KR100773401B1 - Soldering appartus and control method thereof - Google Patents

Abstract

An automatic lead-free soldering apparatus and a method for controlling the same are provided to improve the quality of a lead-free solder by continuously maintaining temperature of a soldering iron and the length of the lead-free solder to a constant level. An automatic lead-free soldering apparatus comprises a case(100), an elevating device(200), a transfer device(300) and a support(400). The case is provided at a rear surface thereof with a fixing plate(202). A soldering iron(220) protrudes from a front surface of the case. The elevating device elevates the fixing plate along rods(201), which are fixed to an upper plate of the case, as a first cylinder(210) is operated. The first cylinder is installed at a lower surface of the fixing plate on which the soldering iron is installed.

Description

Automatic lead-free soldering device and its control method {Soldering Appartus and Control Method

Figure 1a is a perspective view showing a conventional automatic soldering apparatus.

Figure 1b is a cross-sectional view showing a conventional automatic soldering apparatus.

Figure 2 is a cross-sectional view showing an automatic lead-free soldering apparatus of the present invention.

Figure 3 is a left side view showing the automatic lead-free soldering apparatus of the present invention.

4 is a control flowchart of an automatic lead-free soldering apparatus according to the present invention.

* Description of the symbols for the main parts of the drawings *

100: case 110: control panel

111: power switch 112: heating switch

113: Start button 114: Feed button

115: timer switch 120: protective cover

121: back cover 122: fixing plate

200: lifting device 201: pillar

202: fixing plate 203: ball bush

204: first through 205: second through

206: fixed

210: first cylinder 211: adjusting bolt

220: soldering iron 221: fixed frame

222: hollow 223: fixing bolt

224: bolt

300: feeder 301: bobbin

310: first conveyance port 311: inclined surface

312: first through hole 313: feeder bracket

320: second transport port 321: the second through hole

322: first guide 323: first guide ball

324: first transport stand 325: guide bar

330: third port 331: third through hole

332: second guide 333: second guide ball

334: second transport stand 335: second fixed support

336: fixed period 337: frame

340: second cylinder 341: piston rod

350: third cylinder 351: first fixed support

352: piston rod 353: first pressure port

360: fourth cylinder 361: piston rod

400: pedestal 401: projection

402: vertical frame 403: height adjustment bolt

404: base 405: condenser support

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic lead-free soldering apparatus and a control method thereof, and more particularly, to an automatic lead-free soldering apparatus for lead-free soldering while supplying lead-free (lead) wound in a wire form.

As is well known, soldering is soldering with a soldering iron to bond a member to be joined such as an electric component, an electronic component, or an electric wire to be fixed to the bonding member. This soldering operation is to hold the soldering iron with one hand and to hold the solder in the form of wire in the other hand and to place the solder and the soldering iron at the position to be soldered.

In this soldering operation, the lead is melted by the soldering iron when the solder is brought into contact with the heated soldering iron. The molten lead is naturally cured at room temperature when the lead and the soldering iron are detached from the soldered iron.

The soldering work by manual work generates harmful gases harmful to the human body when the lead is melted, and the soldering work is performed by the manual work, and the work speed is slow, and the soldering is performed in a slightly displaced position instead of the correct position. .

In the case of manual soldering, the size of soldering varies depending on the diameter of the member or wire to be joined. If the soldering size is small, the soldering should be repeated two or three times. This has the disadvantage of limiting the space to be soldered in place.

In addition, the manual soldering operation has a problem in that the quality of the soldering iron is heated to a high melting temperature of the lead, so that the quality of the soldering is different depending on the quantity of soldering.

In order to eliminate such a closed end, various types of soldering apparatuses, such as gun-type soldering apparatuses and automatic soldering apparatuses for automatically soldering have been developed.

Such automatic soldering apparatus is disclosed in Korean Patent Application No. 2001-22222 (hereinafter referred to as "prior art") "automatic soldering apparatus", which is shown in Figures 1a to 1c.

