JP2001217545A - Multilayer circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer circuit board which can avoid the migration between terminal electrodes and effectively suppress a stray capacitance from occurring near the terminal electrodes. SOLUTION: The multilayer circuit board comprises silvery conductor films for forming inner wiring patterns 2 between insulation layers 1a-1e on a laminate board 10 composed of laminated glass-ceramic insulation layers, land electrodes 7a-7f formed to be connected to the inner wiring patterns 2 between the insulation layers 1a-1e, and semicircular terminal electrodes 6 formed on the end faces of the laminate board 10 so as to expose a part of the land electrodes 7a-7f. Connecting patterns 8a-8f are formed at positions mutually shifted between the adjacent insulation layers in the laminate thickness direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an end terminal electrode of a multilayer circuit board using a glass-ceramic substrate material as an insulating layer and a conductive material such as silver for an internal wiring pattern.

[0002]

2. Description of the Related Art Conventionally, a firing temperature of 800 to 1050 has been used.
A multilayer circuit board using a material that can be fired at a relatively low temperature of ° C. has been proposed.

[0003] A typical structure of such a multilayer circuit board has an internal wiring pattern between each layer of a laminated substrate comprising a plurality of insulating layers, and at the same time, connects a predetermined internal wiring pattern in the thickness direction of the laminated substrate. It has a via-hole conductor, and a surface wiring pattern for mounting an IC chip and various chip-shaped electronic components is formed on the surface of the laminated substrate.

In such a multilayer circuit board, a low-resistance material such as silver can be used as a material for the wiring pattern, so that the conductivity of a predetermined circuit network can be increased. This makes it relatively easy to increase the speed of the circuit operation and deal with high-frequency operation.

[0005] Usually, the multilayer circuit board is connected to a predetermined wiring (external circuit) mounted on a printed wiring board. Specifically, input / output terminal electrodes are formed on the joint bottom surface of the multilayer circuit board, or flat planar terminal electrodes are formed on the end face of the multilayer circuit board, and are connected via solder or the like. Furthermore, after forming input / output terminal electrodes on the surface of the multilayer circuit board and mechanically joining (mounting) the printed wiring board, bonding between the input / output terminal electrodes on the front side and predetermined wiring of the printed wiring board is performed. They were connected via wires.

In recent years, there has been an increasing demand for miniaturization of a multilayer circuit board, and accordingly, a bonding structure with an external printed wiring board has been increased.
A semicircular recess extending in the thickness direction is formed on an end face of the multilayer circuit board, and an inner wall conductive film that is electrically connected to a land electrode connected to the internal wiring pattern is formed on an inner wall surface of the semicircular recess. Hereinafter, such a structure is simply referred to as a semicircular terminal electrode.

The multilayer circuit board and the printed wiring board are mechanically and electrically joined to each other by soldering the semicircular terminal electrodes to each other (Japanese Patent Laid-Open No. 9-3).
No. 30991). Thus, when the multilayer circuit board and the printed wiring board are joined via solder, the solder rising portion (meniscus) is formed in the semicircular terminal electrode that is recessed inward from the end face of the multilayer circuit board. As a result, a multilayer circuit board having a small mounting area on a printed wiring board is achieved.

FIG. 4 is a perspective view of a circular terminal electrode portion of a conventional multilayer circuit board.

In FIG. 4, 1 is a multilayer circuit board,
1a to 1e are insulating layers, 61 is a semicircular terminal electrode, 71a to 71f are land electrodes, and 81a to 8l.
Reference numeral 1f denotes a connection portion connected to a predetermined wiring pattern.

[0010]

However, the semicircular terminal electrode 61 of the multilayer circuit board 1 has a conductive film 61b formed on the inner surface of the concave portion 61a. Land electrodes 71a to 7a
Both ends of 1f were exposed.

When a plurality of semicircular terminal electrodes 61 are arranged on the end face of the multilayer circuit board 1, the exposed portions of both ends of the land electrodes 71a to 71f in the adjacent terminal electrodes 61 are close to each other. become. As a result, when soldering is performed on the printed wiring board, there is a problem that migration occurs between the exposed portions.

Further, the connection pattern for connecting the land electrode and the internal wiring pattern is opposed to each other with an insulating layer interposed therebetween, and a stray capacitance component is generated therebetween. May have adverse effects.

