JP2001015906A - Automatic continuous soldering device and its controlling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve stability of soldering by step-sending a tip and stopping the tip for a certain time at a plurality of soldering parts on a printed board. SOLUTION: After a soldering unit 10 is moved to an upper part of a specified part 22 on a printed board 21, a spare solder is supplied to a tip part 1a on a work side of a tip 1 with a solder nozzle 15. Then the entire tip unit 14 is lowered using a horizontal cylinder 3c and a vertical cylinder 13, and further the tip 1 is lowered to bring it into contact with the printed board 21. Then a site for soldering is pre-heated with an optical fiber 16, and then automatic continuous soldering of a multi-pin part 22 on the printed board 21 is started, and it is made to stop there for a certain time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic continuous soldering apparatus for continuously soldering, for example, a soldering portion of a multi-pin component arranged on a printed circuit board wiring and a control method therefor. is there.

[0002]

2. Description of the Related Art FIG. 4 is a view showing a main part of a conventional automatic continuous soldering apparatus. Reference numeral 10A denotes a moving base 11 which moves on a horizontal mobile robot 20, and the base 11 is attached to the moving base. A support base 12 having an L-shaped cross section,
Connected to an upper and lower cylinder 13 attached to a protruding piece 12P vertically protruding from the base 11 and extending horizontally.
A soldering unit including a soldering tip unit 14A for soldering to a multi-pin component 22 such as a flat package IC, a surface mount type connector, and a through-hole type connector component arranged on the wiring of the printed circuit board 21. is there. The iron tip unit 14A includes the iron tip 1
A movable unit 2 comprising a movable block 2a and a guide member 2b for adjusting the angle of the iron tip 1 and a supporting member 2b for supporting the iron tip 1, a rotating shaft 3a and a rotating shaft 3a. The attached connecting member 3b and the rotating shaft 3
a rotary cylinder 3 for driving the movable block 2a of the iron tip unit movable part 2 rotatably by the connecting member 3b, the iron tip unit movable part 2 and the rotary shaft 3 and a tension spring 4 for urging the iron tip unit movable section 2 in the upward direction. The upper and lower cylinders 13 are connected to the rotating shaft 3. The iron tip 1 is mounted on the holder 1b so that only the iron tip 1 can be replaced, and is attached to the iron tip mounting shaft 5 via the holder 1b. The iron tip mounting shaft 5 is mounted on the movable block 2a via the support member 2b. Also, 15
Is a solder nozzle for supplying thread solder to the iron tip 1.

Next, the operation will be described. First, the soldering unit 10A is moved by the horizontal moving robot 20 to a position above the soldering start point a. Therefore, the tip side 1a of the iron tip 1 on the work side by the solder nozzle 15
Is automatically supplied to the tip 1a for wetting the solder. Thereafter, the entire iron tip unit 14A is lowered by the horizontal cylinder 3c and the upper and lower cylinders 13, and the iron tip 1 is lowered, so that the iron tip 1 is attached to the printed circuit board 2.
Touch 1 Since the iron tip unit movable part 2 is urged upward by the tension spring 4 connected between the iron tip unit movable part 2 and the rotating shaft part 3, when the iron tip unit 14A descends, the iron tip unit 1 Shock due to contact between the substrate and the printed circuit board 21 and irregularities in the vertical direction are absorbed. In order to absorb a shock caused by the contact between the iron tip 1 and the printed board 21, the driving order of the horizontal cylinder 3c and the upper and lower cylinders 13 may be set as appropriate.
At the time of soldering, since the unit movable part 2 and the rotating shaft part 3 are rotatably connected, the iron tip 1 is substantially free in the vertical direction. In this state, the iron tip unit 14A
Moves along the soldering portion of the multi-pin component 22 of the printed circuit board 21 with the movement of the soldering unit 10A driven by the horizontal mobile robot 20. then,
Solder is automatically supplied from the solder nozzle 15 to the iron tip 1, and the multi-pin component 22 is automatically and continuously soldered. When the soldering unit 10A moves to the soldering end point b and the soldering of the multi-pin component 22 is completed, the soldering tip unit 14A is raised, and the horizontal moving robot 20 moves the soldering unit 10A.
A is moved to the retreat position until soldering of the next work is started.

