JP2001156218A - Producing method for electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem that an obtained electronic device can not be securely mounted on an external electric circuit board and that sealing of electronic components is complicated. SOLUTION: A mother board 10, which is constituted by laminating upper and lower insulating layers 10a and 10b, has a plurality of wiring board areas 11 located and formed at a central part being partitioned by dividing lines 12, is provided with a hole 13 for notch on each of dividing lines 12 and is provided with a wiring conductor 5 derived from the upper surface of each wiring board area 11 through the inside and the inner wall of the hole 13 for notch to the lower surface, is prepared. Next, electronic components 2 are mounted on the upper surfaces of the respective wiring board areas 11 and respective electrodes thereof are connected to the wiring conductor 5. Next, a resin sealing member 3 is applied in the state of liquid and hardened so as to cover the respective wiring board areas 11 and the respective electronic components 2 and finally, the mother board 10 and the resin sealing member 3 are divided along the dividing line 12. Concerning such a producing method for electronic device, when applying the resin sealing member 3 in the state of liquid, that member does not flow into the hole 13 for notch, where the wiring conductor 5 is attached.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component such as a semiconductor element and a piezoelectric vibrator on a small-sized wiring board, and sealing the electronic component with a resin sealing material. And a method for manufacturing a resin-sealed electronic device.

[0002]

2. Description of the Related Art Conventionally, as a resin-sealed small electronic device mounted on an information processing device such as a computer or a communication terminal device such as a portable telephone, for example, a sectional view in FIG. 5 and a perspective view in FIG. As described above, it is made of an electrically insulating material such as an aluminum oxide sintered body, and has a plurality of cutouts 22 penetrating vertically on the side surface thereof, and a cutout 22
An electronic component 24 such as a semiconductor element is mounted on a small wiring board 21 having a size of about several mm square, which is formed by attaching a plurality of wiring conductors 23 led out to the lower surface through Is mounted so as to be electrically connected to the wiring conductor 23, and the electronic component is mounted on the center of the upper surface of the wiring board 21.
There is known an electronic device in which an electronic component 24 is hermetically sealed by fixing a resin sealing material 25 made of a resin such as an epoxy resin so as to cover the electronic component 24.

In this conventional electronic device, a portion of the wiring conductor 23 led out to the lower surface of the wiring board 21 is brought into contact with a connection conductor of an external electric circuit board, and the wiring conductor 23 is connected to the connection conductor of the external electric circuit board. Are mounted on an external electric circuit board by soldering, and each electrode of the electronic component 24 to be mounted at the same time is electrically connected to the external electric circuit via the wiring conductor 23. When this electronic device is mounted on an external electric circuit board via solder, a gap between a wiring conductor 23 attached in a notch 22 formed on a side surface of the wiring board 21 and a connection conductor of the external electric circuit board is obtained. The solder pool is formed three-dimensionally and well, and is extremely firmly mounted on the external electric circuit board.

[0004] Such a conventional electronic device is manufactured by integrally arranging a large number of electronic devices vertically and horizontally in order to facilitate handling at the time of manufacturing and to increase manufacturing efficiency. It is manufactured by a multi-cavity manufacturing method.

More specifically, as shown in the cross-sectional view of FIG.
31 is divided by a dividing line 32 which is an imaginary line so as to be integrally arrayed vertically and horizontally and a dividing line 32 dividing each wiring board region 31
A through-hole 33 is formed on the upper surface, and a mother board 30 is prepared by providing a plurality of wiring conductors 23 extending from the upper surface of each wiring board region 31 to the lower surface via the inner wall of the through-hole 33. An electronic component 24 is mounted on each wiring board region 31 such that each electrode thereof is electrically connected to a corresponding wiring conductor 23, and an electronic component is mounted on a central portion of the upper surface of each wiring board region 31.
After a resin sealing material 25 is dropped in a liquid state so as to cover 24, the resin sealing material 25 is cured and fixed, and finally, the mother substrate 30 is divided along the dividing line 32, whereby a large number of pieces are simultaneously intensively integrated. It is manufactured in.

