JP2001267278A5 - - Google Patents
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- JP2001267278A5 JP2001267278A5 JP2000073307A JP2000073307A JP2001267278A5 JP 2001267278 A5 JP2001267278 A5 JP 2001267278A5 JP 2000073307 A JP2000073307 A JP 2000073307A JP 2000073307 A JP2000073307 A JP 2000073307A JP 2001267278 A5 JP2001267278 A5 JP 2001267278A5
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Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000073307A JP4257816B2 (ja) | 2000-03-16 | 2000-03-16 | 廃液回収機構付ウェーハ表面処理装置 |
TW089113882A TW504776B (en) | 1999-09-09 | 2000-07-12 | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
SG200004814A SG93257A1 (en) | 1999-09-09 | 2000-08-25 | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
SG200204723-1A SG138436A1 (en) | 1999-09-09 | 2000-08-25 | Wafer surface treatment apparatus |
US09/650,367 US6672318B1 (en) | 1999-09-09 | 2000-08-29 | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
ES00119294T ES2394942T3 (es) | 1999-09-09 | 2000-09-06 | Aparato de sujeción rotatoria de oblea |
EP00119294A EP1083589B1 (en) | 1999-09-09 | 2000-09-06 | Wafer rotary holding apparatus |
US10/700,546 US6810888B2 (en) | 1999-09-09 | 2003-11-05 | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000073307A JP4257816B2 (ja) | 2000-03-16 | 2000-03-16 | 廃液回収機構付ウェーハ表面処理装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001267278A JP2001267278A (ja) | 2001-09-28 |
JP2001267278A5 true JP2001267278A5 (hu) | 2007-01-25 |
JP4257816B2 JP4257816B2 (ja) | 2009-04-22 |
Family
ID=18591567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000073307A Expired - Lifetime JP4257816B2 (ja) | 1999-09-09 | 2000-03-16 | 廃液回収機構付ウェーハ表面処理装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4257816B2 (hu) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3734154B2 (ja) * | 2001-07-11 | 2006-01-11 | 東京エレクトロン株式会社 | 液処理装置及びその方法 |
WO2004070807A1 (ja) * | 2003-02-03 | 2004-08-19 | Personal Creation Ltd. | 基板の処理装置及び基板の処理方法 |
JP4293830B2 (ja) * | 2003-05-12 | 2009-07-08 | 葵精機株式会社 | 基板処理装置およびその処理方法 |
KR100752246B1 (ko) | 2005-03-31 | 2007-08-29 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
JP4791068B2 (ja) * | 2005-03-31 | 2011-10-12 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4504859B2 (ja) * | 2005-03-31 | 2010-07-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR101316769B1 (ko) * | 2005-04-01 | 2013-10-15 | 티이엘 에프에스아이, 인코포레이티드 | 하나 이상의 처리 유체를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는데 이용되는 장치용 배리어 구조 및 노즐 장치 |
JP4676272B2 (ja) * | 2005-07-26 | 2011-04-27 | 株式会社 エイ・エス・エイ・ピイ | 基板処理装置 |
KR100637719B1 (ko) | 2005-10-05 | 2006-10-25 | 세메스 주식회사 | 기판 처리 장치 |
KR101191337B1 (ko) | 2006-07-07 | 2012-10-16 | 에프에스아이 인터내쇼날 인크. | 하나 이상의 처리 유체로 마이크로일렉트로닉 워크피스를 처리하는데 사용되는 장치용 배리어 구조물 및 노즐장치 |
KR100757911B1 (ko) | 2006-08-22 | 2007-09-12 | (주)이노맥스 | 웨이퍼의 액처리장치 |
WO2009020524A1 (en) | 2007-08-07 | 2009-02-12 | Fsi International, Inc. | Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses |
KR101690047B1 (ko) | 2008-05-09 | 2016-12-27 | 티이엘 에프에스아이, 인코포레이티드 | 개방 동작 모드와 폐쇄 동작 모드사이를 용이하게 변경하는 처리실 설계를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는 장치 및 방법 |
JP5084639B2 (ja) | 2008-06-30 | 2012-11-28 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
KR101592058B1 (ko) | 2010-06-03 | 2016-02-05 | 도쿄엘렉트론가부시키가이샤 | 기판 액처리 장치 |
JP5242632B2 (ja) * | 2010-06-03 | 2013-07-24 | 東京エレクトロン株式会社 | 基板液処理装置 |
JP2011254019A (ja) * | 2010-06-03 | 2011-12-15 | Tokyo Electron Ltd | 基板液処理装置 |
TWM505052U (zh) * | 2015-01-22 | 2015-07-11 | Scientech Corp | 流體製程處理裝置 |
US10679862B2 (en) | 2016-04-21 | 2020-06-09 | Mimasu Semiconductor Industry Co., Ltd. | Contactless electric power supply mechanism and method for rotary table, and wafer rotating and holding device |
WO2017204082A1 (ja) | 2016-05-24 | 2017-11-30 | 三益半導体工業株式会社 | 回転テーブル用ウェーハ保持機構及び方法並びにウェーハ回転保持装置 |
JP6837481B2 (ja) | 2016-05-26 | 2021-03-03 | 三益半導体工業株式会社 | 回転テーブル用ウェーハ加熱保持機構及び方法並びにウェーハ回転保持装置 |
TWI638394B (zh) | 2016-07-25 | 2018-10-11 | 斯庫林集團股份有限公司 | 基板處理裝置 |
JP6799409B2 (ja) * | 2016-07-25 | 2020-12-16 | 株式会社Screenホールディングス | 基板処理装置 |
KR102174762B1 (ko) * | 2018-11-28 | 2020-11-05 | 세메스 주식회사 | 기판 처리 장치 |
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2000
- 2000-03-16 JP JP2000073307A patent/JP4257816B2/ja not_active Expired - Lifetime