JP2001110719A - 露光方法 - Google Patents
露光方法Info
- Publication number
- JP2001110719A JP2001110719A JP29278299A JP29278299A JP2001110719A JP 2001110719 A JP2001110719 A JP 2001110719A JP 29278299 A JP29278299 A JP 29278299A JP 29278299 A JP29278299 A JP 29278299A JP 2001110719 A JP2001110719 A JP 2001110719A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- exposure
- divided
- photomask
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29278299A JP2001110719A (ja) | 1999-10-14 | 1999-10-14 | 露光方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29278299A JP2001110719A (ja) | 1999-10-14 | 1999-10-14 | 露光方法 |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006206430A Division JP2006303541A (ja) | 2006-07-28 | 2006-07-28 | 半導体集積回路装置の製造方法 |
| JP2006206428A Division JP2006319368A (ja) | 2006-07-28 | 2006-07-28 | 半導体集積回路装置の製造方法 |
| JP2006206429A Division JP2006319369A (ja) | 2006-07-28 | 2006-07-28 | 半導体集積回路装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001110719A true JP2001110719A (ja) | 2001-04-20 |
| JP2001110719A5 JP2001110719A5 (https=) | 2004-09-24 |
Family
ID=17786275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29278299A Pending JP2001110719A (ja) | 1999-10-14 | 1999-10-14 | 露光方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001110719A (https=) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004110035A (ja) * | 2002-09-16 | 2004-04-08 | Numerical Technologies Inc | 大きいフィーチャに隣接する狭いスペースをプリントする際にpsm露光を支援するための第2の露光の使用 |
| JP2004272228A (ja) * | 2003-02-21 | 2004-09-30 | Canon Inc | マスク及びその製造方法、露光装置及び方法、並びに、デバイス製造方法 |
| JP2005055878A (ja) * | 2003-07-23 | 2005-03-03 | Canon Inc | マスク及びその製造方法、並びに、露光方法 |
| JP2006128255A (ja) * | 2004-10-27 | 2006-05-18 | Renesas Technology Corp | パターン形成方法、半導体装置の製造方法及び露光用マスクセット |
| JP2006519480A (ja) * | 2003-02-27 | 2006-08-24 | ザ ユニバーシティ オブ ホンコン | 回路性能向上のための多重露光方法 |
| KR100688723B1 (ko) | 2006-02-17 | 2007-03-02 | 삼성전기주식회사 | 인쇄회로기판의 노광 방법 |
| JP2008299332A (ja) * | 2007-05-30 | 2008-12-11 | Nikon Corp | 露光方法、フラットパネルディスプレイ用基板の製造方法、及び露光装置 |
| US7919231B2 (en) | 2007-09-04 | 2011-04-05 | Hitachi Global Storage Technologies Netherlands B.V. | Photolithographic method and mask devices utilized for multiple exposures in the field of a feature |
| CN102880012A (zh) * | 2012-09-17 | 2013-01-16 | 上海华力微电子有限公司 | 一种可提高工艺套准精度的曝光方法 |
-
1999
- 1999-10-14 JP JP29278299A patent/JP2001110719A/ja active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004110035A (ja) * | 2002-09-16 | 2004-04-08 | Numerical Technologies Inc | 大きいフィーチャに隣接する狭いスペースをプリントする際にpsm露光を支援するための第2の露光の使用 |
| JP2004272228A (ja) * | 2003-02-21 | 2004-09-30 | Canon Inc | マスク及びその製造方法、露光装置及び方法、並びに、デバイス製造方法 |
| JP2006519480A (ja) * | 2003-02-27 | 2006-08-24 | ザ ユニバーシティ オブ ホンコン | 回路性能向上のための多重露光方法 |
| JP2005055878A (ja) * | 2003-07-23 | 2005-03-03 | Canon Inc | マスク及びその製造方法、並びに、露光方法 |
| JP2006128255A (ja) * | 2004-10-27 | 2006-05-18 | Renesas Technology Corp | パターン形成方法、半導体装置の製造方法及び露光用マスクセット |
| US8017305B2 (en) | 2004-10-27 | 2011-09-13 | Renesas Electronics Corporation | Pattern forming method, semiconductor device manufacturing method and exposure mask set |
| KR100688723B1 (ko) | 2006-02-17 | 2007-03-02 | 삼성전기주식회사 | 인쇄회로기판의 노광 방법 |
| JP2008299332A (ja) * | 2007-05-30 | 2008-12-11 | Nikon Corp | 露光方法、フラットパネルディスプレイ用基板の製造方法、及び露光装置 |
| JP2013057963A (ja) * | 2007-05-30 | 2013-03-28 | Nikon Corp | 露光方法及びフラットパネルディスプレイ用基板の製造方法 |
| US7919231B2 (en) | 2007-09-04 | 2011-04-05 | Hitachi Global Storage Technologies Netherlands B.V. | Photolithographic method and mask devices utilized for multiple exposures in the field of a feature |
| US8268517B2 (en) | 2007-09-04 | 2012-09-18 | Hitachi Global Storage Technologies Netherlands B.V. | Photolithographic method and mask devices utilized for multiple exposures in the field of a feature |
| CN102880012A (zh) * | 2012-09-17 | 2013-01-16 | 上海华力微电子有限公司 | 一种可提高工艺套准精度的曝光方法 |
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Legal Events
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