[0006]

However, in the conventional method of manufacturing an electronic device, each wiring board region 31 of the mother board 30 is not used.
When the resin sealing material 25 is dropped in a liquid state so as to cover the electronic component 24 on the upper surface, a part of the liquid resin sealing material 25 is likely to flow into the through hole 33 due to its fluidity. .
When the resin encapsulant 25 flows into the through-hole 33, the resin encapsulant 25 covers the wiring conductor 23 attached to the notch 22 of the wiring board 21 in the obtained electronic device. Sisters,
As a result, when the electronic device is mounted on the external electric circuit board, a three-dimensional solder pool is not formed well between the wiring conductor 23 in the notch 22 and the connection conductor of the external electric circuit board. There has been a problem that the electronic device cannot be firmly mounted on the external electric circuit board.

In this conventional method of manufacturing an electronic device, when a resin sealing material 25 is dropped in a liquid state on the upper surface of each wiring board region 31 of the mother board 30 so as to cover the electronic component 24,
In order to prevent the resin encapsulant 25 from flowing into the through holes 33, it is necessary to individually drop the resin encapsulant 25 at the center of each wiring board region 31. Is extremely complicated.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide an obtained electronic device in which a wiring conductor in a cutout formed in a side surface of a wiring board is made of a resin sealing material. It is an object of the present invention to provide a method of manufacturing an electronic device which can be firmly mounted on an external electric circuit without being covered by a device.

Another object of the present invention is to provide an electronic device which is simple in that a resin sealing material is dropped in a liquid state on the upper surface of each wiring board region of a mother board so as to cover the electronic component. It is to provide a manufacturing method of.

[0010]

A method of manufacturing an electronic device according to the present invention comprises laminating an upper insulating layer and a lower insulating layer, and forming a vertical and horizontal array, each of which is separated by a dividing line at the center. A plurality of wiring board areas, and a notch hole whose upper end is closed by an upper insulating layer through a lower insulating layer on a dividing line separating each wiring board area, and each wiring board area Preparing a mother board provided with a wiring conductor leading out from the upper surface to the lower surface through the inside and the inner wall of the notch hole, mounting electronic components on the upper surface of each wiring board region of the mother board, and A step of electrically connecting each electrode to a wiring conductor, and a step of applying and curing a resin sealing material in a liquid form so as to cover each wiring board area and each electronic component over the entire wiring board area on the mother board. And mother board and resin sealing material It is characterized in that it comprises a step of dividing along the dividing line.

According to the method of manufacturing an electronic device of the present invention, the mother substrate is formed by laminating an upper insulating layer and a lower insulating layer, and the lower insulating layer is formed on a dividing line for dividing each wiring board region. And a wiring conductor extending from the upper surface of each wiring board region to the inside and the lower surface through the inner wall of the notch hole. Therefore, when the resin sealing material is applied in a liquid state on the mother board so as to cover each wiring board area and the electronic component, the resin sealing material does not flow into the notch holes at all.

According to the method of manufacturing an electronic device of the present invention, a resin sealing material is applied in a liquid state so as to cover each wiring board area and each electronic component over the entire wiring board area on the mother board. Therefore, the resin sealing material can be applied to each wiring board region collectively.

[0013]

Next, a method for manufacturing an electronic device according to the present invention will be described with reference to the accompanying drawings.

FIGS. 2 and 3 are a sectional view and a perspective view, respectively, showing an embodiment of an electronic device manufactured by the manufacturing method of the present invention, wherein 1 is a wiring board, 2 is an electronic component, and 3 is It is a resin sealing material.

