JP2001189494A - Light-emitting diode - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting diode that can be mass-produced and at the same time, can be mounted by a reflow furnace. SOLUTION: A reflection mirror 15 is formed into a smooth, recessed part by press-machining a metal plate, and the recessed surface is subjected to surface machining such as plating and vapor deposition, for example, with silver as the material. Also, the reflection mirror 15 is provided opposite to the luminous surface of a light-emitting device 11 and is nearly of rotating paraboloidal shape. The center of the luminous surface of the light-emitting device 11 is arranged at the focal point. The light-emitting device 11, one portion of lead parts 12a and 12b, and a wire 13 and the reflection mirror 15 are sealed in one piece by a light transmission material 14 using the transfer mold method. A paraboloid 21 is the surface of the light transmission material 14, that is located at the rear side of the light-emitting device 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a light emitting diode which emits light emitted from a light emitting element to the outside after being reflected by a concave reflecting surface.

[0002]

2. Description of the Related Art Conventionally, light emitting diodes having various structures have been proposed. Among them, the reflection type light emitting diode is characterized in that light emitted from the light emitting element can be effectively radiated to the outside and that the light emitting diode can be made thin. Hereinafter, such a conventional reflective light emitting diode will be described.

FIG. 20 is a schematic sectional view of a reflection type light emitting diode as a first conventional example. A light emitting diode 80 shown in FIG. 20 includes a light emitting element 81 and lead portions 82a and 82.
b, a wire 83, a light-transmitting resin 84, a reflective substrate 85, and a radiation plate 86.

The light emitting element 81 is mounted on a lead portion 82a and is electrically connected to a lead portion 82b by a wire 83. The reflecting substrate 85 is made by resin molding, and has a concave reflecting mirror surface 85a formed at the center thereof. The reflecting mirror surface 85a is formed by performing a process such as metal deposition on the surface of the concave portion of the reflecting substrate 85. The leads 82a and 82b are mounted on a reflective substrate 85 such that the light emitting element 81 faces the reflective mirror surface 85a, and a radiation plate 86 is further mounted thereon. The radiation plate 86 transmits the light reflected by the reflection mirror surface 85a and radiates the light to the outside. The radiation plate 86 is provided to improve the surface accuracy of the surface from which light is extracted to the outside. Further, the space surrounded by the reflecting mirror surface 85a and the radiation plate 86 is filled with a resin 84, whereby the light emitting element 81 is sealed with a resin.

FIG. 21 is a schematic sectional view of a reflection type light emitting diode as a second conventional example. A light emitting diode 90 shown in FIG. 21 includes a light emitting element 91 and lead portions 92a and 92.
b, a wire 93, a light-transmitting resin 94, a concave reflecting surface 95, and a radiation surface 96.

The light emitting element 91 is mounted on a lead portion 92a and is electrically connected to a lead portion 92b by a wire 93. Light emitting element 91, lead portion 92
a, 92b and the wire 93 are made of a light-transmitting resin 9;
4 are integrally sealed. Concave reflective surface 95
Is obtained by mirror-finishing one surface of a light-transmitting resin 94 by plating, metal evaporation, or the like, and is formed on the side facing the light-emitting surface of the light-emitting element 91. On the other hand, a flat radiation surface 9 is provided on the surface of the light-transmitting resin 94 opposite to the concave reflection surface 95.
6 are formed.

As a method for manufacturing the light emitting diode 90, a transfer molding method is used in which a thermosetting resin is injected into a place where a lead frame is sandwiched between an upper mold and a lower mold, and the resin is cured. This method is used
This is because in the reflective light emitting diode 90, it is necessary to form the reflective surface 95 and the radiation surface 96 with high accuracy on both sides of the lead frame. By using the existing transfer molding device, the light emitting diode 90 can be easily produced and mass production can be achieved.

[0008]

However, in the light emitting diode 80 of the first conventional example, it is extremely difficult to uniformly fill the concave portion of the reflective substrate 85 with the resin 84 at the time of manufacturing the same. This is due in part to the lack of existing equipment for resin filling. Normally, an appropriate amount of resin 84 is put into the concave portion of the reflection substrate 85, and then the lead portions 82a and 82b and the radiation plate 86 are placed on the reflection substrate 85.
The light emitting diode 80 is manufactured by mounting the reflecting mirror surface 85a and the radiation plate 86.
Air bubbles are likely to enter between them, and the resin 84 overflows to the side of the reflective substrate 85. These bubbles adversely affect the radiation characteristics of the light emitting diode 80, and the treatment of the overflowing resin 84 involves technical difficulties. As described above, the first conventional light emitting diode 80 has a problem that it is difficult to manufacture and is inferior in mass productivity.

On the other hand, the second conventional light emitting diode 90
Thus, although it is excellent in mass productivity, there is a problem that it cannot be applied to a reflow furnace. That is, when the light emitting diode 90 is mounted in a reflow furnace using cream solder, the thermal expansion coefficient of the sealing resin 94 and the metal film on the reflection surface 95 are significantly different. Is separated from the sealing resin 94. For this reason, there is a problem that wrinkles and the like are generated on the reflection surface 95, and the function of the reflection surface, which reflects light emitted from the light emitting element 91, is impaired.

The present invention has been made based on the above circumstances, and has as its object to provide a light emitting diode which can be mass-produced and can be mounted using a reflow furnace.

[0011]

According to a first aspect of the present invention, there is provided a light emitting diode comprising: a light emitting element; a lead for supplying power to the light emitting element; A reflecting mirror provided, and the light emitting element,
A light transmitting material that seals a part of the lead portion and the reflecting mirror, and a radiation surface that radiates light reflected by the reflecting mirror to the outside, the reflecting mirror is formed by processing a metal plate into a concave shape. The metal mirror or a concave surface of the metal mirror is mirror-finished, and the radiation surface is a surface of the light transmitting material located on a back side of the light emitting element.