As shown in FIGS. 1A to 1C, the automatic soldering apparatus is applied with a casing 3 equipped with a lead transfer motor 1 and an exhaust gas discharge motor 2 and pressurization of the stepping switch 4. When the lead transfer motor (1) to be driven is heated by a lead (5) mounted on the casing (3) and a heater mounted on the casing (3) so as to be fed to the soldered portion of the member to be joined by a transfer means when driving And a soldering tip 7 for melting and joining the lead 5 to the soldering portion of the member to be joined.

In addition, the discharge means for suctioning and discharging the harmful gas containing dust generated during soldering through the duct (7) by the drive of the exhaust gas discharge motor (2), and is provided in the casing (3) and the lead transfer motor (1) and a control means for controlling the soldering speed by controlling the motor 2 for exhaust gas discharge.

In addition, the soldering tip 6 is formed on the inner edge of the holder 14 which is rotatably fixed to the casing 3, and the harmful gas generated around the soldering tip 6 passes when soldering. It consists of a through hole 15 and a filter 16 mounted above the through hole 15 to collect and filter the harmful gas.

Since the conventional technology uses the motors 1 and 2 to transfer the lead 5 made of wire, noise is generated, and the lead 5 is transferred by driving the motors 1 and 2 so that the transfer distance is accurately transferred. There was a problem that can not be.

The present invention has been made to solve the above problems, an object of the present invention is to control the temperature of the soldering iron and the length of the lead-free supplied in the state that lead-free soldering is optimal, lead-free soldering to increase the quality of lead-free soldering The present invention provides a soldering apparatus and a control method thereof.

In order to achieve the above object, the automatic lead-free soldering apparatus of the present invention is provided with a soldering iron protruding from the front side, and a case with a fixing plate installed on the rear surface, and a first upper cylinder case installed at the bottom of the fixing plate on which the soldering iron is installed. An elevating device for elevating a fixed plate along a column fixed to the elevating device; a conveying device for installing lead-free bobbins wound in the form of wires on the fixed plate and transferring lead-free to a plurality of feed holes installed on the same horizontal line as the fixed plate; It is characterized in that it comprises a pedestal on which the soldering workpiece is placed while being adjusted to the lower part of the iron.

In addition, in the present invention, a soldering iron is installed on the front of the case, a bobbin with a lead-free winding in the form of a wire is installed on the back of the case, a lifting device for elevating the soldering iron is installed inside the case, and the lead-free wound wound on the bobbin is transferred. In the method for controlling the work platform is installed, the lead-free solder is placed under the soldering iron,

Setting a contact time of the soldering iron and a distance for transferring the lead-free wound around the bobbin, lowering the soldering iron with a lifting device, soldering the soldering iron for a set time, and then raising the soldering iron; And transferring the lead-free wound around the bobbin by the operation of the transfer device in the soldering iron direction by a predetermined length, and then retreating the transfer device after the lead-free transfer is made.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

Figure 2 is a cross-sectional view showing the automatic lead-free soldering apparatus of the present invention, Figure 3 is a left side view showing the automatic lead-free soldering apparatus of the present invention, Figure 4 is a right side view showing the automatic lead-free soldering apparatus of the present invention, Figure 5 It is a front view which shows the control panel of the automatic lead-free soldering apparatus by this invention.

Lead-free (soldering) in the present invention is a collectively referred to as containing a small amount even if lead (Pb) is not included. This lead-free is made of Sn-Ag-Cu-based or Sn-Pb, such as low melting point 217 ~ 220 ℃, to reduce the soil and water pollution by heavy metals.

As shown in FIGS. 2 to 5, the automatic lead-free soldering apparatus of the present invention is a lifting apparatus for elevating the case 100 forming the appearance of the lead-free soldering apparatus and the soldering iron 220 installed on the front of the case 100 ( 200, a feeder 300 for transferring lead-free in the form of a wire to the elevator 200, and a pedestal 400 installed under the soldering iron 220.

In addition, the case 100 is formed in a substantially hexahedral shape so that components installed therein do not protrude to the outside, and the control panel 110 is installed on the front of the case 100 as shown in FIG. 3.