The wiring board 1 is made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, a silicon carbide sintered body, and a glass ceramic. The upper insulating layer 1a and the lower insulating layer 1b are laminated in a substantially square plate shape. On the side surface of the lower insulating layer 1b, the upper end has an upper insulating layer 1b.
a plurality of cutouts 4 are formed, which are covered with tungsten, molybdenum, copper, etc. from the upper surface of the upper insulating layer 1a to the inside and the lower surface of the lower insulating layer 1b via the cutouts 4. A plurality of wiring conductors 5 made of a metal powder of silver or the like are adhered and formed.

The wiring board 1 supports the electronic component 2 and the wiring conductor 5 functions as a conductive path for connecting each electrode of the electronic component 2 to an external electric circuit board, and the electronic component 2 is mounted on the upper surface thereof. Have been. The wiring conductor 5 is usually provided with a nickel plating having a thickness of about 1 to 10 μm and a gold plating having a thickness of about 0.1 to 3 μm on the surface thereof.

The electronic component 2 mounted on the wiring board 1 is a semiconductor element such as a semiconductor integrated circuit element, for example, and has a plurality of electrodes (not shown) on the lower surface thereof. Each of the electrodes is electrically connected to the wiring conductor 5 via a bump 6 made of, for example, solder or gold. In this example, the electronic component 3 has an electrode on its lower surface and each electrode and the wiring conductor 5 are electrically connected via a bump 6. However, the electronic component 3 has an electrode on its upper surface and The electrode may be electrically connected to the wiring conductor 5 via a bonding wire or the like.

A resin sealing material 3 made of a resin such as epoxy resin is fixed on the upper surface of the wiring board 1 so as to cover the entire surface and the electronic component 2. The resin sealing material 3 is fixed on the wiring board 1 so as to cover the electronic component 2, thereby functioning as a protection member that hermetically seals the electronic component 2 and protects the electronic component 2 from the external environment.

In this electronic device, the wiring substrate 5 is
Are mounted on the external electric circuit board by connecting the portions adhered to the inside and the lower surface of the notch 4 to the connection conductors of the external electric circuit board via solder, whereby each electrode of the electronic component 2 is connected to the wiring. It is electrically connected to an external electric circuit via the conductor 5. At this time, the solder pool is well formed three-dimensionally between the wiring conductor 5 attached in the notch 4 formed on the side surface of the wiring board 1 and the connection conductor of the external electric circuit board. The electronic device is very firmly mounted on the external electric circuit board.

Next, a method of manufacturing the above electronic device by applying the manufacturing method of the present invention will be described in the order of steps.

First, as shown in the sectional view of FIG.
The upper insulating layer 10a mainly composed of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, a silicon carbide sintered body, and a glass ceramic. A lower insulating layer 10b is laminated, and a large number of wiring board areas 11 each of which becomes the wiring board 1 are formed in the center by dividing the board by dividing lines 12 which are imaginary lines and arranged vertically and horizontally. A notch hole 13 whose upper end is closed by the upper insulating layer 10a is formed through the lower insulating layer 10b on the dividing line 12 that separates the inner and the through holes 13 from the upper surface of each wiring board region 11. A mother substrate 10 is prepared by depositing and forming a wiring conductor 5 made of metal powder of a metal powder such as tungsten, molybdenum, copper, silver or the like led out to the lower surface through the inner wall of the substrate.

If the upper insulating layer 10a and the lower insulating layer 10b are made of an aluminum oxide sintered body, the mother substrate 10 is suitable for a raw material powder of aluminum oxide, silicon oxide, calcium oxide, magnesium oxide or the like. The mixture is mixed with an organic binder and a solvent to form a slurry, which is formed into a sheet by employing a well-known doctor blade method to obtain two ceramic green sheets. The green sheet is manufactured by performing appropriate punching and printing a metal paste containing a metal powder such as tungsten or molybdenum, stacking the green sheet on top and bottom, and firing this at a temperature of about 1600 ° C. in a reducing atmosphere. The wiring conductor 5 of the mother board 10 is plated with a plating metal layer such as a nickel plating layer and a gold plating layer to an appropriate thickness on the exposed surface by electrolytic plating or electroless plating.