[0004]

Generally, when performing automatic continuous soldering of a multi-pin connector or the like, it is necessary to stabilize the amount of solder supplied to each soldering portion and to reduce the heat conduction to each soldering portion. It is required to increase the solder wettability. For this purpose, it is necessary to enhance the contactability of the iron tip 1 to solder parts such as patterns on the printed circuit board 21 and component electrode terminals. However, in the above-described conventional automatic continuous soldering apparatus, the iron tip 1 is moved at a constant speed, so that the iron tip contact time ratio is low. In addition, iron tip 1
In order to move the soldering part on the printed circuit board 21 having a considerable unevenness, the tip part 1a of the iron tip 1 which is free up and down
Vibrates, and the adhesion between the soldering portion and the iron tip 1 is reduced. For this reason, there has been a problem that heat conduction to the soldering portion is insufficient, and stable soldering cannot be performed. In addition, if a solder pool is formed at the tip 1a of the iron tip 1, there is a problem that the amount of solder to be supplied at the start and at the end of the series of soldering differs due to the influence. The total moving distance from the soldering start point a to the soldering end point b of the multi-pin component 22 is divided into several sections, and the soldering unit 10 is provided for each section.
A proposal has also been made for a speed control method of performing soldering while varying the moving speed of A and the solder supply speed (Japanese Patent Laid-Open No. 7-1115), but it is necessary to control the soldering speed of each component. Therefore, not only adjustment and operation are complicated, but also versatility in terms of price is considered to be low.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and the soldering stability can be ensured by making sure that the iron tip and the solder part are in contact without performing complicated speed control. The purpose is to improve.

[0006]

According to a first aspect of the present invention, there is provided a method for controlling an automatic continuous soldering apparatus, comprising: feeding an iron tip stepwise; Is characterized in that it is stopped for a certain time.

According to a second aspect of the present invention, in the control method of the automatic continuous soldering apparatus, the supply of the thread solder is started at a stop position of the ironing tip.

According to a third aspect of the present invention, there is provided an automatic continuous soldering apparatus for controlling a soldering tip, a solder nozzle for supplying thread solder to the soldering tip, a moving speed of the soldering tip, and a supply amount of the thread solder. A control device, and the control device is provided with movement control means for step-moving the iron tip, and the iron tip is stopped at a plurality of soldering portions on the printed circuit board for a predetermined time. It was made.

According to a fourth aspect of the present invention, in the automatic continuous soldering apparatus, the supply of the thread solder is started at a stop position of the ironing tip.

According to a fifth aspect of the present invention, there is provided an automatic continuous soldering apparatus wherein the stop time of the iron tip and / or the moving speed of the iron tip are adjusted to increase the contact time ratio of the iron tip.

In the automatic continuous soldering apparatus according to the present invention, a weight for adjusting the weight is attached to a portion of the iron tip other than the soldering portion.

An automatic continuous soldering apparatus according to a seventh aspect of the present invention is provided with an air cylinder, wherein the tension of a tension spring for buffering the vertical movement of the iron tip is loosened when the iron tip is lowered.

