the present invention, This is because even when such solder is used, the bonding strength can be surely increased.

[Brief description of the drawings]

FIG. 1 is a partially cutaway side view of a first embodiment of a wiring board with lead pins according to the present invention, and an enlarged view of a main part thereof (pin bonding structure).

FIG. 2 is an enlarged view of an enlarged sectional view of FIG.

FIG. 3 is an enlarged view of FIG. 2;

FIG. 4 is an enlarged cross-sectional view of a main part of another embodiment of the pin bonding structure of the wiring board with lead pins according to the present invention.

[Explanation of symbols]

100 Wiring board with pins 101 Substrate 103, 104 Main surface of substrate 111 Pin joint 115 Solder resist layer 121 Pin 122 Pin shaft 123 Pin flange 124 Joint of flange (convex) 126 Opposite flange Surface 127 Outermost peripheral edge on opposite surface of flange 131 Row (solder) 131a Wet and spread end of lead to tip side of lead pin W1 Length of flange of pin in direction parallel to main surface of substrate W2, W3 Pin joint W4 The length in the direction parallel to the main surface of the substrate W4 The length of the flange in the direction perpendicular to the main surface of the substrate G The axis of the shaft of the lead pin S The contour line outside the cut surface of the row θ Angle made with contour line S

Continued on the front page (72) Inventor Mitsuo Shiraishi 14-18 Takatsuji-cho, Mizuho-ku, Nagoya F-term in Japan Special Ceramics Co., Ltd. 5E319 AA03 AB03 CC22 5F067 AA05 AB07 BC01 BC12

Claims (4)

[Claims] 1. A pinned wiring board in which a pin having a shaft portion and a flange portion is brazed to a pin joint provided on a main surface of the substrate at the flange portion, wherein the pin has a flange portion. The length parallel to the main surface of the substrate is W
1. A pin characterized in that W1 and W2 have a relationship of 0.7 ≦ W1 / W2 ≦ 1.0, where W2 is the length of the pin joint in the direction parallel to the main surface of the substrate. With wiring board. 2. A wiring board with pins, wherein a pin having a shaft portion and a flange portion is brazed at a flange portion to a pin joint portion provided on a main surface of a substrate having a solder resist layer, The length of the flange portion in the direction parallel to the main surface of the substrate is W
1. Assuming that the length of the portion of the pin joint not covered with the solder resist layer in the direction parallel to the main surface of the substrate is W3, W1 and W3 are 0.7 ≦ W1 / W3 ≦ 1. 2.0, wherein the wiring board has pins. 3. The pin-equipped wiring board according to claim 1, wherein an end surface of the flange portion of the pin on a side of the pin joint is convex. 4. An end surface of the flange portion of the pin on the side of the pin joint portion has a spherical shape.
The wiring board with pins according to any one of the above.