According to another aspect of the present invention, there is provided a light emitting diode including a light emitting element, a lead for supplying power to the light emitting element, and a light emitting surface of the light emitting element. A reflecting mirror, and a radiation surface that radiates light reflected by the reflecting mirror to the outside, wherein the reflecting mirror is a metal mirror processed by combining a plurality of metal pieces into a concave shape or a concave surface of the metal mirror. It is characterized in that it has been performed.

Furthermore, a light emitting diode according to the present invention for achieving the above object is provided with a light emitting element, a lead portion for supplying power to the light emitting element, and a light emitting surface of the light emitting element. A reflecting mirror, a radiation plate that transmits the light reflected by the reflecting mirror and radiates the light to the outside, and includes a light-emitting element, a part of the lead, and a housing that houses the reflecting mirror; A metal mirror in which a metal plate is processed into a concave shape, or a mirror surface is applied to a concave surface of the metal mirror, and
The radiation plate is attached to the housing, and a space surrounded by the radiation plate and the housing is sealed.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] A first embodiment of the present invention will be described below with reference to the drawings. FIG.
FIG. 2 is a schematic plan view of a light emitting diode according to a first embodiment of the present invention, FIG. 2 is a schematic sectional view of the light emitting diode in the direction of arrows AA, and FIG. 3 is a schematic rear view of the light emitting diode.

The light emitting diode 10a of the first embodiment is
As shown in FIGS. 1, 2 and 3, the light emitting device includes a light emitting element 11, leads 12 a and 12 b, a wire 13, a light transmitting material 14, a concave reflecting mirror 15, and a radiation surface 21.

The light emitting element 11 is mounted on a lead 12a, and the light emitting element 11 and the lead 12b are
Are electrically connected to each other. Further, the light emitting element 11,
A part of the leads 12a and 12b, the wire 13 and the reflecting mirror 15 are integrally sealed by a light transmitting material 14. Here, as the light transmissive material 14, for example, a transparent epoxy resin is used.

The leads 12a and 12b are connected to the light emitting element 11
Used to supply power to the As shown in FIG. 1, the lead portions 12a are drawn out from the upper and lower sides and the left side of the light transmitting material 14. The light emitting element 11 is mounted at the intersection of the lead portion 12a where the rightwardly extending portion abuts the vertically extending portion. Further, as shown in FIG. 1, the lead portion 12b is drawn out from the right side of the light transmitting material 14, and one end of the lead portion 12b is separated from the intersection of the lead portion 12a by a certain distance. Placed.

The reflecting mirror 15 is a metal plate (for example, a copper alloy plate)
Pressed into a smooth concave shape.
The concave surface is subjected to surface processing such as plating or vapor deposition using silver as a material, for example. Here, the reflecting mirror 15 is formed in a substantially paraboloid of revolution shape, and the light emitting surface of the light emitting element 11 is arranged at the focal point. Then, the reflecting mirror 15 and the lead 12
a, 12b are spaced apart by a certain distance so as not to contact with the a and 12b. In addition, as shown in FIG. 2, protrusions 15 a are formed at least at two positions facing each other among the edges of the reflecting mirror 15. The projection 15a projects in a direction perpendicular to the central axis of the reflecting mirror 15 toward the outside of the reflecting mirror 15.

The radiation surface 21 is formed on the back side of the light emitting element 11. To be more precise, the surface of the light transmitting material 14 on the back side of the light emitting element 11 corresponding to the optical path diameter of the light reflected by the reflecting mirror 15 becomes the radiation surface 21. Here, the radiation surface 21 is formed in a planar shape perpendicular to the central axis of the reflecting mirror 15. That is, in the first embodiment, the position of the light emitting element 11 and the shapes of the reflecting mirror 15 and the radiation surface 21 are designed so that the light emitting diode 10a can emit parallel light.

Next, the light emitting diode 10 of the first embodiment
The method for producing a will be described. To manufacture the light emitting diode 10a, a lead frame is used, and the light emitting diode 10a is formed on the lead frame by a transfer molding method. FIG. 4 shows the light emitting diode 10.
FIG. 6 is a schematic partial enlarged cross-sectional view for explaining a state when a is manufactured by a transfer molding method.

In this case, a lead frame having lead portions 12a and 12b is used. First,
Using the lead frame, the light emitting element 11 is mounted at a predetermined position on the lead part 12a, and the light emitting element 11 and the lead part 12b are bonded with the wire 13. next,
As shown in FIG. 4, the reflecting mirror 15 is set on the lower mold 32 such that the concave surface of the reflecting mirror 15 faces upward. Lower mold 3
As shown in FIG. 4, a groove 32a is engraved on the inside of the upper part of 2. By fitting the projection 15a of the reflecting mirror 15 into the groove 32a, the reflecting mirror 15 is held in a state of floating inside the lower mold 32. Here, the groove 3
The depth of 2a is larger than the thickness of the projection 15a. In addition, the lower mold 3 is placed on the reflecting mirror 15 with the concave surface facing upward.
The reason for setting to 2 is to prevent air bubbles from entering the inside of the molded product.

Thereafter, the lead frame and the lower mold 32 are aligned, and the lead frame is mounted on the lower mold 32. Then, by placing the upper mold 31 over the lead frame, the lead frame is sandwiched between the upper mold 31 and the lower mold 32 as shown in FIG. At this time, the lead portions 12a and 12b of the lead frame are separated from the reflecting mirror 15 by a certain distance.

Next, a liquid transparent epoxy resin is applied to the upper mold 3.
It is injected into a space surrounded by 1 and the lower mold 32. After the resin injected into the space is cured, the molded product is taken out from the upper mold 31 and the lower mold 32. Thereafter, unnecessary portions of the lead frame are cut to obtain a light emitting diode 10a as shown in FIGS. 1, 2 and 3.

