CN210325851U

CN210325851U - LED packaging structure

Info

Publication number: CN210325851U
Application number: CN201921368688.3U
Authority: CN
Inventors: 刘永; 张志宽
Original assignee: Shenzhen Jufei Optoelectronics Co Ltd
Current assignee: Shenzhen Jufei Optoelectronics Co Ltd
Priority date: 2019-08-21
Filing date: 2019-08-21
Publication date: 2020-04-14
Anticipated expiration: 2029-08-21

Abstract

The utility model discloses a LED packaging structure, which comprises a substrate, a light-emitting chip, a light-transmitting glue and a light-reflecting glue; the light-emitting chip is arranged on the substrate, the light-transmitting glue wraps the light-emitting chip, the light-reflecting glue is fixed on the light-transmitting glue, the light-reflecting glue is opposite to the light-emitting chip in a separated mode, and the surface of the light-reflecting glue opposite to the light-emitting chip is a curved surface; the light reflecting glue reflects the light emitted by the light emitting chip to the substrate, and the substrate reflects the light reflected by the light reflecting glue; therefore, the light emitted by the light emitting chip can enlarge the irradiation range, namely after the LED packaging structure is applied, the requirement of optical distance can be met through a small number of LEDs, and the problem that the LEDs are too many and difficult to radiate is avoided.

Description

LED packaging structure

Technical Field

The utility model relates to a LED's technical field, in particular to LED packaging structure.

Background

For the Mini LED applied to the backlight, due to the requirement of ultrathin terminals, the combination of cost and control difficulty requires that the chips can realize smaller light mixing distance under the condition of wider LED chip arrangement distance, so that the thickness of the whole machine is reduced, and therefore, the key points are how to realize light output regulation and control of the chips and the consistency in the later use process.

However, the Mini LED product has a large number of LEDs, for example, a 5.5 inch FHD screen, the number of LEDs used is as high as 2000-10000, and a long optical distance is required when the number of LEDs is small, so that the thickness of the whole device is increased, and when the number of LEDs is large, although the optical distance required by the backlight can be shortened and the uniformity is good, the heat dissipation problem is derived and the cost is greatly increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED packaging structure to solve current LED and can't compromise optical distance and radiating problem.

In order to solve the above technical problem, the utility model provides a LED packaging structure, which comprises a substrate, a light emitting chip, a light transmitting glue and a light reflecting glue; the light-emitting chip is arranged on the substrate, the light-transmitting glue wraps the light-emitting chip, the light-reflecting glue is fixed on the light-transmitting glue, the light-reflecting glue is opposite to the light-emitting chip in a separated mode, and the surface of the light-reflecting glue opposite to the light-emitting chip is a curved surface; the light reflecting glue reflects the light emitted by the light emitting chip to the substrate, and the substrate reflects the light reflected by the light reflecting glue.

The light reflecting glue protrudes towards the light emitting chip to form the curved surface.

Wherein, the curved surface is a spherical surface.

Wherein, the light-emitting chip is completely arranged in the covering range of the reflective glue.

The position of the light-transmitting glue opposite to the light-emitting chip is provided with a concave hole, the concave hole is formed in the outer surface of the light-transmitting glue, and the reflective glue is arranged in the concave hole.

The surface of the substrate for mounting the light-emitting chip is covered with a light-reflecting coating.

Wherein, the surface of the light reflecting coating is a rough surface.

Wherein, the transparent glue is fluorescent glue or transparent glue.

Wherein the reflective glue is reflective white glue.

Wherein, the curved surface is a rough surface.

The utility model has the advantages as follows:

the light reflecting glue is opposite to the light emitting chip in a separated mode, light rays emitted by the light emitting chip are reflected to the substrate through the light reflecting glue, the light rays reflected by the light reflecting glue are reflected out through the substrate, the irradiation range of the light rays emitted by the light emitting chip can be enlarged, the requirement for optical distance can be met through a small number of LEDs after the LED packaging structure is applied, and the problem that the LEDs are too many and difficult to radiate is solved.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings required for the embodiments will be briefly described below, and obviously, the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic cross-sectional view of an embodiment of an LED package structure of the present invention;

FIG. 2 is a schematic diagram of the optical path of FIG. 1;

fig. 3 is a disassembled view of fig. 1.