Next, as shown in the sectional view of FIG.
The electronic component 2 such as a semiconductor integrated circuit element is mounted on the upper surface of each wiring board area 11 of the mother board 10 and its electrodes are connected to the corresponding wiring conductors 5 via bumps 6 made of, for example, solder or gold.
Electrically connected to In order to electrically connect the electrodes of the electronic component 2 to the wiring conductor 5 via the bumps 6 made of solder or gold, for example, the bumps 6 made of solder or gold are previously applied to the electrodes of the electronic component 2. In addition, a method is employed in which the bumps 6 are bonded to the corresponding wiring conductors 5 by welding, pressure bonding, or the like.

Next, as shown in the sectional view of FIG.
Each wiring board area over the entire wiring board area 11 on the mother board 10
11 and a resin sealing material 3 made of a thermosetting resin such as an epoxy resin, a polyimide resin, a phenol resin, a bismaleimide triazine resin, or the like, is applied in a liquid state so as to cover the electronic components 2 mounted thereon. Let it cure.

In order to apply the resin sealing material 3 to the mother substrate 10 in a liquid state, a nozzle capable of discharging a predetermined amount of the liquid resin is arranged on the mother substrate 10 and the nozzle is moved horizontally. A method of discharging a fixed amount of the liquid resin sealing material 3 from the nozzle while moving, a method of applying the liquid resin sealing material 3 on the mother substrate 10 by a screen printing method, or the like can be adopted. At this time, since the notch hole 13 to which the wiring conductor 3 is attached is closed at the upper end by the upper insulating layer 10a, the resin sealing material 3 applied on the mother substrate 10 is not used. It does not flow into the notch hole 13 at all. At the same time, since the resin sealing material 3 is applied over the entire wiring board area 11 on the mother board 10, the resin coating material 3 can be applied on each wiring board area 11 at a time. The workability of applying the sealing material 3 becomes extremely simple. Also, mother board
In order to cure the resin sealing material 3 applied on the top 10, a method of curing by, for example, a thermosetting method or an ultraviolet curing method can be adopted.

Finally, as shown in the sectional view of FIG. 1D, the mother board 10 and the resin sealing material 3 are divided along a dividing line 12 using a diamond cutter or a laser cutter. As shown in FIGS. 2 and 3, the lower insulating layer 1 b has a cutout 4 on the side surface thereof, the upper end of which is closed by the upper insulating layer 1 a, and from the upper surface through the inside and the side surface of the cutout 4. The electronic component 2 is mounted on the wiring board 1 on which the wiring conductor 5 extending to the lower surface is attached so that each electrode is electrically connected to the corresponding wiring conductor 5 via the bump 6. A large number of electronic devices in which a resin sealing material 3 is fixed on the upper surface of the substrate 1 so as to cover the electronic components 2 are simultaneously and intensively manufactured. In this case, since the wiring conductor 5 attached to the side surface of the notch 4 is not covered with the resin sealing material 3 at all, when the electronic device is mounted on the external electric circuit board, the inside of the notch 4 A solder pool is formed between the wiring conductor 5 and the connection conductor of the external electric circuit board in a three-dimensionally favorable manner, and the electronic device is extremely firmly mounted on the external electric circuit board.

Thus, according to the method of manufacturing an electronic device of the present invention, the electronic component 2 is placed on the upper surface of each wiring board region 11 of the mother board 10 such that each electrode is electrically connected to the wiring conductor 5. After mounting, the resin sealing material 3 is applied in a liquid state and cured so as to cover each wiring board area 11 and each electronic component 2 mounted thereon over the entire wiring board area 11 on the mother board 10, Finally, by dividing the mother board 10 and the resinous encapsulant 3 along the dividing line 12, a large number of electronic devices having excellent mounting strength can be simply and simultaneously manufactured.