When the transfer molding method is used, the radiation surface 15 can be molded with high precision, and the radiation surface 21 is formed by holding the lead frame with a mold. Can also be highly accurate.

In the light emitting diode 11 configured as described above, when power is supplied to the light emitting element 11, the light emitting element 11 emits light, and the light emitted from the light emitting element 11 is reflected by the reflecting mirror 15 and radiated to the outside from the radiation surface 21 Is done. In particular, the reflector 1
Since the light-emitting element 5 has a substantially paraboloid of revolution and the center of the light-emitting surface of the light-emitting element 11 is arranged at the focal point, the light passing through the light-emitting surface 21 is externally emitted as parallel light. As described above, the light emitted from the light emitting element 11 is once reflected by the reflecting mirror 15 and then emitted to the outside, so that the light emitting diode 11 has a feature that the external radiation efficiency is high, and the brightness and the luminous intensity are high. . Moreover, since the light emitted from the light emitting element 11 is controlled only by the reflecting mirror 15, the light emitting diode 1
Since the irradiation distribution of Oa itself does not have a biased irradiation pattern and the degree of irradiation unevenness is small, the uniformity can be improved.

In the first embodiment, the case where the reflecting mirror 15 is formed in a substantially paraboloid of revolution has been described. However, by forming the reflecting mirror 15 into a desired shape, light emission such as light distribution characteristics can be achieved. Characteristics can be freely designed.

In the light emitting diode of the first embodiment, since the concave reflecting mirror formed by pressing a metal plate is used, the reflecting mirror is resistant to temperature change.
No wrinkles or the like are generated on the concave surface of the reflector even under a high temperature condition, and the reflector is not damaged. Therefore, such a light emitting diode can be mounted in a reflow furnace using cream solder. As described above, since the light emitting diode of the first embodiment can be used as a surface mount component without any limitation, it is particularly suitable for use in applications in which a large number of devices are mounted.

Even when such a reflecting mirror is used, the light emitting element, a part of the lead portion and the reflecting mirror are sealed with the light transmitting material, and one surface of the light transmitting material is radiated. By molding as a surface, production can be easily performed using existing production equipment, and thus mass production of light emitting diodes can be achieved. Second Embodiment Next, a second embodiment of the present invention will be described with reference to the drawings. 5 is a schematic plan view of a light-emitting diode according to a second embodiment of the present invention, FIG. 6 is a schematic cross-sectional view of the light-emitting diode in the direction of arrows BB, and FIG. 7 is a schematic rear view of the light-emitting diode. In the second embodiment, components having the same functions as those of the first embodiment are denoted by the same reference numerals, and a detailed description thereof will be omitted.

The light emitting diode 10b according to the second embodiment comprises:
As shown in FIGS. 5, 6, and 7, the light emitting element 11, the lead portions 120a and 120b, the wire 13, the light transmitting material 14, the concave reflecting mirror 16, the radiation surface 21, the insulator 22.

The light emitting element 11 is mounted on a lead 120a, and the light emitting element 11 and the lead 120b are electrically connected by a wire 13. The light emitting element 11, a part of the lead portions 120a and 120b, the wire 13, the reflecting mirror 16, and the insulator 22 are integrally sealed with the light transmitting material 14. The insulator 22 is connected to the lead 12
0a, 120b and the reflecting mirror 16.

The leads 120a and 120b are used to supply power to the light emitting element 11. As shown in FIG. 6, each of the lead portions 120a and 120b is bent toward the reflecting mirror 16 so that the light transmitting material 1
4 is drawn out from the lower side.

As in the first embodiment, the reflecting mirror 16 is formed by pressing a metal plate (eg, a copper alloy plate) into a smooth concave shape, and for example, silver is formed on the concave surface. Surface processing such as plating and vapor deposition is performed as a material. Here, the reflecting mirror 16 is formed in a substantially paraboloid of revolution shape, and the light emitting surface of the light emitting element 11 is arranged at the focal point.
However, in the second embodiment, unlike the first embodiment, a through hole 16a is formed in the center of the reflecting mirror 16. It is desirable that the diameter of the through hole 16a be smaller than the width of the lead portions 120a and 120b. Further, no projection is formed on the edge of the reflecting mirror 16.

By forming the through hole 16a in the reflecting mirror 16, a part of the reflecting mirror 16 is missing. However, the lack is only a small part of the reflector 16,
Also, in the portion where the through hole 16a of the reflecting mirror 16 is formed,
Even if the through hole 16a is not formed, the light reflected at that portion is blocked by the light emitting element 11 and is not radiated to the outside. Therefore, the influence on the external radiation efficiency and the light radiation characteristics due to the formation of the through hole 16a is negligible.

Next, the light emitting diode 10 of the second embodiment
The method for manufacturing b will be described. Here, a potting mold method is used to manufacture the light emitting diode 10b. FIG. 8 shows the light emitting diode 1
FIG. 10 is a schematic cross-sectional view for explaining a state when Ob is manufactured by the potting mold method.

In this case, first, the light emitting element 11 is mounted at a predetermined position on the lead part 120a, and the light emitting element 11 and the lead part 120b are bonded by the wire 13. Then, the leads 120a and 120b are bent at predetermined positions to the side where the light emitting element 11 is mounted. Next, as shown in FIG. 8, the ends of the lead portions 120a and 120b are held by a jig or the like with the light emitting surface of the light emitting element 11 facing upward, and placed in a predetermined case. Thereafter, the reflecting mirror 16 is disposed at a predetermined position on the lead portions 120a and 120b via the insulator 22 with the concave surface facing down.