The control panel 110 is provided with a power switch 111, a heating switch 112, a start button 113, a transfer button 114 and three timer switches 115.

In addition, the power switch 111 is applied / cut off the power to the automatic lead-free soldering device, the heating switch 112 controls the application / cut-off of the power so that the soldering iron 220 is heated, the start button 113 is automatic lead-free Lead-free soldering is performed by the operation of the soldering device, and the transfer button 114 is transferred to the lead-free device in the form of a wire installed on one side of the automatic lead-free soldering device at a predetermined length interval.

In addition, the control panel 110 is provided with three timer switches 115, these timer switches 115 so that the operator can set the operation of the automatic lead-free soldering device, such as lead-free soldering time, transfer time, return time, etc. as needed Is installed.

In addition, a soldering iron 220 which is elevated by the elevating device 200 is installed on the front of the case 100, and a protective cover 120 protruding forward is installed on both sides of the case 100. Such protective cover 120 is preferably made of a transparent acrylic material.

In addition, a rear cover 121 that is vertically opened and closed is installed on the back of the case 100, and the fixing plate 122 is fixed vertically to the rear of the rear cover 121, that is, to the right side in the drawing of FIG. 2, and the fixing plate ( 122, the fixing groove 123 having a predetermined depth from the top to the bottom is formed.

In addition, the elevating device 200 is fixed to the two pillars 201 perpendicular to the upper plate of the case 100, and the fixed plate 202 is coupled to the pillars 201 to be elevated. The fixing plate 202 couples the ball bush 203 between the pillar 201 and the fixing plate 202 so as to smoothly move up and down vertically along the pillar 201.

In addition, the first plate 204 is formed at a predetermined position in the fixed plate 202, and the first cylinder 210 is installed at the bottom of the first hole 204, and the adjustment bolt 211 is disposed on the first cylinder 210. To combine.

The adjustment bolt 211 is projected over the upper plate of the case 100 and fastened to the upper plate of the case 100 to adjust the height of the fixing plate 202, the piston rod of the first cylinder 210 (not shown in the figure) Fix firmly so as not to be separated from the tip of the adjustment bolt (211).

In addition, a second through hole 205 is formed on one side of the fixing plate 202, and a fixing bar 206 is fixed to the bottom of the second hole 205, and a soldering iron 220 is coupled to the bottom of the fixing bar 206. The fixing frame 221 is fixed.

The fixing frame 221 forms a hollow 222 therein, and fastening the fixing bolt 223 to a plurality of fastening holes formed in the fixing frame 221 to firmly fix the soldering iron 220, and the fixing frame. The other side fastens the bolt 224 so that the fixing frame 221 is fixed to the bottom surface of the fixing section 206.

In addition, the transfer device 300 is to transfer the lead-free in the form of wire from the bobbin 301 by a predetermined length, to the first transfer port 310, the second transfer port 320 and the third transfer port 330. Is done.

In addition, the conveying apparatus 300 is installed on the fixing plate 122 of the back of the case 100, the bobbin 301 winding the lead-free in the form of a wire, the conveying apparatus 300 from the bobbin 301 to the case 100 The first feeder 310, the second feeder 320, and the third feeder 330 are installed in the forward order.

A second cylinder 340 is installed between the first transport port 310 and the second transport port 320, and a third cylinder 350 is installed on the upper surface of the second transport port 320, and a third transport is performed. The fourth cylinder 360 is installed on the upper surface of the sphere 330.

The first transfer port 310 forms an inclined surface 311 inclined from one end to the inside, and forms a first through hole 312 at the tip of the inclined surface 311 so that lead-free passes. In addition, the one side of the first conveying hole 310 is fixed to the feeder support 313 supporting the first conveying hole (310).

In addition, the second feed hole 320 is fixed at a position away from the first feed hole 310, the second through hole 321 is the same as the first through hole 312 on the upper side of the second feed hole (320). To form. In addition, the first guide 322 is horizontally fixed to the other side of the second transfer hole 320, and the first guide hole 323 is formed in the first guide 322 so that lead-free passes.