The present invention has been devised in view of the above-mentioned problems, and an object of the present invention is to provide a terminal electrode structure that can prevent migration between semicircular terminal electrodes and that causes little deterioration in high-frequency characteristics due to stray capacitance. And a circuit board having the same.

[0014]

According to the present invention, there is provided a multi-layer circuit board comprising insulating layers made of a glass-ceramic material which can be fired at 800 ° C. to 1050 ° C.
A multilayer circuit board comprising an Ag-based internal wiring pattern and a land electrode, a semicircular recess formed in an end face of the multilayer circuit board, and a part of the land electrode exposed on an inner wall of the recess. In the above, while forming a connection pattern for connecting the land electrode and the internal wiring pattern between the insulating layers, when each of the connection patterns in plan view,
A multilayer circuit board, which is formed at different positions between insulating layers adjacent to each other in a lamination thickness direction.

Preferably, the land electrode is a multilayer circuit board disposed at least 100 μm or more inside from the end face of the multilayer circuit board.

In the multilayer circuit board of the present invention, the formation positions of the connection patterns between the land electrodes and the internal wiring patterns are different between the adjacent insulating layers in the lamination thickness direction. For this reason, the stray capacitance component generated between the connection patterns adjacent to each other in the stacking thickness direction can be suppressed.

Thus, in a circuit that performs high-frequency operation, fluctuations in high-frequency characteristics can be prevented, and stable circuit operation can be performed.

Further, both ends of the land electrode constituting the semicircular terminal electrode are arranged so as to be located inside from the end face of the substrate. That is, although the land electrode is exposed in the semicircular concave portion, both ends are never exposed from the end surface of the laminated substrate.

Accordingly, migration does not occur between adjacent semicircular terminal electrodes of the multilayer circuit board. In order to completely prevent this migration, it is important that both ends be allowed to escape from the end face of the laminated substrate by 100 μm or more to the inside in consideration of the displacement of the lamination position.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a multilayer circuit board according to the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of a multilayer circuit board according to the present invention, and FIG. 2 is a perspective view of a semicircular terminal electrode portion.

In FIG. 1, reference numeral 1 denotes a multilayer circuit board;
10 is a laminated substrate, 1a to 1f are insulating layers, 6
Is a semicircular terminal electrode, 7a to 7f are land electrodes, and 8a to 8f are connection patterns (connection portions) connected to a predetermined wiring pattern. 2 is an internal wiring pattern, 3 is a via hole conductor, 4 is a surface wiring pattern formed on the surface of the laminated substrate 10, and 5 is an electronic component element.

The laminated board 10 constituting the multilayer circuit board 1
Are insulating layers 1a to 1e made of a glass-ceramic material.
In addition, between each of the insulating layers 1a to 1e, an internal wiring pattern 2 for achieving a predetermined circuit network and generating a capacitance component is arranged. In the insulating layers 1a to 1e, via-hole conductors 3 penetrating in the thickness direction of the layers are formed.

The insulating layers 1a to 1e are, for example, 850 to 10
Glass that can be fired at a relatively low temperature of around 50 ° C
Made of ceramic material. Specific examples of the ceramic material include cristobalite, quartz, corundum (α-alumina), mullite, and cordierite. Further, by firing a glass frit containing a plurality of metal oxides as a glass material, cordierite,
It precipitates at least one kind of crystal of mullite, anorthite, serdian, spinel, garnite, willemite, dolomite, petalite or a substituted derivative thereof. The thickness of the insulating layers 1a to 1e is, for example, 100 to
It is about 300 μm.

Internal wiring pattern 2, via hole conductor 3
Is composed of a conductor film (conductor) mainly composed of a silver-based material (silver alone or a silver alloy such as Ag-Pd). For example,
The internal wiring pattern 2 has a thickness of about 8 to 15 μm, and the via-hole conductor 3 can have an arbitrary diameter, for example, 80 to 250 μm.

A surface wiring pattern 4 is formed on the surface of the laminated substrate 10. This surface wiring pattern 4
Is made of, for example, a conductor material mainly containing a silver-based material. The surface wiring pattern 4 forms a predetermined circuit network and is a connection pad for bonding an electronic component element 5 bonded via solder, or a terminal electrode of a thick film resistor film or a thick film capacitor element. Or a connection with the via-hole conductor 3. Also, an electronic component element such as an IC chip mounted on the surface of the laminated substrate 10
It may be a connection pad connected to 5 by a bonding thin wire.