Next, as shown by an arrow in FIG. 8, a liquid transparent epoxy resin is dropped into the case from the upper corner of the case. At this time, since air escapes from the through-hole 16a provided in the central portion of the reflecting mirror 16, no air bubbles accumulate in the reflecting mirror 16. Then, after the resin injected into the case is cured, the molded product is taken out of the case to obtain a light emitting diode 10b as shown in FIGS. 5, 6, and 7.

When the potting molding method is used, the light emitting element 11, the lead portions 120a and 120b, and the reflecting mirror 16 can be sealed with resin, and the radiation surface 2 can be formed.
1 can be molded. In particular, the potting mold method has many advantages over the transfer mold method, and has the advantage that an appropriate type of resin can be selected according to the application.

The light emitting diode 10 of the second embodiment
In order to produce b, a transfer molding method can be used as in the first embodiment. In this case, the radiating surface can be formed not only by the upper mold but also by the lower mold. This is because, in the second embodiment, since the through-hole 16a is provided in the central portion of the reflecting mirror 16, bubbles do not accumulate in the reflecting mirror 16. In general, when the radiation surface is molded by the upper mold, even if the upper mold forms a flat surface, the residual air layer may cause sinkage during part or most of the radiation surface during resin curing. However, by forming the radiating surface with the lower mold, such sinking problem disappears, so it is possible to improve the forming accuracy of the radiating surface and make the radiation characteristics on the radiating surface as designed. it can.

In the light-emitting diode of the second embodiment, similarly to the first embodiment, the use of a concave reflecting mirror formed by pressing a metal plate makes the reflecting mirror resistant to temperature changes. As a result, wrinkles and the like are not generated on the concave surface of the reflecting mirror even under a high temperature condition, and the reflecting mirror is not damaged. Therefore, the light emitting diode of the second embodiment can be mounted in a reflow furnace using cream solder. Even when such a reflecting mirror is used, the light emitting element, a part of the lead portion, and the reflecting mirror are sealed with the light transmitting material, and one surface of the light transmitting material is used as a radiation surface and molded. By molding, it can be easily produced using existing production equipment, and therefore, mass production of light emitting diodes can be achieved.

Further, the light emitting diode of the second embodiment has an advantage that the flexibility of the manufacturing method can be increased by providing the through hole in the center of the reflecting mirror.
That is, even if the light emitting element, the lead portion, and the reflecting mirror are sealed with a resin while the reflecting mirror is installed above the lead portion, bubbles do not accumulate in the reflecting mirror. A light-emitting diode can be manufactured by a transfer molding method using a lower mold. In particular, when the transfer mold method is used, the radiation surface is formed by the lower mold, so that the molding accuracy of the radiation surface is improved, and the radiation characteristics due to the residual air layer generated in the molding portion of the upper mold are avoided. be able to. [Third Embodiment] Next, a third embodiment of the present invention will be described with reference to the drawings. 9 is a schematic plan view of a light-emitting diode according to a third embodiment of the present invention, FIG. 10 is a schematic cross-sectional view of the light-emitting diode in the direction of arrows CC, and FIG. 11 is a schematic rear view of the light-emitting diode. In the third embodiment, components having the same functions as those of the first embodiment are denoted by the same reference numerals, and a detailed description thereof will be omitted.

The light emitting diode 10c according to the third embodiment comprises:
As shown in FIG. 9, FIG. 10 and FIG.
, Leads 12 a and 12 b, wire 13, light transmitting material 14, concave reflecting mirror 17, and radiation surface 21. Light emitting element 11, a part of lead portions 12a and 12b,
The wire 13 and the reflecting mirror 17 are integrally sealed by the light transmitting material 14.

The reflecting mirror 17 is a combination of four reflecting mirror pieces 17a, 17b, 17c, and 17d pressed in a concave shape.
On the concave surfaces of c and 17d, surface processing such as plating and vapor deposition is performed using, for example, silver as a material. That is, it can be considered that the reflecting mirror 17 is obtained by dividing the reflecting mirror in the first or second embodiment into four parts. Reflector piece 17
a, 17b, 17c and 17d each have a central angle of approximately 9
It has a substantially fan shape of 0 degrees, and the lead portions 12a,
12b is made of the same metal plate material. As shown in FIG. 11, the four reflecting mirror pieces 17a, 17b, 17c, and 17d are arranged so as to be substantially circular when viewed from the back. Here, adjacent reflecting mirror pieces 17a, 17
b, 17c, 17d, between the lead portions 12a, 12b
Is provided with a gap smaller than the width.

The reflecting mirror 17 is formed in a substantially paraboloid of revolution, and the light emitting surface of the light emitting element 11 is disposed at the focal point. At this time, as shown in FIGS. 9 and 10, the reflecting mirror 17 has adjacent reflecting mirror pieces 17a, 17b, 17c, 1
7d, and the leads 12a, 12b drawn out in the respective directions of up, down, left, and right face each other.
Be placed. Even if there is no gap in the portion of the reflecting mirror 17 facing the leads 12a, 12b, the light reflected at the portion is blocked by the leads 12a, 12b and is not emitted to the outside. Therefore, by arranging the gap between the reflecting mirrors 17 in this portion, it is possible to minimize the influence of the gap on the external radiation efficiency and the like.

Next, the light emitting diode 10 of the third embodiment
The manufacturing method of c will be described. As a method of manufacturing the light emitting diode 10c, for example, the lead portions 12a,
A first method using one lead frame in which a reflector 12b and a fan-shaped portion corresponding to each of the reflecting mirror pieces 17a, 17b, 17c, and 17d are formed; a lead frame in which the leads 12a and 12b are formed; There is a second method using a frame in which a portion is formed.