The present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. For example, as shown in the sectional view of FIG. 4, a frame-shaped dam portion 14 may be provided on the outer peripheral portion of the mother substrate 10, and the resin sealing material 3 may be applied in a liquid state inside the dam portion 14. . In this case, it is possible to effectively prevent the resin sealing material 3 from flowing out of the mother board 10 by the dam portion 14, and to make the thickness of the resin sealing material 3 uniform in the entire wiring board region 11. And an electronic device with small shape variation can be provided. Further, the mechanical strength of the mother substrate 10 can be increased by such a dam portion 14. The dam portion 14 is made of the same material as the insulating layers 10a and 10b.
And may be integrally formed.

[0029]

According to the electronic device manufacturing method of the present invention,
Notch formed by laminating a mother board with an upper insulating layer and a lower insulating layer, penetrating the lower insulating layer on a dividing line that separates each wiring board area, and closing the upper end with the upper insulating layer Since the wiring conductors are provided to extend from the upper surface of each wiring board region to the inside and the lower surface through the inner wall of the notch hole, the wiring board region and the electronic components are covered on the mother board. When applying the resin sealing material in liquid,
The resin sealing material never flows into the notch holes. Therefore, in the obtained electronic device, the wiring conductor adhered to the cutout on the side surface of the wiring board is not covered with the resin sealing material at all, and when this electronic device is mounted on the external electric circuit board, Solder wells are formed three-dimensionally and well between the wiring conductor in the notch and the connection conductor of the external electric circuit board, and the electronic device is extremely firmly mounted on the external electric circuit board. According to the manufacturing method of (1), the resin sealing material is applied in a liquid state so as to cover each wiring board area and each electronic component over the entire wiring board area on the mother board. Coating can be performed collectively on the substrate region, and as a result, the workability of sealing becomes extremely simple.

[Brief description of the drawings]

FIGS. 1A to 1D are cross-sectional views for explaining steps of a method for manufacturing an electronic device according to the present invention.

FIG. 2 is a cross-sectional view illustrating an example of an electronic device manufactured by the method for manufacturing an electronic device of the present invention illustrated in FIG.

FIG. 3 is a perspective view of the electronic device shown in FIG. 2;

FIG. 4 is a cross-sectional view for explaining another example of the method for manufacturing an electronic device of the present invention.

FIG. 5 is a cross-sectional view illustrating an example of an electronic device manufactured by a conventional manufacturing method.

6 is a perspective view of the electronic device shown in FIG.

FIG. 7 is a cross-sectional view for explaining a conventional method for manufacturing an electronic device.

[Explanation of symbols]

 2 ... electronic parts 3 ... resin sealing material 5 ... wiring conductor 10 ... mother board 10 a ... upper insulating layer 10 b ... lower insulating layer 11 ... wiring board area 12 ・ ・ ・ Parting line 13 ・ ・ ・ Notch hole

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M109 AA01 BA03 CA05 CA12 DA06 DA10 DB15 DB16 DB17 EA02 EA07 EA08

Claims (1)

[Claims] A plurality of wiring board regions each formed by laminating an upper insulating layer and a lower insulating layer, each of which is divided by a dividing line and arranged vertically and horizontally at a central portion; A notch hole whose upper end is closed by the upper insulating layer is provided on a parting line dividing the substrate region through the lower insulating layer, and the inner and the notch holes are formed from the upper surface of each wiring board region. Preparing a mother board provided with a wiring conductor leading out to the lower surface via the inner wall of the mother board; mounting an electronic component on the upper surface of each wiring board area of the mother board and connecting each electrode of the electronic component to the wiring conductor A step of applying a resin sealing material in a liquid state and curing the same so as to cover each wiring board area and each electronic component over the entire wiring board area on the mother board; and Substrate and the resin sealing material Method of manufacturing an electronic device characterized by comprising a step of dividing along the dividing line.