According to an eighth aspect of the present invention, there is provided an automatic continuous soldering apparatus, wherein a means for irradiating a spot beam to a predetermined portion of the soldering portion is provided so as to preheat the predetermined soldering portion before moving the soldering tip. It is.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. In the following description, portions common to the conventional example will be described using the same reference numerals. FIG. 1 is a view showing a main part of an automatic continuous soldering apparatus according to the present invention. In FIG. 1, reference numeral 10 denotes a base 11 which moves on a horizontal mobile robot 20, and a sectional shape attached to the base 11. Is an L-shaped support base 12 and the support base 1
A soldering unit including an iron tip unit 14 connected to the upper and lower cylinders 13 attached to the two protruding pieces 12P. The iron tip unit 14 is composed of the iron tip 1, the movable block 2a and the support member 2b. The tip spring unit is provided between the tension spring 4 and the rotation shaft 3, the rotation shaft 3 having a rotation shaft 3 a and a connecting member 3 b, and a tension spring 4. 4 and an air cylinder 6 that operates to loosen the tension of the tension spring 4 when the iron tip 1 descends. In addition, an adjustment weight 7 is attached to an end of the iron tip mounting shaft 5 on which the iron tip 1 is mounted, on the opposite side to the iron tip 1. Reference numeral 15 denotes a solder nozzle for supplying thread solder to the iron tip 1, and reference numeral 16 irradiates an optical spot beam to a portion to be soldered ahead of the soldering unit 10 in the moving direction before the iron tip 1 moves. In addition, the optical fiber is a spot beam irradiating means for preheating the portion to be soldered. The optical fiber 16 is fixed to the iron tip unit 14, but the drawing is complicated, and FIG. 1 omits a portion for attaching the optical fiber 16 to the iron tip unit 14. Further, the automatic continuous soldering apparatus of the present invention includes a step feed movement of the iron tip 1, that is, a soldering unit 10, in a controller (not shown) for controlling the moving speed of the iron tip 1 and the supply amount of the thread solder. And a movement control means for controlling the step feed movement. As the step control of the soldering unit 10 by the movement control means, a well-known PTP control (Point To Point Control) often used in general-purpose robots is used.
Is used.

Next, a description will be given of a soldering operation in the automatic continuous soldering apparatus having the above-described configuration in a case where the yarn soldering feed speed is kept constant, with reference to flowcharts shown in FIGS. First, horizontal mobile robot 2
0, the soldering unit 10 is mounted on the printed circuit board 21.
(Step S1)
00) Then, preliminary solder is supplied to the tip 1a of the iron tip 1 on the work side by the solder nozzle 15 (step S2).
00). Next, the entire iron tip unit 14 is lowered by the horizontal cylinder 3c and the upper and lower cylinders 13, and the iron tip 1 is lowered, so that the iron tip 1 is mounted on the printed circuit board 2.
1 (step S300), preheating of a portion to be soldered (hereinafter, referred to as a point) by the optical fiber 16, and then automatic continuous soldering of the multi-pin component 22 on the printed circuit board 21 is started. (Step S400). In addition, at the time of soldering, since the unit movable part 2 and the rotating shaft part 3 are rotatably connected,
The tip 1 is almost free in the vertical direction. The preheating is
In order to improve solderability, the optical fiber 16 irradiates a spot to be soldered next with a light spot beam to raise the temperature of the point in advance. By employing the light spot beam, local heating can be achieved. This makes it possible to raise the temperature of the soldering scheduled point without affecting the heating of other parts.
In step S300, the iron tip unit 14
When the iron tip 1 is brought into contact with the printed circuit board 21 by lowering, the tension of the tension spring 4 adjusted to a predetermined stroke by the air cylinder 6 causes the printed circuit board 21 to move.
In this embodiment, the air cylinder 6 is operated after the lowering of the iron tip unit 14 is confirmed by, for example, a stroke sensor or the like. (Pushed out), the tension of the tension spring 4 is loosened, the load applied to the point from the iron tip unit 14 including the load of the adjusting weight 7 is increased, and the contact pressure between the iron tip 1 and the point is increased. . That is, in the automatic continuous soldering device of the present invention, the shock absorption adjustment (stroke adjustment of the tension spring 4) when the iron tip unit 14 is lowered.
And the adjustment of the load received from the iron tip 1 to the printed circuit board 21 can be adjusted independently.