The reference numbers are as follows:

10. a substrate; 20. a light emitting chip; 30. a light-transmitting adhesive; 31. concave holes; 40. a reflective glue; 41. a curved surface; 50. and a copper wire.

Detailed Description

The technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

As can be seen from fig. 1 to 3, the LED package structure according to the embodiment of the present invention includes a substrate 10, a light emitting chip 20, a transparent adhesive 30 and a reflective adhesive 40; the light emitting chip 20 is mounted on the substrate 10, the light transmitting glue 30 wraps the light emitting chip 20, the light reflecting glue 40 is fixed on the light transmitting glue 30, the light reflecting glue 40 is opposite to the light emitting chip 20 in a separated manner, and the surface of the light reflecting glue 40 opposite to the light emitting chip 20 is a curved surface 41; the light reflecting glue 40 reflects the light emitted by the light emitting chip 20 to the substrate 10, and the substrate 10 reflects the light reflected by the light reflecting glue 40.

As shown in fig. 1, at this time, a copper line 50 is mounted on the upper surface of the substrate 10, the copper line 50 is welded to the light emitting chip 20 by a welding material, so that the light emitting chip 20 can be mounted and fixed on the substrate 10, and in application, the copper line 50 can obtain electric energy for the light emitting chip 20 from the outside.

When the light emitting chip 20 emits light, the light will irradiate onto the curved surface 41 of the reflective glue 40, then the reflective glue 40 reflects the light onto the substrate 10, and the light can be emitted through the transparent glue 30 by re-reflecting the light by the substrate 10; compared with the scheme that light rays are directly emitted through the light-transmitting glue 30, the light-reflecting glue 40 and the substrate 10 are matched to enlarge the irradiation range of the light rays, namely the requirement of optical distance can be met through a small number of LEDs, and the problem that the LEDs are too many and difficult to radiate is avoided.

The reflective glue 40 is used for reflecting light to the substrate 10, and after the surface of the reflective glue 40 facing the light emitting chip 20 is set as the curved surface 41, the reflective glue 40 can be ensured to reflect light to the substrate 10; however, the curved surface 41 has different shapes, which causes different light reflection effects.

In order to ensure that the reflective glue 40 can have a better reflection effect, as shown in fig. 1 and 3, the reflective glue 40 may be preferably arranged to protrude toward the light emitting chip 20 to form the curved surface 41, and compared with the reflective glue 40 which is recessed inward to form the curved surface 41, the way of protruding the curved surface 41 can prevent the curved surface 41 from shielding the reflected light, so that more light can be directly reflected onto the substrate 10, thereby improving the reflection effect.

In order to improve the uniformity of the light reflection effect, it is preferable that the curved surface 41 is a spherical surface, and the uniform linear change of the curvature of each part of the spherical surface ensures the uniform reflection degree of the light, thereby achieving the uniform emission of the light.

Wherein, set up to the smooth surface for with curved surface 41, more can preferably set up curved surface 41 is the rough surface, and the rough surface has stronger light reflection ability for the smooth surface to make the light that emitting chip 20 jetted out can better reflection shoot out, thereby optimized illuminating effect.

In addition, the arrangement manner of disposing the light emitting chip 20 and the reflective glue 40 is not exclusive, the light emitting chip 20 may be only partially disposed in the coverage area of the reflective glue 40, or may be disposed completely in the coverage area of the reflective glue 40, and in order to achieve a better reflection effect, as shown in fig. 1, the light emitting chip 20 may be preferably disposed completely in the coverage area of the reflective glue 40.

Through the total sheltering from of reflection of light glue 40 to emitting chip 20, can make the light that emitting chip 20 jetted out shine to reflection of light glue 40 more on, guaranteed promptly that reflection of light glue 40 can realize the expansion of angle of illumination to more light to make the expansion of angle of illumination and the stability of shining the effect realize jointly.