First, the first method will be described. FIG.
2 is a schematic plan view of a part of a lead frame used when manufacturing the light emitting diode 10c by the first method,
FIG. 13 is a schematic plan view of a part of the lead frame in a state where the fan-shaped portion is folded. First, a metal plate material is punched out to produce a lead frame 40 as shown in FIG. The lead frame 40 includes a lead 12
a, 12b and each of the reflector pieces 17a, 17b, 17c, 1
Fan-shaped portions (metal pieces) 41a, 41b, 4 corresponding to 7d
1c, 41d and a connecting portion 42 for connecting the lead portions 12a, 12b and the fan-shaped portions 41a, 41b, 41c, 41d.
Are formed. The connecting portion 42 is connected to the lead 1
The arc-shaped connecting portion 42a connecting the 2a and 12b to each other, the arc-shaped connecting portion 42a and the fan-shaped portions 41a, 41b, 41c, 41
d and a linear connecting portion 42b connecting between the two.

In this embodiment, the lead portion 12a is formed so as to be elongated in the up, down, left and right directions.
This is so that a, 41b, 41c, and 41d can be firmly held.

Next, plating is performed on at least one surface of the lead frame 40. Here, it is assumed that plating is applied to the front surface of the lead frame 40 in FIG. After that, the light emitting element 11 is mounted at a predetermined position on the surface of the plated side of the lead part 12a, and the light emitting element 11 and the lead part 12b are bonded by the wire 13.

Next, with respect to the lead frame 40, each fan-shaped portion 41a, 41b, 41c, 41d is pressed to form a concave shape. In this case, the front surface of the lead frame 40 in FIG. 12 is processed into a concave shape. The reason why the press working is performed after the bonding processing is that the mounting of the light emitting element and the wire bonding are desirably performed in a state of a flat lead frame. Then, the portion indicated by the one-dot chain line in FIG. 12 is valley-folded, and the four fan-shaped portions 41a, 41b, 41c, 41d are folded, so that the lead frame 40 is in the state shown in FIG. Here, in FIG.
1 and the wire 13 are omitted. Thereby, the reflecting mirror 17 is formed on the side facing the light emitting element 11. As described above, in the first method, the alignment between the lead portion 12a on which the light emitting element 11 is mounted and the reflecting mirror 17 can be performed at the time of press working, so that workability can be improved. In addition, even when using a plate material that is difficult to form a concave surface at a time due to, for example, shearing during press working, the plate material is divided and formed into a concave shape for each of the divided portions. Processing can be performed without any problem.

After that, similarly to the first embodiment, the light emitting element 11 and the lead 12
A part of a, 12b, the wire 13 and the reflecting mirror 17 are resin-sealed, and the radiation surface 21 is formed. And FIG.
By cutting the part shown by the dashed line in
Light emitting diode 1 as shown in FIGS. 9, 10 and 11
0c is obtained.

Next, the second method will be described. FIG.
FIG. 4 is a schematic plan view of a part of two frames used when manufacturing the light emitting diode 10c by the second method. First, two metal plate materials were punched out, and FIG.
A lead frame 40a shown in FIG. 14A and a frame 40b shown in FIG. Lead frame 40
a is formed with lead portions 12a and 12b. On the other hand, on the frame 40b, each of the reflecting mirror pieces 17a, 17b,
Fan-shaped portions (metal pieces) 41a corresponding to 17c and 17d,
41b, 41c and 41d are formed. In this frame 40b, unlike the lead frame used in the first method, each of the fan-shaped portions 41a, 41b, 41c, 41
d is arranged in advance so as to be substantially circular. Also,
The outer frame of each frame 40a, 40b has a lead 12
a, 12b and each fan-shaped portion 41a, 41b, 41c, 41
A hole 43 for positioning with d is formed.

Next, with respect to the frame 40b, each fan-shaped portion 41a, 41b, 41c, 41d is press-worked.
It is formed in a concave shape. Thereafter, plating is performed on at least one surface of the lead frame 40a, and plating is performed on at least the concave surface of each fan-shaped portion of the frame 40b. Thereby, the reflection mirror 17 is provided on the lead frame 40b.
Is formed. Here, in the second method, each fan-shaped portion 4
For 1a, 41b, 41c and 41d, plating is performed after press working. By performing plating after press working, there is an advantage that there is no risk of the plating state being degraded during press work as in the case of performing plating before press work. In addition, regarding the lead frame 40a, the light emitting element 11 is provided at a predetermined position on the surface of the lead portion 12a on the plated side.
Is mounted, and the light emitting element 11 and the lead portion 12b are bonded by the wire 13.

Next, the light emitting surface of the light emitting element 11 and the reflecting mirror 17
The lead frame 40a and the frame 40b are overlapped with each other so that the concave surfaces of the lead frames face each other, and fixed with a jig or the like. In the second method, the positioning of the light emitting element 11 and the reflecting mirror 17 can be easily performed by using the positioning hole 43. At this time, the lead portions 12a, 12b
In order to insulate the mirror and the reflector 17, care must be taken so that they do not come into contact with each other. For this reason, for example, when the frame 40b is pressed, each fan-shaped portion 41a,
The circumferential ends 410 of 41b, 41c and 41d are
The projection is made to protrude beyond the plane formed by the outer frame portion of b. Also, by superposing the lead frame 40a and the frame 40b via an insulator, the lead portion 12
a, 12b and the reflecting mirror 17 may not be in contact with each other.

Thereafter, as in the first embodiment, the light emitting element 11, the parts of the leads 12a, 12b, the wire 13, and the reflecting mirror 17 are formed by superimposing the two frames 40a, 40b on each other. And the radiation surface 21 is formed. And
By cutting unnecessary portions of the frames 40a and 40b, a light emitting diode 10c as shown in FIGS. 9, 10 and 11 is obtained.