FIG. 2B is a flowchart showing the details of step S400. First, the soldering iron 1 is brought into contact with a predetermined point on the printed circuit board 21 and the supply of solder is started (step S401). Next, the moving speed of the soldering unit 10 is set (Step S).
402), the soldering unit 10 is moved to a predetermined point (the first point is the soldering start point a) at the set moving speed (step S).
403) After that, it is stopped for a predetermined time at the above point and soldering is performed (step S404). Here, the moving speed and the stop time of the soldering unit 10 are set for each point. As mentioned above, the above points are:
The irradiation temperature of the light spot beam by the optical fiber 16 raises the temperature, so that the solder is easily put on.
Is loosened, and the contact pressure between the iron tip 1 and the point is increased.
Stable soldering can be performed. Further, the moving speed of the soldering unit 10 in the step S403 is not a moving speed in consideration of the soldering speed as in the conventional case, so that not only the speed setting is easy, but also a speed higher than the conventional moving speed. Can be set. Therefore, solder breakage is improved and solder bridges are less likely to occur.

After the end of the soldering by stopping for a predetermined time, the above-mentioned point is set to a preset soldering end point b.
It is determined whether or not the soldering of the predetermined component 22 has been completed (step S40).
5). If the soldering is not completed, the process returns to the step S402, and sets a moving speed for moving to the next point after the point, and sets the soldering unit 1
0 is moved to the next point, and then stopped at the above-mentioned point for a predetermined time to perform soldering (step S).
402 to S404). As described above, the step control for repeating the movement and the stop is performed on the soldering unit 10, and the plurality of points of the multi-pin component 22 are sequentially soldered. If it is determined in step S405 that the soldering has been completed, the soldering iron unit 14 is raised (step S500), and the soldering unit 10 is moved to the horizontal moving robot 20 until the soldering of the next work is started. To return to the retreat position (step S60).
0). In the above-mentioned soldering process, the amount of solder to be supplied can be adjusted by the movement speed between the steps of the soldering unit 10 and the stop time at each point. Therefore, the movement speed and / or the stop time are controlled. By doing so, it is possible to appropriately control the solder supply amount, and it is possible to reliably reduce defects such as unsolder and solder bridge.

In the above embodiment, the soldering operation in the case where the yarn soldering speed is kept constant has been described. However, as shown in the flowcharts of FIGS. By setting for each point, the amount of supplied solder can be further finely adjusted. In other words, soldering is performed by changing the soldering iron 1 to the printed circuit board 21.
First, the moving speed of the soldering unit 10 is set for each point (Step S).
411), after moving the soldering unit 10 to a predetermined point (step S412), the supply of the solder is started at the point (step S413).
Here, the amount of solder to be supplied is the amount of solder set for each point. Thereafter, at the above points, the soldering unit 10 is stopped for a predetermined time set for each point, and soldering is performed (step S414). As a result, the amount of supplied solder can be appropriately controlled, so that defects such as unsolder, which occurs when the supply of solder is insufficient, and solder bridges, which occur when the supply of solder is excessive, can be reliably reduced.

[0019]

As described above, according to the first aspect of the present invention, the iron tip is fed stepwise, and the iron tip is stopped at a plurality of soldering portions on the printed circuit board for a predetermined time. As a result, the contact of the soldering tip with the connector electrode and the printed circuit board pattern can be ensured, and in a series of soldering operations, the contact time between the soldering tip and the soldering portion can be lengthened. Heat can be reliably transmitted, and stable soldering can be performed.

According to the second aspect of the present invention, the supply of the thread solder is started at the stop position of the iron tip, so that the supply amount of the thread solder at each point can be appropriately controlled. This can significantly reduce defects such as unsolder generated when the supply of solder is insufficient and solder bridges generated when the supply of solder is excessive.

According to the third aspect of the present invention, the controller for the automatic continuous soldering device for controlling the moving speed of the iron tip and the supply amount of the thread solder is used to move the iron tip stepwise. The control means is provided, and the soldering iron tip is stopped at a plurality of soldering portions on the printed circuit board for a certain period of time, so that in a series of soldering operations, heat conduction to the soldering portion can be ensured, An automatic continuous soldering apparatus capable of automatically performing stable soldering can be provided.

