JP2001142224A5 - - Google Patents
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- JP2001142224A5 JP2001142224A5 JP2000258450A JP2000258450A JP2001142224A5 JP 2001142224 A5 JP2001142224 A5 JP 2001142224A5 JP 2000258450 A JP2000258450 A JP 2000258450A JP 2000258450 A JP2000258450 A JP 2000258450A JP 2001142224 A5 JP2001142224 A5 JP 2001142224A5
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000258450A JP4628531B2 (ja) | 1999-08-31 | 2000-08-29 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24657299 | 1999-08-31 | ||
| JP11-246572 | 1999-08-31 | ||
| JP2000258450A JP4628531B2 (ja) | 1999-08-31 | 2000-08-29 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001142224A JP2001142224A (ja) | 2001-05-25 |
| JP2001142224A5 true JP2001142224A5 (ja) | 2007-10-25 |
| JP4628531B2 JP4628531B2 (ja) | 2011-02-09 |
Family
ID=26537798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000258450A Expired - Fee Related JP4628531B2 (ja) | 1999-08-31 | 2000-08-29 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4628531B2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1720484B (zh) * | 2002-12-06 | 2010-05-05 | 东京应化工业株式会社 | Lcd制造用正型光致抗蚀剂组合物和抗蚀图的形成方法 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4634673B2 (ja) * | 2001-09-26 | 2011-02-16 | シャープ株式会社 | 液晶表示装置及びその製造方法 |
| US6872658B2 (en) | 2001-11-30 | 2005-03-29 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device by exposing resist mask |
| JP2004342833A (ja) | 2003-05-15 | 2004-12-02 | Seiko Epson Corp | 半導体装置の製造方法、電気光学装置、集積回路及び電子機器。 |
| JP2005072573A (ja) * | 2003-08-05 | 2005-03-17 | Semiconductor Energy Lab Co Ltd | 配線基板及びその作製方法、並びに半導体装置及びその作製方法 |
| US7423343B2 (en) | 2003-08-05 | 2008-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof |
| JP5398158B2 (ja) * | 2008-03-27 | 2014-01-29 | 三菱電機株式会社 | パターン形成方法、及び配線構造、並びに電子機器 |
| JP6240443B2 (ja) * | 2012-09-17 | 2017-11-29 | シチズンファインデバイス株式会社 | 液晶表示装置 |
| WO2016093122A1 (ja) * | 2014-12-09 | 2016-06-16 | シャープ株式会社 | 表示パネル用基板の製造方法 |
| JP6650719B2 (ja) | 2015-09-30 | 2020-02-19 | キヤノン株式会社 | 撮像装置、撮像システムおよび半導体装置の製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50159267A (ja) * | 1974-06-12 | 1975-12-23 | ||
| JPS6473616A (en) * | 1987-09-14 | 1989-03-17 | Nec Corp | Manufacture of semiconductor device |
| JPH01134919A (ja) * | 1987-11-19 | 1989-05-26 | Nec Corp | 光学投影露光装置 |
| JPH08236433A (ja) * | 1994-12-28 | 1996-09-13 | Nikon Corp | 露光方法 |
| JP3892565B2 (ja) * | 1997-02-28 | 2007-03-14 | 株式会社東芝 | パターン形成方法 |
| JP3101594B2 (ja) * | 1997-11-06 | 2000-10-23 | キヤノン株式会社 | 露光方法及び露光装置 |
| JP3535770B2 (ja) * | 1998-06-29 | 2004-06-07 | キヤノン株式会社 | 露光方法及び露光装置 |
| JP2000347416A (ja) * | 1999-03-31 | 2000-12-15 | Seiko Epson Corp | 露光装置 |
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2000
- 2000-08-29 JP JP2000258450A patent/JP4628531B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1720484B (zh) * | 2002-12-06 | 2010-05-05 | 东京应化工业株式会社 | Lcd制造用正型光致抗蚀剂组合物和抗蚀图的形成方法 |