JP2001189494A - 発光ダイオード - Google Patents

発光ダイオード

Info

Publication number
JP2001189494A
JP2001189494A JP37244099A JP37244099A JP2001189494A JP 2001189494 A JP2001189494 A JP 2001189494A JP 37244099 A JP37244099 A JP 37244099A JP 37244099 A JP37244099 A JP 37244099A JP 2001189494 A JP2001189494 A JP 2001189494A
Authority
JP
Japan
Prior art keywords
light
light emitting
reflecting mirror
emitting element
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP37244099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001189494A5 (enExample
Inventor
Yoshinobu Suehiro
好伸 末広
祐次 ▲高▼橋
Yuji Takahashi
Koji Uchida
浩二 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwasaki Electric Co Ltd
Toyoda Gosei Co Ltd
Original Assignee
Iwasaki Electric Co Ltd
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwasaki Electric Co Ltd, Toyoda Gosei Co Ltd filed Critical Iwasaki Electric Co Ltd
Priority to JP37244099A priority Critical patent/JP2001189494A/ja
Priority to EP00128513A priority patent/EP1113506A3/en
Priority to US09/749,636 priority patent/US6906459B2/en
Publication of JP2001189494A publication Critical patent/JP2001189494A/ja
Publication of JP2001189494A5 publication Critical patent/JP2001189494A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
JP37244099A 1999-12-28 1999-12-28 発光ダイオード Pending JP2001189494A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP37244099A JP2001189494A (ja) 1999-12-28 1999-12-28 発光ダイオード
EP00128513A EP1113506A3 (en) 1999-12-28 2000-12-27 Light emitting diode
US09/749,636 US6906459B2 (en) 1999-12-28 2000-12-28 Light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP37244099A JP2001189494A (ja) 1999-12-28 1999-12-28 発光ダイオード

Publications (2)

Publication Number Publication Date
JP2001189494A true JP2001189494A (ja) 2001-07-10
JP2001189494A5 JP2001189494A5 (enExample) 2007-01-11

Family

ID=18500447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP37244099A Pending JP2001189494A (ja) 1999-12-28 1999-12-28 発光ダイオード

Country Status (1)

Country Link
JP (1) JP2001189494A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3467258B2 (ja) 2001-04-10 2003-11-17 岡谷電機産業株式会社 発光ダイオードランプ
JP2004311973A (ja) * 2003-03-27 2004-11-04 Sanyo Electric Co Ltd 発光素子および照明装置
US7029156B2 (en) 2001-12-05 2006-04-18 Toyoda Gosei Co., Ltd. Light emitting apparatus and display
CN100373638C (zh) * 2001-12-29 2008-03-05 杭州富阳新颖电子有限公司 发光二极管及其发光二极管灯
JP2009054692A (ja) * 2007-08-24 2009-03-12 C I Kasei Co Ltd 発光装置および発光装置の作製方法
US7607801B2 (en) 2003-10-31 2009-10-27 Toyoda Gosei Co., Ltd. Light emitting apparatus
US7932527B2 (en) 2003-03-27 2011-04-26 Sanyo Electric Co., Ltd. Light-emitting device and illuminator
WO2015052995A1 (ja) * 2013-10-07 2015-04-16 シャープ株式会社 半導体レーザ装置及びその製造方法
JP2021141174A (ja) * 2020-03-04 2021-09-16 ローム株式会社 半導体発光装置および半導体発光装置の製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3467258B2 (ja) 2001-04-10 2003-11-17 岡谷電機産業株式会社 発光ダイオードランプ
US7029156B2 (en) 2001-12-05 2006-04-18 Toyoda Gosei Co., Ltd. Light emitting apparatus and display
CN100373638C (zh) * 2001-12-29 2008-03-05 杭州富阳新颖电子有限公司 发光二极管及其发光二极管灯
JP2004311973A (ja) * 2003-03-27 2004-11-04 Sanyo Electric Co Ltd 発光素子および照明装置
US7932527B2 (en) 2003-03-27 2011-04-26 Sanyo Electric Co., Ltd. Light-emitting device and illuminator
US7607801B2 (en) 2003-10-31 2009-10-27 Toyoda Gosei Co., Ltd. Light emitting apparatus
JP2009054692A (ja) * 2007-08-24 2009-03-12 C I Kasei Co Ltd 発光装置および発光装置の作製方法
WO2015052995A1 (ja) * 2013-10-07 2015-04-16 シャープ株式会社 半導体レーザ装置及びその製造方法
JP2021141174A (ja) * 2020-03-04 2021-09-16 ローム株式会社 半導体発光装置および半導体発光装置の製造方法
JP7413086B2 (ja) 2020-03-04 2024-01-15 ローム株式会社 半導体発光装置

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