JP2001165632A - 検査装置及び検査方法 - Google Patents
検査装置及び検査方法Info
- Publication number
- JP2001165632A JP2001165632A JP34546599A JP34546599A JP2001165632A JP 2001165632 A JP2001165632 A JP 2001165632A JP 34546599 A JP34546599 A JP 34546599A JP 34546599 A JP34546599 A JP 34546599A JP 2001165632 A JP2001165632 A JP 2001165632A
- Authority
- JP
- Japan
- Prior art keywords
- inspection
- light
- concave
- convex portion
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Landscapes
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34546599A JP2001165632A (ja) | 1999-12-03 | 1999-12-03 | 検査装置及び検査方法 |
EP00125360A EP1113262A3 (en) | 1999-12-03 | 2000-11-30 | Inspection apparatus and method |
US09/727,143 US6559937B2 (en) | 1999-12-03 | 2000-11-30 | Inspection apparatus and method |
KR1020000072296A KR20010062041A (ko) | 1999-12-03 | 2000-12-01 | 검사 장치 및 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34546599A JP2001165632A (ja) | 1999-12-03 | 1999-12-03 | 検査装置及び検査方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001165632A true JP2001165632A (ja) | 2001-06-22 |
Family
ID=18376790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP34546599A Withdrawn JP2001165632A (ja) | 1999-12-03 | 1999-12-03 | 検査装置及び検査方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6559937B2 (ko) |
EP (1) | EP1113262A3 (ko) |
JP (1) | JP2001165632A (ko) |
KR (1) | KR20010062041A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018185309A (ja) * | 2017-04-26 | 2018-11-22 | エーエスエム・テクノロジー・シンガポール・ピーティーイー・リミテッド | 基板切断制御と検査 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6204917B1 (en) * | 1998-09-22 | 2001-03-20 | Kla-Tencor Corporation | Backside contamination inspection device |
JP4901090B2 (ja) * | 2004-10-06 | 2012-03-21 | 株式会社ニコン | 欠陥検査方法及び欠陥検出装置 |
US7449348B1 (en) * | 2004-06-02 | 2008-11-11 | Advanced Micro Devices, Inc. | Feedback control of imprint mask feature profile using scatterometry and spacer etchback |
WO2006014152A1 (en) * | 2004-07-01 | 2006-02-09 | Midwest Research Institute | Optic probe for semiconductor characterization |
CN1300549C (zh) * | 2005-05-20 | 2007-02-14 | 浙江大学 | 图像传感器细分纳米分辨率光栅测量方法 |
JP4654086B2 (ja) * | 2005-07-29 | 2011-03-16 | 本田技研工業株式会社 | 弾性部材の品質評価方法及び装置 |
JPWO2007058188A1 (ja) * | 2005-11-15 | 2009-04-30 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
US7589832B2 (en) * | 2006-08-10 | 2009-09-15 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device method |
KR101992016B1 (ko) * | 2017-09-01 | 2019-06-21 | 한국광기술원 | 광원 및 초점 자동 제어 기능을 가지는 안저 형광 영상 획득 장치 및 방법 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3306194A1 (de) * | 1982-02-25 | 1983-09-08 | Mitsubishi Denki K.K., Tokyo | Verfahren zur pruefung von schraubenoberflaechen auf fehler und vorrichtung zu seiner durchfuehrung |
US4641967A (en) | 1985-10-11 | 1987-02-10 | Tencor Instruments | Particle position correlator and correlation method for a surface scanner |
US4724322A (en) * | 1986-03-03 | 1988-02-09 | Applied Materials, Inc. | Method for non-contact xyz position sensing |
US4952058A (en) * | 1987-04-27 | 1990-08-28 | Hitach, Ltd. | Method and apparatus for detecting abnormal patterns |
US5151584A (en) | 1988-07-20 | 1992-09-29 | Applied Materials, Inc. | Method and apparatus for endpoint detection in a semiconductor wafer etching system |
US5486919A (en) * | 1992-04-27 | 1996-01-23 | Canon Kabushiki Kaisha | Inspection method and apparatus for inspecting a particle, if any, on a substrate having a pattern |
JPH0728226A (ja) * | 1993-04-30 | 1995-01-31 | Internatl Business Mach Corp <Ibm> | 領域的イメージを測定する装置及び方法 |
JP2000223541A (ja) * | 1999-01-27 | 2000-08-11 | Hitachi Ltd | 欠陥検査装置およびその方法 |
-
1999
- 1999-12-03 JP JP34546599A patent/JP2001165632A/ja not_active Withdrawn
-
2000
- 2000-11-30 EP EP00125360A patent/EP1113262A3/en not_active Withdrawn
- 2000-11-30 US US09/727,143 patent/US6559937B2/en not_active Expired - Fee Related
- 2000-12-01 KR KR1020000072296A patent/KR20010062041A/ko not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018185309A (ja) * | 2017-04-26 | 2018-11-22 | エーエスエム・テクノロジー・シンガポール・ピーティーイー・リミテッド | 基板切断制御と検査 |
TWI686603B (zh) * | 2017-04-26 | 2020-03-01 | 新加坡商先進科技新加坡有限公司 | 用於檢查襯底之檢查系統、襯底切割設備、檢查襯底之方法及襯底切割技術 |
Also Published As
Publication number | Publication date |
---|---|
US6559937B2 (en) | 2003-05-06 |
US20010021014A1 (en) | 2001-09-13 |
EP1113262A3 (en) | 2002-04-10 |
KR20010062041A (ko) | 2001-07-07 |
EP1113262A2 (en) | 2001-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20070206 |