JP2001155540A - 導電性微粒子、異方性導電接着剤及び導電接続構造体 - Google Patents
導電性微粒子、異方性導電接着剤及び導電接続構造体Info
- Publication number
- JP2001155540A JP2001155540A JP33811199A JP33811199A JP2001155540A JP 2001155540 A JP2001155540 A JP 2001155540A JP 33811199 A JP33811199 A JP 33811199A JP 33811199 A JP33811199 A JP 33811199A JP 2001155540 A JP2001155540 A JP 2001155540A
- Authority
- JP
- Japan
- Prior art keywords
- fine particles
- conductive
- conductive fine
- value
- particles according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010419 fine particle Substances 0.000 title claims abstract description 112
- 239000000853 adhesive Substances 0.000 title claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 24
- 229910052709 silver Inorganic materials 0.000 claims abstract description 23
- 239000004332 silver Substances 0.000 claims abstract description 23
- 238000013508 migration Methods 0.000 claims abstract description 22
- 230000005012 migration Effects 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 12
- 230000002265 prevention Effects 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 238000011084 recovery Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 6
- 229910052755 nonmetal Inorganic materials 0.000 claims 3
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 45
- 239000000758 substrate Substances 0.000 description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 19
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 239000011247 coating layer Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- -1 nickel can be used Chemical compound 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33811199A JP2001155540A (ja) | 1999-11-29 | 1999-11-29 | 導電性微粒子、異方性導電接着剤及び導電接続構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33811199A JP2001155540A (ja) | 1999-11-29 | 1999-11-29 | 導電性微粒子、異方性導電接着剤及び導電接続構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001155540A true JP2001155540A (ja) | 2001-06-08 |
| JP2001155540A5 JP2001155540A5 (enExample) | 2006-09-21 |
Family
ID=18315024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33811199A Withdrawn JP2001155540A (ja) | 1999-11-29 | 1999-11-29 | 導電性微粒子、異方性導電接着剤及び導電接続構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001155540A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003068144A (ja) * | 2001-08-23 | 2003-03-07 | Sekisui Chem Co Ltd | 導電性微粒子及び導電接続構造体 |
| JP2004165123A (ja) * | 2002-09-24 | 2004-06-10 | Sekisui Chem Co Ltd | 導電性微粒子、導電性微粒子の製造方法および導電材料 |
| JPWO2006018995A1 (ja) * | 2004-08-05 | 2008-05-08 | 積水化学工業株式会社 | 導電性微粒子、導電性微粒子の製造方法、及び、無電解銀メッキ液 |
| WO2013146573A1 (ja) * | 2012-03-29 | 2013-10-03 | デクセリアルズ株式会社 | 導電性粒子、回路接続材料、実装体、及び実装体の製造方法 |
| WO2014007334A1 (ja) * | 2012-07-05 | 2014-01-09 | 積水化学工業株式会社 | 導電性粒子、樹脂粒子、導電材料及び接続構造体 |
| JP2014127464A (ja) * | 2012-12-27 | 2014-07-07 | Nippon Shokubai Co Ltd | 導電性微粒子及びそれを用いた異方性導電材料 |
| JPWO2015105120A1 (ja) * | 2014-01-08 | 2017-03-23 | 積水化学工業株式会社 | バックコンタクト方式の太陽電池モジュール用導電性粒子、導電材料及び太陽電池モジュール |
-
1999
- 1999-11-29 JP JP33811199A patent/JP2001155540A/ja not_active Withdrawn
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003068144A (ja) * | 2001-08-23 | 2003-03-07 | Sekisui Chem Co Ltd | 導電性微粒子及び導電接続構造体 |
| JP2004165123A (ja) * | 2002-09-24 | 2004-06-10 | Sekisui Chem Co Ltd | 導電性微粒子、導電性微粒子の製造方法および導電材料 |
| JPWO2006018995A1 (ja) * | 2004-08-05 | 2008-05-08 | 積水化学工業株式会社 | 導電性微粒子、導電性微粒子の製造方法、及び、無電解銀メッキ液 |
| WO2013146573A1 (ja) * | 2012-03-29 | 2013-10-03 | デクセリアルズ株式会社 | 導電性粒子、回路接続材料、実装体、及び実装体の製造方法 |
| JP2013206823A (ja) * | 2012-03-29 | 2013-10-07 | Dexerials Corp | 導電性粒子、回路接続材料、実装体、及び実装体の製造方法 |
| WO2014007334A1 (ja) * | 2012-07-05 | 2014-01-09 | 積水化学工業株式会社 | 導電性粒子、樹脂粒子、導電材料及び接続構造体 |
| CN104380393A (zh) * | 2012-07-05 | 2015-02-25 | 积水化学工业株式会社 | 导电性粒子、树脂粒子、导电材料及连接结构体 |
| JPWO2014007334A1 (ja) * | 2012-07-05 | 2016-06-02 | 積水化学工業株式会社 | 導電性粒子、樹脂粒子、導電材料及び接続構造体 |
| CN104380393B (zh) * | 2012-07-05 | 2017-11-28 | 积水化学工业株式会社 | 导电性粒子、树脂粒子、导电材料及连接结构体 |
| JP2014127464A (ja) * | 2012-12-27 | 2014-07-07 | Nippon Shokubai Co Ltd | 導電性微粒子及びそれを用いた異方性導電材料 |
| JPWO2015105120A1 (ja) * | 2014-01-08 | 2017-03-23 | 積水化学工業株式会社 | バックコンタクト方式の太陽電池モジュール用導電性粒子、導電材料及び太陽電池モジュール |
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