Further, for the installation that realizes that the reflection of light glues 40 is fixed, usable light-transmitting glue 30 wraps up reflection of light glue 40, also can directly locate the surface that the light-transmitting glued 30 with reflection of light glue 40, but in order to reduce the installation degree of difficulty that the light-transmitting glued 40 and improve the installation fastness that the light-transmitting glued 40, as shown in fig. 1 and 3, but preferred setting the light-transmitting glued 30 with the position that luminous chip 20 is relative is equipped with shrinkage pool 31, shrinkage pool 31 is located the surface that the light-transmitting glued 30, reflection of light glues 40 and is located in the shrinkage pool 31.

Therefore, in the production process, the light-transmitting glue 30 can be firstly utilized to wrap the light-emitting chip 20, after the light-emitting chip 20 is fixed, the light-reflecting glue 40 can be filled in the concave hole 31 as long as the concave hole 31 is formed by hollowing the outer surface of the light-transmitting glue 30 through a stamping process and the like, and the mode is simple to process, can ensure that the light-reflecting glue 40 is firmly fixed, and provides important help for the production of the LED packaging structure.

For the substrate 10, the surface of the substrate 10 facing the transparent adhesive 30 is provided with a reflective film or coated with a reflective material, etc. for reflecting light, so that the light can be emitted through the transparent adhesive 30, and in order to improve the light reflection effect of the substrate 10, the surface of the substrate 10 on which the light emitting chips 20 are mounted is preferably provided with a reflective coating (not shown), so that the substrate 10 can have a better reflection effect.

And similar with curved surface 41, can set up the surface of reflection of light coating is rough surface, sets up to the smooth surface for the surface with reflection of light coating, and rough surface has stronger light reflection ability for the smooth surface to make the reflection that the light that luminous chip 20 jetted out can be better to emit, with the luminous angle that enlarges luminous chip 20, thereby optimized the illuminating effect.

It should also be pointed out that above-mentioned reflecting glue 40 is used for carrying out the light reflection, and this purpose can be realized to most lighttight material homoenergetic, like silica gel and lighttight ebonite etc. it has better reflection effect in order to make reflecting glue 40, but preferred setting reflecting glue 40 is the white glue of reflection of light, and the white glue of reflection of light provides the guarantee for the reflection effect of light through the high reflectivity of self.

Similarly, the transparent adhesive 30 is used for light projection, so that the transparent adhesive 30 can be made of a transparent material, for example, the transparent adhesive 30 can be preferably made of a fluorescent adhesive or a transparent adhesive.

The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.

Claims

1. An LED packaging structure is characterized by comprising a substrate, a light-emitting chip, light-transmitting glue and light-reflecting glue; the light-emitting chip is arranged on the substrate, the light-transmitting glue wraps the light-emitting chip, the light-reflecting glue is fixed on the light-transmitting glue, the light-reflecting glue is opposite to the light-emitting chip in a separated mode, and the surface of the light-reflecting glue opposite to the light-emitting chip is a curved surface; the light reflecting glue reflects the light emitted by the light emitting chip to the substrate, and the substrate reflects the light reflected by the light reflecting glue.

2. The LED package structure of claim 1, wherein the reflective glue protrudes toward the light emitting chip to form the curved surface.

3. The LED package structure of claim 2, wherein the curved surface is a spherical surface.

4. The LED package structure of claim 1, wherein the light emitting chip is completely disposed within a coverage area of the reflective glue.

5. The LED package structure of claim 1, wherein a recess is formed in a portion of the transparent adhesive opposite to the light emitting chip, the recess is formed in an outer surface of the transparent adhesive, and the reflective adhesive is formed in the recess.

6. The LED package structure of claim 1, wherein the surface of the substrate on which the light emitting chip is mounted is covered with a light reflecting coating.

7. The LED package structure of claim 6, wherein the surface of the light reflecting coating is roughened.

8. The LED package structure according to any one of claims 1 to 7, wherein the light-transmitting adhesive is a fluorescent adhesive or a transparent adhesive.

9. The LED package structure according to any one of claims 1 to 7, wherein the light reflecting glue is a light reflecting white glue.

10. The LED package structure according to any one of claims 1 to 7, wherein the curved surface is a rough surface.