According to the invention described in claim 4, according to claim 3,
In the automatic continuous soldering apparatus described in the above, since the supply of the thread solder is started at the stop position of the iron tip, the supply amount of the thread solder at each point can be appropriately controlled, and Defects such as solder and solder bridge can be significantly reduced.

According to the fifth aspect of the present invention, the stop time of the iron tip and / or the moving speed of the iron tip are adjusted to increase the contact time ratio of the iron tip, so that the soldering is further ensured. Can be done.

According to the sixth aspect of the present invention, since the weight for adjusting the weight is attached to the portion other than the soldering portion of the iron tip, the contact pressure between the iron tip and the soldering portion can be increased. It is possible to improve solderability.

According to the seventh aspect of the present invention, an air cylinder is provided to adjust the stroke of the tension spring for buffering the vertical movement of the iron tip, and to relax the tension of the tension spring when the iron tip is lowered. Because it was
The contact of the iron tip can be ensured, and the solderability can be further improved.

According to the eighth aspect of the present invention, there is provided means for irradiating a spot beam to a predetermined portion of the soldering portion,
The pre-heating of the part to be soldered is performed before moving the soldering tip, so the temperature of the part to be soldered can be raised without the effect of heating other parts, and the soldering can be performed more reliably. it can.

[Brief description of the drawings]

FIG. 1 is a view showing a main part of an automatic continuous soldering apparatus according to an embodiment of the present invention.

FIG. 2 is a flowchart of a soldering operation when the yarn soldering speed is constant.

FIG. 3 is a flowchart of a soldering operation when a thread soldering feed amount is set at each point.

FIG. 4 is a view showing a main part of a conventional automatic continuous soldering apparatus.

[Explanation of symbols]

1 iron tip, 1a tip of iron tip, 1b holder, 2
Iron tip unit movable part, 2a movable block, 2b
Supporting member, 2r guide groove, 3 rotating shaft, 3a rotating shaft, 3b connecting member, 3c horizontal cylinder, 4 extension spring, 5 iron tip mounting shaft, 6 air cylinder, 7 adjustment weight, 10 soldering unit, 11 movement Base, 12 L-shaped support, 13 vertical cylinder, 1
4 iron tip unit, 15 solder nozzle, 16 optical fiber, 20 horizontal moving robot, 21 printed circuit board, 22 multi-pin parts.

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // B23K 101: 42

Claims (8)

[Claims] 1. An automatic continuous soldering apparatus for automatically supplying thread solder to a soldering iron tip and continuously soldering a plurality of soldering portions on a printed circuit board. A method for controlling an automatic continuous soldering apparatus, wherein the soldering sections are stopped for a predetermined time. 2. The control method for an automatic continuous soldering device according to claim 1, wherein the supply of the thread solder is started at a stop position of the ironing tip. And a control device for controlling a moving speed of the iron tip and a supply amount of the yarn solder. In an automatic continuous soldering apparatus for continuously soldering a soldering portion at a location, the control device is provided with movement control means for moving the iron tip stepwise, and the iron tip is attached to each of the soldering parts. An automatic continuous soldering device, wherein the automatic continuous soldering device is stopped for a certain period of time. 4. The automatic continuous soldering apparatus according to claim 3, wherein the supply of the thread solder is started at a stop position of the iron tip. 5. The automatic continuous soldering apparatus according to claim 3, wherein a stop time of the iron tip and / or a moving speed of the iron tip are adjusted to increase a contact time ratio of the iron tip. 6. The automatic continuous soldering apparatus according to claim 3, wherein a weight for weight adjustment is attached to a portion of the iron tip other than the soldering portion. 7. An air cylinder connected to a tension spring for buffering the vertical movement of the iron tip is provided.
4. The automatic continuous soldering device according to claim 3, wherein the tension of the tension spring is loosened. 8. The automatic continuous soldering device according to claim 3, further comprising means for irradiating a spot beam to a predetermined portion of the soldering portion.