JP4336426B2 - 極薄銅箔を用いたフレキシブルプリント配線板用基板の製造方法 - Google Patents

極薄銅箔を用いたフレキシブルプリント配線板用基板の製造方法 Download PDF

Info

Publication number
JP4336426B2
JP4336426B2 JP27838799A JP27838799A JP4336426B2 JP 4336426 B2 JP4336426 B2 JP 4336426B2 JP 27838799 A JP27838799 A JP 27838799A JP 27838799 A JP27838799 A JP 27838799A JP 4336426 B2 JP4336426 B2 JP 4336426B2
Authority
JP
Japan
Prior art keywords
copper foil
substrate
flexible printed
printed wiring
ultra
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP27838799A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001102693A5 (zh
JP2001102693A (ja
Inventor
卓 三輪
和英 北
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arisawa Manufacturing Co Ltd
Original Assignee
Arisawa Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arisawa Manufacturing Co Ltd filed Critical Arisawa Manufacturing Co Ltd
Priority to JP27838799A priority Critical patent/JP4336426B2/ja
Publication of JP2001102693A publication Critical patent/JP2001102693A/ja
Publication of JP2001102693A5 publication Critical patent/JP2001102693A5/ja
Application granted granted Critical
Publication of JP4336426B2 publication Critical patent/JP4336426B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
JP27838799A 1999-09-30 1999-09-30 極薄銅箔を用いたフレキシブルプリント配線板用基板の製造方法 Expired - Lifetime JP4336426B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27838799A JP4336426B2 (ja) 1999-09-30 1999-09-30 極薄銅箔を用いたフレキシブルプリント配線板用基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27838799A JP4336426B2 (ja) 1999-09-30 1999-09-30 極薄銅箔を用いたフレキシブルプリント配線板用基板の製造方法

Publications (3)

Publication Number Publication Date
JP2001102693A JP2001102693A (ja) 2001-04-13
JP2001102693A5 JP2001102693A5 (zh) 2006-08-03
JP4336426B2 true JP4336426B2 (ja) 2009-09-30

Family

ID=17596643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27838799A Expired - Lifetime JP4336426B2 (ja) 1999-09-30 1999-09-30 極薄銅箔を用いたフレキシブルプリント配線板用基板の製造方法

Country Status (1)

Country Link
JP (1) JP4336426B2 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002034509A1 (fr) * 2000-10-27 2002-05-02 Kaneka Corporation Lamine
JP4504602B2 (ja) * 2001-09-04 2010-07-14 三井化学株式会社 ポリイミド銅張積層板及びその製造方法
JP2005205731A (ja) * 2004-01-22 2005-08-04 Kaneka Corp フレキシブル積層板の製造方法、およびフレキシブル積層板
JP4516769B2 (ja) * 2004-03-11 2010-08-04 株式会社カネカ セミアディティブ用金属張積層板の製造方法ならびにこれにより得られるセミアディティブ用金属張積層板
JP2006068920A (ja) 2004-08-31 2006-03-16 Shin Etsu Chem Co Ltd フレキシブル銅箔ポリイミド積層板の製造方法
JP2007129208A (ja) * 2005-10-05 2007-05-24 Sumitomo Chemical Co Ltd フレキシブルプリント配線板用基板及びその製造方法
JP6321944B2 (ja) * 2013-11-15 2018-05-09 三井金属鉱業株式会社 プレス接着用金属箔及び電子部品パッケージ

Also Published As

Publication number Publication date
JP2001102693A (ja) 2001-04-13

Similar Documents

Publication Publication Date Title
JP5190553B1 (ja) キャリア付き金属箔
GB2122646A (en) Transfer lamination of vapor deposited foils method and product
TW201124027A (en) Carrier for manufacturing substrate and method of manufacturing substrate using the same
JP4336426B2 (ja) 極薄銅箔を用いたフレキシブルプリント配線板用基板の製造方法
GB2091634A (en) Transfer lamination of vapour deposited copper thin sheets and films
US20200071160A1 (en) Method for forming microstructures
JP2001102693A5 (zh)
JP2010157605A (ja) 回路基板及び回路基板の製造方法
JPH08281866A (ja) フレキシブル金属箔積層板の製造方法
JPS5816592A (ja) 印刷回路板、金属張り積層板中間製品及びそれらの製造方法
JPH0964514A (ja) プリント配線板の製造方法
JP5358785B2 (ja) 両面導通粘着金属フィルムの製造方法
JPH10178241A (ja) プリント配線板及びその製造方法
JPH07221435A (ja) フレキシブルプリント基板
JPS5815952B2 (ja) 接着剤被覆積層板の製造法
JP2007069617A (ja) フレキシブル金属箔積層板の製造方法
JP2008302696A (ja) フレキシブル金属箔積層板の製造方法
JPH1110791A (ja) 片面金属張り積層板製造用接合材
JP2003086922A (ja) 回路基板の製造方法
JP2004090488A (ja) 金属層転写シート
JPS61170091A (ja) 印刷配線板の製造方法
JPH11348179A (ja) 金属薄膜基板の製造法
JP2006237323A (ja) 配線用フィルム基板の製造方法、配線用フィルム基板、および配線用フィルム基板の製造装置
JP2002205356A (ja) 樹脂付銅箔の製造方法
JPH09232704A (ja) スルーホールを有するフレキシブルプリント回路基板及びその製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060620

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060620

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080820

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080825

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081024

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081120

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090119

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090601

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090629

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120703

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4336426

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120703

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130703

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term