JP2001102693A5 - - Google Patents
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- Publication number
- JP2001102693A5 JP2001102693A5 JP1999278387A JP27838799A JP2001102693A5 JP 2001102693 A5 JP2001102693 A5 JP 2001102693A5 JP 1999278387 A JP1999278387 A JP 1999278387A JP 27838799 A JP27838799 A JP 27838799A JP 2001102693 A5 JP2001102693 A5 JP 2001102693A5
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- printed wiring
- wiring board
- flexible printed
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011889 copper foil Substances 0.000 description 88
- 239000000758 substrate Substances 0.000 description 34
- 239000000853 adhesive Substances 0.000 description 28
- 230000001070 adhesive Effects 0.000 description 28
- 239000010408 film Substances 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 23
- 239000000463 material Substances 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 17
- 239000010949 copper Substances 0.000 description 17
- 239000011888 foil Substances 0.000 description 13
- 238000005530 etching Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000010030 laminating Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229920001721 Polyimide Polymers 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000000996 additive Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27838799A JP4336426B2 (ja) | 1999-09-30 | 1999-09-30 | 極薄銅箔を用いたフレキシブルプリント配線板用基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27838799A JP4336426B2 (ja) | 1999-09-30 | 1999-09-30 | 極薄銅箔を用いたフレキシブルプリント配線板用基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001102693A JP2001102693A (ja) | 2001-04-13 |
| JP2001102693A5 true JP2001102693A5 (zh) | 2006-08-03 |
| JP4336426B2 JP4336426B2 (ja) | 2009-09-30 |
Family
ID=17596643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27838799A Expired - Lifetime JP4336426B2 (ja) | 1999-09-30 | 1999-09-30 | 極薄銅箔を用いたフレキシブルプリント配線板用基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4336426B2 (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002034509A1 (fr) * | 2000-10-27 | 2002-05-02 | Kaneka Corporation | Lamine |
| JP4504602B2 (ja) * | 2001-09-04 | 2010-07-14 | 三井化学株式会社 | ポリイミド銅張積層板及びその製造方法 |
| JP2005205731A (ja) * | 2004-01-22 | 2005-08-04 | Kaneka Corp | フレキシブル積層板の製造方法、およびフレキシブル積層板 |
| JP4516769B2 (ja) * | 2004-03-11 | 2010-08-04 | 株式会社カネカ | セミアディティブ用金属張積層板の製造方法ならびにこれにより得られるセミアディティブ用金属張積層板 |
| JP2006068920A (ja) | 2004-08-31 | 2006-03-16 | Shin Etsu Chem Co Ltd | フレキシブル銅箔ポリイミド積層板の製造方法 |
| JP2007129208A (ja) * | 2005-10-05 | 2007-05-24 | Sumitomo Chemical Co Ltd | フレキシブルプリント配線板用基板及びその製造方法 |
| JP6321944B2 (ja) * | 2013-11-15 | 2018-05-09 | 三井金属鉱業株式会社 | プレス接着用金属箔及び電子部品パッケージ |
-
1999
- 1999-09-30 JP JP27838799A patent/JP4336426B2/ja not_active Expired - Lifetime
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