On the surface of such a laminated substrate 10, an electronic component element 5 of an IC chip or each chip component is arranged.

A semicircular terminal electrode 6 is formed on the end face of the laminated substrate 10. This semicircular terminal electrode 6
Are concave portions 6 on a semi-cylinder formed on the end face of the laminated substrate 10.
a, and a conductive film 6b adhered to the inner wall surface of the concave portion 6a
It is composed of

The connection between the conductor film 6b of the semicircular terminal electrode 6 and the wiring patterns 2 and 4 is made by connecting the land electrodes 7a to 7f formed around the recess 6a with the wiring patterns 2 and 4, as shown in FIG. The connection patterns 8a to 8f are connected to the connection patterns 2 and 4.

Here, both end portions of the land electrodes 7a to 7f are arranged so as to enter at least 100 μm from the end surface of the laminated substrate 10 and are not exposed at all from the end surface of the laminated substrate 10.

The semi-cylindrical concave portion 6a constituting the semi-circular terminal electrode 6 has an opening width of 100 μm or more.

Here, the land electrode 7a constituting the semicircular terminal electrode 6 is a land electrode formed on the surface of the laminated substrate 10, and the connection pattern 8a is connected to the surface wiring pattern 4. is there.

The land electrode 7b is a land electrode formed between the layers of the insulating layers 1a and 1b constituting the laminated substrate 10, and the connection pattern 8b is formed of the internal wiring pattern 2 formed between the layers. Is to connect.

Further, the land electrode 7c is connected to the laminated substrate 10
Is a land electrode formed between the layers of the insulating layers 1b and 1c, and the connection pattern 8c is connected to the internal wiring pattern 2 formed between the layers.

Similarly, the land electrodes 7d and 7e are provided between the insulating layers 1c and 1d of the laminated substrate 10 and between the insulating layers 1c and 1d.
land electrodes formed between the layers d and 1e,
The connection patterns 8d and 8e connect to the internal wiring patterns 2 formed between the layers.

The land electrodes 7a and 7f and the connection patterns 8a and 8f have substantially the same structure as the surface wiring pattern 4 and are formed in the same step. The land electrodes 7b to 7e and the connection patterns 8b to 8 have substantially the same structure as the internal wiring pattern 2 disposed between the insulating layers 1a to 1f, and are formed in the same step.

Here, in the multilayer circuit board of the present invention, the connection patterns 8b to 8e for connecting the land electrodes 7b to 7e to the internal wiring patterns 2 arranged between the corresponding insulating layers.
(Substantially a part of the internal wiring pattern 2) is formed in the adjacent insulating layers 1a and 1b, 1b and 1c, 1c and 1
are formed at different positions from each other.

Preferably, adjacent connection patterns 8b
Ideally, as shown in FIG. 2, No. to 8 e do not face each other in the thickness direction of the insulating layer.

Further, as described above, both ends of the land electrodes 7a to 7f formed inside and on the surface of the laminated substrate 10 are arranged so as to enter the inner side from the end face of the laminated substrate 10 by 100 μm or more.

First, since the connection patterns 8b to 8e arranged in the thickness direction are displaced from each other, the generation of the stray capacitance generated in the thickness direction of the adjacent connection patterns 8b to 8e can be reduced.

In particular, in a wiring pattern constituting a circuit operating at a high frequency, the tip of the circuit is connected to the same potential. However, as the capacitance is further away from the same potential, the characteristic of the high frequency operation increases as the distance increases. fluctuate.

In the description, the connection patterns 8a and 8f formed on the surface of the laminated substrate 10 are not described in detail. However, when it is necessary to form the connection patterns 8a and 8f on the surface, as shown in FIG. , Connection patterns 8a and 8b,
It is important to form 8e and 8f at different positions.

As described above, the land electrodes 7a to 7f are
Since the part exposed to a is covered with the conductor film 6b, even if the land electrodes 7a to 7f face each other in the stacking thickness direction, the stray capacitance component generated at this part does not greatly affect the high frequency characteristics. Absent.

