JP2001152335A5 - - Google Patents

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Publication number
JP2001152335A5
JP2001152335A5 JP1999332242A JP33224299A JP2001152335A5 JP 2001152335 A5 JP2001152335 A5 JP 2001152335A5 JP 1999332242 A JP1999332242 A JP 1999332242A JP 33224299 A JP33224299 A JP 33224299A JP 2001152335 A5 JP2001152335 A5 JP 2001152335A5
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JP
Japan
Prior art keywords
target
processing tank
vacuum processing
sputtering
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999332242A
Other languages
English (en)
Japanese (ja)
Other versions
JP4330737B2 (ja
JP2001152335A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP33224299A priority Critical patent/JP4330737B2/ja
Priority claimed from JP33224299A external-priority patent/JP4330737B2/ja
Publication of JP2001152335A publication Critical patent/JP2001152335A/ja
Publication of JP2001152335A5 publication Critical patent/JP2001152335A5/ja
Application granted granted Critical
Publication of JP4330737B2 publication Critical patent/JP4330737B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP33224299A 1999-11-24 1999-11-24 真空処理方法 Expired - Fee Related JP4330737B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33224299A JP4330737B2 (ja) 1999-11-24 1999-11-24 真空処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33224299A JP4330737B2 (ja) 1999-11-24 1999-11-24 真空処理方法

Publications (3)

Publication Number Publication Date
JP2001152335A JP2001152335A (ja) 2001-06-05
JP2001152335A5 true JP2001152335A5 (enExample) 2006-11-02
JP4330737B2 JP4330737B2 (ja) 2009-09-16

Family

ID=18252776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33224299A Expired - Fee Related JP4330737B2 (ja) 1999-11-24 1999-11-24 真空処理方法

Country Status (1)

Country Link
JP (1) JP4330737B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010056353A (ja) 2008-08-29 2010-03-11 Renesas Technology Corp 半導体装置の製造方法
JP5486970B2 (ja) * 2010-03-17 2014-05-07 東京エレクトロン株式会社 基板脱着方法及び基板処理装置
JP5794905B2 (ja) * 2011-12-07 2015-10-14 株式会社アルバック リフロー法及び半導体装置の製造方法
JP6217233B2 (ja) * 2013-08-21 2017-10-25 住友電気工業株式会社 半導体装置の製造方法
JP6248684B2 (ja) * 2014-02-19 2017-12-20 住友電気工業株式会社 半導体装置の製造方法
JP6212434B2 (ja) 2014-05-13 2017-10-11 住友電気工業株式会社 半導体装置の製造方法
JP6558567B2 (ja) * 2015-03-31 2019-08-14 パナソニックＩｐマネジメント株式会社 プラズマ処理装置およびプラズマ処理方法
JP6861579B2 (ja) * 2017-06-02 2021-04-21 東京エレクトロン株式会社 プラズマ処理装置、静電吸着方法および静電吸着プログラム
JP7304188B2 (ja) * 2019-03-29 2023-07-06 東京エレクトロン株式会社 基板処理方法及び基板処理装置

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