In the second method, the lead portions 12a,
By using the lead frame 40a on which the lead portions 12b are formed and the frame 40b on which the fan-shaped portions 41a, 41b, 41c and 41d are formed, the lead portions 12a and 12d are formed.
b, there is an advantage that an appropriate material, thickness and the like can be selected and used separately for each of the reflecting mirrors 17. For example, a plate on which the light emitting element is mounted needs to have a certain thickness in order to secure heat radiation. In contrast,
By reducing the thickness of the plate material forming the reflecting mirror, the stress at the time of thermal expansion and thermal contraction between the metal and the resin can be suppressed low.

In the light-emitting diode of the third embodiment, similarly to the first embodiment, the use of a concave reflecting mirror formed by pressing a metal plate makes the reflecting mirror resistant to temperature changes. As a result, wrinkles and the like are not generated on the concave surface of the reflecting mirror even under a high temperature condition, and the reflecting mirror is not damaged. Therefore, the light emitting diode of the third embodiment can be mounted in a reflow furnace using cream solder. Even when such a reflecting mirror is used, the light emitting element, a part of the lead portion, and the reflecting mirror are sealed with the light transmitting material, and one surface of the light transmitting material is used as a radiation surface and molded. By molding, it can be easily produced using existing production equipment, and therefore, mass production of light emitting diodes can be achieved.

By the way, strict light distribution control may not be required depending on the application of the light emitting diode. In such a case, instead of forming the reflecting mirror into a smooth curved surface such as a paraboloid of revolution, a concave reflecting mirror may be formed by bending each reflecting mirror piece at several places. Hereinafter, a specific example of the light emitting diode manufactured as described above will be described.

FIG. 15 is a schematic sectional view of a light emitting diode which is a first modification of the third embodiment, and FIG. 16 is a schematic rear view of the light emitting diode. The light emitting diode shown in FIGS. 15 and 16 differs from the light emitting diode of the third embodiment in the structure of the reflecting mirror 170. The reflecting mirror 170 includes six reflecting mirror pieces 1.
71, 171,... Each reflector piece 171, 17
Are formed by bending a substantially triangular metal piece at only one place, and are arranged so as to have a substantially regular hexagonal shape when viewed from the back as shown in FIG. I have.

FIG. 17 is a schematic rear view of a light emitting diode according to a second modification of the third embodiment. The light emitting diode shown in FIG. 17 differs from that of the third embodiment only in the structure of the reflecting mirror 180. The reflecting mirror 180 has four reflecting mirror pieces 181, 181, 181, and 182. Three of the reflecting mirror pieces 181, 181, 181 are formed in a flat, substantially trapezoidal shape. One remaining reflector piece 182
Has a substantially trapezoidal portion and a substantially square portion connected to the substantially trapezoidal portion, and is bent at a boundary between the substantially trapezoidal portion and the substantially square portion. Each reflector piece 1
As shown in FIG. 17, 81, 181, 181, and 182 are arranged so as to be substantially square when viewed from the back. That is, the reflecting mirror piece 182 is disposed at a position where the center of the substantially square portion faces the center of the light emitting surface of the light emitting element, and each of the reflecting mirror pieces 181, 181 and 181 is formed of the substantially square portion of the reflecting mirror piece 182. It is arranged at a position adjacent to the three sides.

The light emitting diodes of the first and second modifications have the advantage that the reflector piece can be easily processed because the reflector piece is bent at several places to form a concave reflector. Such a light emitting diode is suitable for use when strict light distribution control is not required. [Fourth Embodiment] Next, a fourth embodiment of the present invention will be described with reference to the drawings. FIG. 18 is a schematic plan view of a light-emitting diode according to a fourth embodiment of the present invention, and FIG. 19 is a schematic cross-sectional view of the light-emitting diode in the direction of arrows DD. In the fourth embodiment, components having the same functions as those of the first embodiment are denoted by the same reference numerals, and a detailed description thereof will be omitted.

The light emitting diode 10d according to the fourth embodiment comprises:
As shown in FIGS. 18 and 19, the light emitting element 11, the lead portions 121a and 121b, the wire 13, the concave reflecting mirror 19, the flat radiation plate 23, and the metal housing portion 24 are provided.
And The housing part 24 has a substantially square shape when viewed from above, and includes the light emitting element 11 and the lead parts 12a and 12b.
, The wire 13, the reflecting mirror 19, and the radiation plate 23.

The leads 12a1 and 121b are used to supply power to the light emitting element 11. The light emitting element 11 is mounted on the lead portion 121a, and the light emitting element 11 and the lead 121b are electrically connected by the wire 13. As shown in FIG. 18, the lead portion 121a is drawn out from the left side of the light transmitting material 14, and the lead portion 121b is connected to the light transmitting material 14
Is drawn out from the right side.

As in the first embodiment, the reflecting mirror 19 is formed by pressing a metal plate (eg, a copper alloy plate) into a smooth concave shape, and for example, silver is formed on the concave surface. Surface processing such as plating and vapor deposition is performed as a material. Here, the reflecting mirror 19 is formed in a substantially paraboloid of revolution shape, and the light emitting surface of the light emitting element 11 is arranged at the focal point.
However, in the fourth embodiment, unlike the first embodiment, no projection is formed on the edge of the reflecting mirror 19.

The reflecting mirror 19 is fixed to the bottom in the housing 24. A groove is formed in the upper part of the housing 24, and the leads 121a and 121 are formed in the groove.
b, the light emitting element 11 and the lead 12
A part of the wires 1a and 121b and the wire 13 are housed in the housing 24.

The radiating plate 23 transmits the light reflected by the reflecting mirror 19 and radiates the light to the outside. As a material of the radiation plate 23, for example, glass is used. Case 24
A step portion 24a is formed inside the upper end portion of
The radiation plate 23 is fitted into the step 24a.

The groove of the housing 24 is filled with the resin 25, and the radiating plate 23 is fixed with an adhesive or the like, so that the light emitting diode 10d has a sealed structure. In the fourth embodiment, a metal member is used as the housing portion 24. In this case, the lead portions 121a, 121a
For example, an insulator is inserted between the lead portions 121a and 121b and the housing portion 24 so that the housing 1 does not contact the housing 1b.