It is important that the electrode width of the land electrodes 7a to 7f (the distance from the concave portion 6a to the inside) is substantially 100 μm or less in order to reduce the influence of unnecessary capacitance. If the electrode width exceeds this value,
As a result, the stray capacitance component cannot be ignored in the high-frequency circuit.

A method for manufacturing such a multilayer circuit board will be described.

First, green sheets to be the insulating layers 1a to 1e made of a glass-ceramic material are formed. Specifically, a ceramic powder, a frit of a low-melting glass component, an organic binder, and a slurry obtained by homogeneously kneading an organic solvent are tape-formed to a predetermined thickness by a doctor blade method, and cut into a predetermined size to form a sheet. .

The ceramic powder includes insulating ceramic materials such as cristobalite, quartz, corundum (α-alumina), mullite, cordierite, BaTiO ₃ , Pb ₄ Fe
₂ Dielectric ceramic materials such as NbO ₁₂ and TiO ₂ , Ni
Magnetic ceramic materials such as -Zn ferrite and Mn-Zn ferrite (ceramics in a broad sense) and the like, and pulverized to an average particle size of 1.0 to 6.0 m, preferably 1.5 to 4.0 m. Use what was done. still,
Two or more ceramic materials may be used in combination.
In particular, the use of corundum is advantageous in terms of cost.

The frit of the low melting glass component precipitates a crystal phase of cordierite, mullite, anorthite, serdian, spinel, garnite, willemite, dolomite, petalite or a substituted derivative thereof or a crystal phase having a spinel structure by firing. Any material may be used, for example, glass frit containing B ₂ O ₃ , SiO ₂ , Al ₂ O ₃ , ZnO, and alkaline earth oxide.

Since such a glass frit has a wide vitrification range and a sag point of about 600 to 800 ° C., it is suitable for firing at a low temperature of about 850 to 1050 ° C., the Ag-based internal wiring pattern 2 and the Ag-based surface. The sintering behavior with the conductor film to be the wiring pattern 4 is similar. The average particle size of the glass frit is 1.0 to 6.0 μm, 1.5 to
3.5 μm.

The composition ratio of the above-mentioned ceramic material and glass material is such that the ceramic material is 10 to 60 wt%, preferably 30 to 50 wt%, since firing at a relatively low temperature of 850 to 1050 ° C. 90-40w
t%, preferably 70 to 50 wt%.

It is necessary to give importance to the wettability of the organic binder with the solid content (ceramic powder, frit of the low melting point glass component), and the organic binder has a thermal decomposition property so that it can be burned off at a relatively low temperature and in a short firing step. Excellent ones are preferable, and ethylenically unsaturated compounds having a carboxyl group and an alcoholic hydroxyl group such as acrylic acid or methacrylic acid-based polymers are preferable.

As the solvent, an organic solvent or an aqueous solvent can be used. For example, in the case of an organic solvent, 2.2.
For example, 4-trimethyl-1.3-pentanediol monoisoventilate is used. In the case of an aqueous solvent, it must be water-soluble, and a hydrophilic functional group such as a carboxyl group is contained in the monomer and the binder. Has been added. The amount of addition is 2 to 300 in terms of acid value, preferably 5 to 300.
100. If the added amount is small, the solubility in water and the dispersibility of the powder of the fixed component deteriorate, and if the added amount is large, the thermal decomposability deteriorates. In consideration of the above, it is appropriately added within the above range.

Next, in the green sheets to be the insulating layers 1a to 1e, through holes having a predetermined diameter are formed by punching corresponding to the formation positions of the via hole conductors 3 in each layer. At the same time, a through hole for forming the concave portion 6a of the terminal electrode 6 is formed in a portion located on the end face of the laminated substrate 10.

Next, the conductor to be the via-hole conductor 3 is printed and printed with an Ag-based conductive paste inside the through-hole to be the via-hole conductor 3 of the green sheet to be the insulating layers 1a to 1e.
Formed by filling. Further, on the surfaces of the insulating layers 1a to 1e,
A conductor serving as the internal wiring pattern 2 and a conductor film serving as the surface wiring pattern 4 are formed by printing an Ag-based conductive paste.
In forming the conductor film serving as the internal wiring pattern 2 and the surface wiring pattern 4, the conductor films serving as the land electrodes 7a to 7f and the land electrodes 7a to 7e are brought into contact with the through holes serving as the concave portions 6a of the terminal electrodes 6. Wiring pattern 2,
Conductive films serving as connection patterns 8a to 8e for connection to the conductive layer 4 are formed by printing an Ag-based conductive paste. still,
When forming a conductor film to be the land electrodes 7a to 7e,
The printing plate making is controlled so that the conductive paste is also applied to a part of the inner wall surface of the through hole.

