JP2001165632A - 検査装置及び検査方法 - Google Patents

検査装置及び検査方法

Info

Publication number
JP2001165632A
JP2001165632A JP34546599A JP34546599A JP2001165632A JP 2001165632 A JP2001165632 A JP 2001165632A JP 34546599 A JP34546599 A JP 34546599A JP 34546599 A JP34546599 A JP 34546599A JP 2001165632 A JP2001165632 A JP 2001165632A
Authority
JP
Japan
Prior art keywords
inspection
light
concave
convex portion
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP34546599A
Other languages
English (en)
Japanese (ja)
Inventor
Hitoshi Tamada
仁志 玉田
Yutaka Imai
裕 今井
Ayumi Taguchi
歩 田口
Hiroyuki Wada
裕之 和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP34546599A priority Critical patent/JP2001165632A/ja
Priority to EP00125360A priority patent/EP1113262A3/en
Priority to US09/727,143 priority patent/US6559937B2/en
Priority to KR1020000072296A priority patent/KR20010062041A/ko
Publication of JP2001165632A publication Critical patent/JP2001165632A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers

Landscapes

  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP34546599A 1999-12-03 1999-12-03 検査装置及び検査方法 Withdrawn JP2001165632A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP34546599A JP2001165632A (ja) 1999-12-03 1999-12-03 検査装置及び検査方法
EP00125360A EP1113262A3 (en) 1999-12-03 2000-11-30 Inspection apparatus and method
US09/727,143 US6559937B2 (en) 1999-12-03 2000-11-30 Inspection apparatus and method
KR1020000072296A KR20010062041A (ko) 1999-12-03 2000-12-01 검사 장치 및 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34546599A JP2001165632A (ja) 1999-12-03 1999-12-03 検査装置及び検査方法

Publications (1)

Publication Number Publication Date
JP2001165632A true JP2001165632A (ja) 2001-06-22

Family

ID=18376790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34546599A Withdrawn JP2001165632A (ja) 1999-12-03 1999-12-03 検査装置及び検査方法

Country Status (4)

Country Link
US (1) US6559937B2 (ko)
EP (1) EP1113262A3 (ko)
JP (1) JP2001165632A (ko)
KR (1) KR20010062041A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018185309A (ja) * 2017-04-26 2018-11-22 エーエスエム・テクノロジー・シンガポール・ピーティーイー・リミテッド 基板切断制御と検査

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6204917B1 (en) * 1998-09-22 2001-03-20 Kla-Tencor Corporation Backside contamination inspection device
JP4901090B2 (ja) * 2004-10-06 2012-03-21 株式会社ニコン 欠陥検査方法及び欠陥検出装置
US7449348B1 (en) * 2004-06-02 2008-11-11 Advanced Micro Devices, Inc. Feedback control of imprint mask feature profile using scatterometry and spacer etchback
WO2006014152A1 (en) * 2004-07-01 2006-02-09 Midwest Research Institute Optic probe for semiconductor characterization
CN1300549C (zh) * 2005-05-20 2007-02-14 浙江大学 图像传感器细分纳米分辨率光栅测量方法
JP4654086B2 (ja) * 2005-07-29 2011-03-16 本田技研工業株式会社 弾性部材の品質評価方法及び装置
JPWO2007058188A1 (ja) * 2005-11-15 2009-04-30 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
US7589832B2 (en) * 2006-08-10 2009-09-15 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device method
KR101992016B1 (ko) * 2017-09-01 2019-06-21 한국광기술원 광원 및 초점 자동 제어 기능을 가지는 안저 형광 영상 획득 장치 및 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3306194A1 (de) * 1982-02-25 1983-09-08 Mitsubishi Denki K.K., Tokyo Verfahren zur pruefung von schraubenoberflaechen auf fehler und vorrichtung zu seiner durchfuehrung
US4641967A (en) 1985-10-11 1987-02-10 Tencor Instruments Particle position correlator and correlation method for a surface scanner
US4724322A (en) * 1986-03-03 1988-02-09 Applied Materials, Inc. Method for non-contact xyz position sensing
US4952058A (en) * 1987-04-27 1990-08-28 Hitach, Ltd. Method and apparatus for detecting abnormal patterns
US5151584A (en) 1988-07-20 1992-09-29 Applied Materials, Inc. Method and apparatus for endpoint detection in a semiconductor wafer etching system
US5486919A (en) * 1992-04-27 1996-01-23 Canon Kabushiki Kaisha Inspection method and apparatus for inspecting a particle, if any, on a substrate having a pattern
JPH0728226A (ja) * 1993-04-30 1995-01-31 Internatl Business Mach Corp <Ibm> 領域的イメージを測定する装置及び方法
JP2000223541A (ja) * 1999-01-27 2000-08-11 Hitachi Ltd 欠陥検査装置およびその方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018185309A (ja) * 2017-04-26 2018-11-22 エーエスエム・テクノロジー・シンガポール・ピーティーイー・リミテッド 基板切断制御と検査
TWI686603B (zh) * 2017-04-26 2020-03-01 新加坡商先進科技新加坡有限公司 用於檢查襯底之檢查系統、襯底切割設備、檢查襯底之方法及襯底切割技術

Also Published As

Publication number Publication date
US6559937B2 (en) 2003-05-06
US20010021014A1 (en) 2001-09-13
EP1113262A3 (en) 2002-04-10
KR20010062041A (ko) 2001-07-07
EP1113262A2 (en) 2001-07-04

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Legal Events

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A300 Application deemed to be withdrawn because no request for examination was validly filed

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Effective date: 20070206