Next, the light emitting diode 10 of the fourth embodiment
The method for manufacturing d will be described. First, the lead section 121
The light-emitting element 11 is mounted at a predetermined position on a, and the light-emitting element 11 and the lead portion 121b are bonded by the wire 13. Next, the reflecting mirror 19 is placed in the housing 24, and the bottom of the reflecting mirror 19 is fixed to the bottom of the housing 24. Thereafter, the leads 121a and 121b are inserted into the grooves of the housing 24, and the radiation plate 23 is fitted into the step 24a of the housing 24. At this time, dry air is allowed to enter the housing portion 24. In this state, the radiation surface 23 and the housing portion 24 are bonded with an adhesive, and the groove of the housing portion 24 is
Close with. As described above, the case in which dry air is introduced into the housing portion 24 and the housing portion 24 is completely sealed is formed by the light emitting element 11.
This is for preventing the deterioration of the film due to moisture. Also,
This is also to prevent dust and dirt from entering the inside. As described above, the light emitting diode 1 as shown in FIGS.
0d is obtained.

In the light-emitting diode of the fourth embodiment, similarly to the first embodiment, the use of the concave reflecting mirror formed by pressing the metal plate makes the reflecting mirror resistant to temperature changes. As a result, wrinkles and the like are not generated on the concave surface of the reflecting mirror even under a high temperature condition, and the reflecting mirror is not damaged. Therefore, such a light emitting diode can be mounted in a reflow furnace using cream solder. In addition, the light emitting diode can be easily produced using existing production equipment, and thus mass production of light emitting diodes can be achieved.

When a light-emitting element that emits light having a short wavelength in the visible region or light having a wavelength in the ultraviolet region is used as in the first to third embodiments,
When the light emitting element, a part of the lead portion, and the reflecting mirror are sealed with a transparent epoxy resin as a light transmitting resin, there is a problem that the light emitted from the light emitting element deteriorates the epoxy resin. However, in the light emitting diode of the fourth embodiment, such a problem does not occur because the light emitting element and the like are not sealed with the resin. Moreover, at this time, by sealing the inside of the case, it is possible to prevent the light emitting element from being deteriorated by moisture.

In particular, in this case, a light emitting diode that emits white light can be manufactured by applying a phosphor to the inner surface of the radiation plate. That is, when an element that emits ultraviolet light is used as the light emitting element, when the ultraviolet light hits the phosphor, the phosphor emits white light. When a light-emitting element that emits blue light is used, part of the blue light passes through the phosphor, and the other part is absorbed by the phosphor, and the phosphor emits yellow light. When the blue light and the yellow light overlap, white light is emitted to the outside. Here, the rate at which the phosphor transmits blue light varies depending on the thickness of the phosphor applied to the radiation surface. By the way, although the main factor of the deterioration of the phosphor is due to moisture, in the fourth embodiment, the dried air is sealed in the casing and the casing is sealed, so that the moisture of the phosphor is reduced. Can be reduced.

In the case where a light emitting element that emits ultraviolet light is used, since the reflectance of the ultraviolet light on the silver surface is not very good, instead of using a mirror whose concave surface is plated with silver, the light emitting element is used. It is preferable to use one in which the concave surface is deposited with aluminum. Also, instead of applying the phosphor to the inner surface of the radiation plate, when forming the radiation plate,
A fluorescent material may be included therein.

The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the invention.

For example, in each of the above embodiments, the case where the concave surface of the metal plate is mirror-finished as the reflecting mirror has been described. However, if the reflectance of light on the metal plate is sufficiently high,
The metal plate does not necessarily need to be mirror-finished. That is, a metal mirror obtained by processing a metal plate into a concave shape may be used as the reflecting mirror.

In each of the above embodiments, the case where a metal plate is used as the reflecting mirror is described. However, for example, a white ceramic may be used as the reflecting mirror, or the surface of the ceramic may be plated or plated. A metal-deposited one may be used. Alternatively, an undercoat for increasing the adhesive strength may be applied to the surface of the resin having high heat resistance, and a metal surface or the like may be applied on the coated surface. However, when the reflector is sealed with a light-transmitting material, consideration must be given to the fact that the reflector must be set in a high-temperature mold and the possibility that the mold is damaged by the reflector should be reduced. Then, it is desirable to use a reflecting mirror formed by processing a metal plate.

In the third embodiment, the case where the light emitting element, a part of the lead portion, and the reflecting mirror are sealed with the light transmitting resin has been described. May be sealed. Furthermore, it is not always necessary to seal them with a resin or the like. When resin sealing is not performed, for example, the lead portion and the reflecting mirror are held by a fixing jig or the like.

Further, in the above-described fourth embodiment, a case has been described where dry air is sealed in the housing. For example, an inert gas may be sealed in the housing. This can prevent the reflection mirror from being oxidized.

[0076]

As described above, according to the light emitting diode of the present invention, since the reflecting mirror formed by processing the metal plate into a concave shape is used, the reflecting mirror is resistant to a temperature change. Even under high temperature conditions, wrinkles and the like are not generated on the concave surface of the reflector, and the reflector is not damaged. Therefore, such a light emitting diode can be mounted in a reflow furnace using cream solder. Therefore,
Since the light emitting diode of the present invention can be used without any limitation as a surface mount component, it is particularly suitable for use in applications in which a large amount is mounted.

Even when such a reflecting mirror is used, the light emitting element, a part of the lead portion, and the reflecting mirror are sealed with the light transmitting material, and one surface of the light transmitting material is radiated. By molding as a surface, production can be easily performed using existing production equipment, and thus mass production of light emitting diodes can be achieved.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a light emitting diode according to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of the light emitting diode as viewed in the direction of arrows AA.