Here, the via hole conductor 3, the internal wiring pattern 2, the land electrodes 7a to 7e, and the connection patterns 8a to 8
Ag-based conductive paste for forming a conductive film to be e
A homogeneous mixture of g-based (Ag alone, Ag alloy such as Ag-Pd) powder, borosilicate low-melting glass frit, organic binder such as ethyl cellulose, and a solvent is used.

The Ag-based conductive paste for forming the conductive film to be the surface wiring pattern 4 is a mixture of a Pt powder, a low melting glass frit, an organic binder, and a solvent homogeneously containing Ag powder as a main component. . In addition, V ₂ O ₅ powder was added to each metal component in an amount of 0.2 to 1.0 w.
Addition of t% is desirable because the adhesion strength with the laminated substrate 10 is improved. Next, the green sheets to be the insulating layers 1a to 1e are laminated and integrated according to the lamination order of the laminated substrate 10.

Next, on the lower surface of the unsintered laminated substrate 10, a conductor film to be the surface wiring pattern 4, a land electrode 7f, and a connection pattern 8f are provided, if necessary, with the conductive paste as described above. It is formed by printing.

Next, a conductive film serving as the conductive film 6b is printed and applied on the inner wall surface of the through hole serving as the terminal electrode 6 using a conductive paste mainly composed of an Ag-based material.

Next, a division groove is formed in the unfired laminate so as to straddle the through hole serving as the terminal electrode 6.

Next, the unfired laminate is fired in an oxidizing atmosphere or an air atmosphere. The firing process includes a binder removal process and a sintering process.

The binder removal process includes a green sheet serving as the insulating layers 1a to 1e, a conductor film serving as the internal wiring pattern 2,
Organic components contained in the conductor to be the via hole conductor 3, the conductor film to be the surface wiring pattern 4, the conductor film to be the land electrodes 7a to 7f, the conductor film to be the connection patterns 8a to 8f, and the conductor film to be the conductor film 6b This is performed, for example, in a temperature range of 600 ° C. or less.

In the sintering process, the glass component of the glass-ceramic green sheet is crystallized and simultaneously dispersed uniformly at the grain boundaries of the ceramic powder to give a certain strength to the laminate, thereby forming the internal wiring pattern 2. A conductor film, a conductor serving as a via-hole conductor 3, a conductor film serving as a surface wiring pattern 4, a conductor film serving as land electrodes 7a to 7f, a conductor film serving as connection patterns 8a to 8f, and metal powder of a conductor film serving as a conductor film 6b; The resistance of each conductor is reduced by grain growth of the Ag-based powder, and is integrated with the insulating layers 1a to 1e. This is done until a peak temperature of 850-1050 <0> C is reached.

In this step, the internal wiring patterns 2 and
The laminated substrate 10 in which the via-hole conductor 3 is formed and the surface wiring pattern 4 is formed on the surface is achieved.

Thereafter, if necessary, a thick film resistive film or an insulating protective film of a predetermined shape connected to the surface wiring pattern 4 is formed, and various electronic component elements 5 are further joined and mounted.
The bonding structure differs depending on the various electronic component elements 5. For example, in the case of a chip-shaped electronic component, the bonding is performed by soldering with the surface wiring pattern 4. In the case of the IC chip, wire bonding is performed using a bonding wire of Al or Au with the surface wiring pattern 4.

After that, a dividing / cutting process is performed along the dividing groove formed in each laminated substrate 10. Thereby, the multilayer circuit board shown in FIG. 1 is achieved. The bonding between the IC chip and the surface wiring pattern 4 using the fine bonding wire may be performed after the division processing.

The through hole serving as the semicircular terminal electrode 6 is formed of the conductor film serving as the internal wiring pattern 2 and the land electrode 7a.
To 7f, and a conductor film to be the connection patterns 8a to 8f may be formed on each green sheet, and then each lamination process may be performed.

The above-mentioned land electrodes 7a to 7f (generally denoted by a reference numeral 7) and connection patterns 8a to 8f
Other examples of the shape (generally, the reference numeral 8 is simply given) are shown in the drawings.

In each of FIGS. 3 (a) to 3 (e), the center circle is a through hole which becomes the concave portion 6a of the semicircular terminal electrode 6 by the dividing process, and the center line passing through this through hole. Indicates a line to be divided.

The dotted lines show the shapes of the land electrodes 7 and the connection patterns 8 which are adjacent to each other in the direction of the layer thickness.

The shape of the land electrode 7 is substantially C-shaped as shown in FIG. 3A, and FIGS. 3B to 3C.
As shown in FIG. 3 (d) to FIG.
As shown in (e), a shape based on a substantially square shape is exemplified. In this case, although each land electrode 7 is in contact with the inner wall surface of the through hole, it does not reach the dividing line indicated by the solid line. This interval has an interval of at least 100 μm in a state where no positional shift occurs in consideration of Ag migration and printing shift.

The connection pattern 8 is not opposed to the connection pattern 8 adjacent in the stacking direction. This allows
Unnecessary stray capacitance on the side close to the internal wiring pattern 2 can be reduced.

In the above-mentioned manufacturing method, the surface wiring pattern and the conductor film of the terminal electrode of the multi-layered green sheet are described as being baked integrally with the laminated substrate. The film may be separately printed on the fired laminated substrate.

[0072]

As described above, according to the present invention, 800
An Ag-based conductor film serving as a surface wiring pattern and an internal wiring pattern is integrally formed on a laminated substrate on which an insulating layer made of a glass-ceramic material that can be fired at 10 ° C. to 1050 ° C. is laminated. It is a multilayer circuit board provided with terminal electrodes.

The connection pattern for connecting the land electrode and the internal wiring pattern is formed such that the connection patterns that are adjacent to each other in the lamination thickness direction are different from each other. That is, the connection patterns between the adjacent layers do not face each other. For this reason, the stray capacitance generated between the connection patterns can be effectively suppressed, and a multilayer circuit board with less variation in high-frequency characteristics even when a high-frequency circuit is formed on the multilayer board.

Further, both end portions of the electrode land constituting the terminal electrode are located inside from the end face of the laminated substrate. For this reason, since the land electrode is not exposed on the end face of the substrate, a short circuit due to migration of Ag can be effectively prevented between the adjacent terminal electrodes, so that the interval between the adjacent terminal electrodes can be narrowed, so that the size of the device can be reduced. A multilayer circuit board can be achieved.

[Brief description of the drawings]

FIG. 1 is a sectional view of a multilayer circuit board according to the present invention.

FIG. 2 is a perspective view of an end face portion of the multilayer circuit board of the present invention.

FIGS. 3A to 3E are partial plan views showing the relationship between the shape of a land electrode, a connection pattern, and a connection pattern adjacent in the stacking direction.

FIG. 4 is a perspective view of an end face portion of a conventional multilayer circuit board.

[Explanation of symbols]

 10 laminated board 1a-1e insulating layer 2 internal wiring pattern 3 via-hole conductor 4 surface wiring pattern 5 electronic components Element 6 ····· Semicircular terminal electrode 7, 7a to 7f ····· Land electrode 8, 8a to 8f ······ Connection pattern

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E346 AA02 AA05 AA12 AA22 AA32 AA38 AA43 AA45 BB16 CC18 CC39 DD02 DD13 DD34 EE24 EE29 FF05 FF18 GG04 GG05 GG06 GG08 GG09 HH06 HH08 HH22

Claims (2)

[Claims] An Ag-based internal wiring pattern and a land electrode are formed between insulating layers of a multilayer circuit board formed by laminating insulating layers made of a glass-ceramic material that can be fired at 800 ° C. to 1050 ° C. In a multilayer circuit board formed by forming a semicircular recess on an end face of the multilayer circuit board and exposing a part of the land electrode on an inner wall of the recess, a land electrode and an internal wiring pattern are provided between the insulating layers. A multilayer circuit board, wherein, when viewed in plan, each connection pattern is formed at a different position between adjacent insulating layers in the stacking thickness direction. 2. The method according to claim 1, wherein the land electrode is located 100 meters from an end face of the substrate.
2. The multi-layer circuit board according to claim 1, wherein the multi-layer circuit board is disposed on the inner side of at least μm.