FIG. 3 is a schematic rear view of the light emitting diode.

FIG. 4 is a schematic partial enlarged cross-sectional view for explaining a state when the light emitting diode is manufactured by a transfer molding method.

FIG. 5 is a schematic plan view of a light emitting diode according to a second embodiment of the present invention.

FIG. 6 is a schematic sectional view of the light emitting diode as viewed in the direction of arrows BB.

FIG. 7 is a schematic rear view of the light emitting diode.

FIG. 8 is a schematic cross-sectional view for explaining a state when the light emitting diode is manufactured by a potting mold method.

FIG. 9 is a schematic plan view of a light emitting diode according to a third embodiment of the present invention.

FIG. 10 is a schematic sectional view of the light emitting diode as viewed in the direction of arrows CC.

FIG. 11 is a schematic rear view of the light emitting diode.

FIG. 12 is a schematic plan view of a part of a lead frame used when manufacturing the light emitting diode by the first method.

FIG. 13 is a schematic plan view of a part of the lead frame in a state where the fan-shaped portion in FIG. 12 is folded.

FIG. 14 is a schematic plan view of a part of two lead frames used when manufacturing the light emitting diode by a second method.

FIG. 15 is a schematic sectional view of a light emitting diode which is a first modification of the third embodiment.

FIG. 16 is a schematic rear view of the light emitting diode.

FIG. 17 is a schematic rear view of a light emitting diode which is a second modification of the third embodiment.

FIG. 18 is a schematic plan view of a light emitting diode according to a fourth embodiment of the present invention.

FIG. 19 is a schematic cross-sectional view of the light-emitting diode as viewed in the direction of arrows DD.

FIG. 20 is a schematic cross-sectional view of a reflection type light emitting diode as a first conventional example.

FIG. 21 is a schematic sectional view of a reflection type light emitting diode as a second conventional example.

[Explanation of symbols]

10a, 10b, 10c, 10d Light emitting diode 11 Light emitting element 12a, 12b, 120a, 120b, 121a, 12
1b Lead portion 13 Wire 14 Light transmissive material 15, 16, 17, 170, 180, 19 Reflector 15a Projection 16a Through hole 17a, 17b, 17c, 17d, 171, 181, 1
82 Reflector piece 21 Radiating surface 22 Insulator 23 Radiating plate 24 Housing 24a Step 25 Resin 31 Upper mold 32 Lower mold 32a Groove 40, 40a, 40b Lead frame 41a, 41b, 41c, 41d Fan-shaped part 42 Connection Portion 42a Arc-shaped connection portion 42b Linear connection portion 43 hole

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor ▲ Taka ▼ Yuji Hashiga, Ochiai, 1-chome, Kasuga-cho, Nishi-Kasugai-gun, Aichi Prefecture Inside Toyoda Gosei Co., Ltd. (72) Inventor Koji Uchida 1-1-20 Fujimi-cho, Gyoda, Saitama Address Iwasaki Electric Co., Ltd. Development Center F-term (reference) 5F041 AA31 DA12 DA17 DA44 DA59 EE23

Claims (9)

[Claims] A light-emitting element; a lead portion for supplying power to the light-emitting element; a reflecting mirror provided to face a light-emitting surface of the light-emitting element; a light-emitting element; a part of the lead portion; A light-transmitting material for sealing the reflecting mirror, and a radiation surface for emitting light reflected by the reflecting mirror to the outside, wherein the reflecting mirror is a metal mirror formed by processing a metal plate into a concave shape or a concave surface of the metal mirror. A light emitting diode, wherein the light emitting surface is a surface of the light transmissive material located on the back side of the light emitting element. 2. The light emitting diode according to claim 1, wherein a through hole is provided in a central portion of said reflecting mirror. 3. A light-emitting element, a lead portion for supplying power to the light-emitting element, a reflecting mirror provided to face a light-emitting surface of the light-emitting element, and radiating light reflected by the reflecting mirror to the outside. A light-emitting diode, comprising: a radiation surface; and the reflecting mirror being a metal mirror processed into a concave shape by combining a plurality of metal pieces or a mirror-finished surface of the concave surface of the metal mirror. 4. The light-emitting element, a part of the lead portion, and the reflecting mirror are sealed with a light-transmitting material, and the light-emitting surface is located on the back side of the light-emitting element. 4. The surface of a permeable material.
A light-emitting diode as described. 5. A light-emitting element, a lead for supplying power to the light-emitting element, a reflecting mirror provided to face a light-emitting surface of the light-emitting element, and an external light-transmitting light reflected by the reflecting mirror. A radiating plate, and a housing for housing the light emitting element, a part of the lead and the reflecting mirror, wherein the reflecting mirror is a metal mirror formed by processing a metal plate into a concave shape or a concave surface of the metal mirror. A light-emitting diode which has been mirror-finished, and wherein the radiation plate is attached to the housing and a space surrounded by the radiation plate and the housing is sealed. 6. The light emitting diode according to claim 5, wherein a phosphor is provided inside the radiation plate or on an inner surface of the radiation plate. 7. The light emitting diode according to claim 1, wherein the reflecting mirror is formed using a metal plate material on which the lead portion is formed. 8. The mirror according to claim 1, wherein the reflection mirror is formed using a metal plate material different from a metal plate material on which the lead portion is formed. Light emitting diode. 9. A light-emitting element, a lead for supplying power to the light-emitting element, a reflecting mirror provided to face a light-emitting surface of the light-emitting element, the light-emitting element, a part of the lead, and a light-emitting element. A light-transmitting material for sealing the reflector, and a radiation surface for radiating light reflected by the reflector to the outside, wherein the reflector is formed of ceramic or resin in a concave shape, and the radiation surface Is a surface of the light transmissive material located on the back side of the light emitting element.