In addition, the first transfer support 324 is fixed between the second through hole 321 and the first guide hole 323, and the first fixed support 351 is fixed to the upper surface of the second transfer port 320. 1 The third cylinder 350 is installed on the upper surface of the fixed support 351.

The third cylinder 350 is connected to a compressor (not shown), which is an air supply source, and couples the first pressure port 353 to the tip of the piston rod 352 of the third cylinder 350.

In addition, the second conveying hole 320 is provided with a guide bar 325 to move the second conveying hole 320 on one side of the lower side, and the second conveying hole 320 on the other lower portion of the second conveying hole (320). The second cylinder 340 to be moved is installed.

One side of the second cylinder 340 is fixed to the first transfer port 310, and the tip of the piston rod 341 of the second cylinder 340 is fixed to the second transfer hole 320.

In addition, one side of the second transfer hole 320 is installed in a straight line to the third transfer hole 330 in a spaced position. The third transfer hole 330 is installed to protrude toward the front of the case 100, and forms a third through hole 331 through the lead-free in the center of the third transfer hole 330, the third transfer hole 330 The second guide 332 is installed on the rear side, that is, on the right side of the drawing.

A second guide hole 333 through which lead-free passes is formed in the second guide 332 as described above, and the second transfer support 334 is fixed between the third transfer hole 330 and the second guide 332. . In addition, the second fixing support 335 is fixed to the upper surface of the third port 330, and the fourth cylinder 360 is installed on the upper surface of the second fixing support 335.

The piston rod 361 of the fourth cylinder 360 is installed to be sunk onto the upper surface of the second transfer support 335, and a fixed interval 336 is disposed on the bottom of the third transfer port 330 and the second guide 332. It is fixed, and the fixed frame 336 is fixed to the frame 337 vertically.

The pedestal 400 is installed below the frame 337. The pedestal 400 has a predetermined length and the vertical frame 402 is fixed to the vertical frame 402 is formed with a protrusion 401 protruding toward the front of the lower end. In addition, the height adjustment bolt 403 is fastened to the protrusion 401, and the base 404 is fixed to the top of the height adjustment bolt 403.

In addition, the base 404 is provided with a condenser pedestal 405 that is movable in the X, Y, and Z-axis directions to support various types of condensers, and an automatic lead-free soldering device such as a lifting device 200 and a conveying device 300. Install a controller (not shown) that controls all operations of the

The present invention having such a configuration rotatably inserts a lead-free bobbin wound in a wire form into the fixing groove 123 of the fixing plate 122 of the automatic lead-free soldering apparatus. The lead-free wound on the bobbin as described above passes through the first feed hole 310, the second feed hole 320, and the third feed hole 330 to protrude from the tip of the third feed hole 330. A description with reference to FIG.

The lead-free transfer may be carried by pressing the transfer button 114 installed in the control panel 110, and is passed through to the third transfer port 330 by manual operation.

In this case, the lead-free wire is to be different in the protruding length according to the target to be soldered, the length of the lead-free to be transferred can be different depending on the lead-free soldering target.

In addition, the automatic lead-free soldering apparatus rotates the height adjusting bolt 403 installed at the lower portion to elevate the base 404 and the condenser pedestal 405 to an appropriate position. The condenser worktable 405 is adjusted to a position convenient for the operator to reduce the fatigue according to the work, the condenser worktable 405 is X, Y, It is made to move in the Z-axis direction.

In addition, the operator operates the power switch 111 of the control panel 110 to apply power to the automatic lead-free soldering device and the heating switch 112 to supply power to the soldering iron 220.

The soldering iron 220 is heated by an applied power source, and the heating temperature of the soldering iron 220 is heated to a temperature of 320 to 350 ° C. so that the lead-free soldering operation is performed smoothly. The heating temperature of the soldering iron 220 is easy to perform the initial lead-free soldering operation as well as to maintain a constant temperature of the soldering iron 220 used for the initial solderless operation and the last lead-free soldering operation during the lead-free soldering operation In order to set the initial heating temperature of the soldering iron 220 high.

In addition, an operator may use the lead-free soldering time to lead-free soldering the soldering iron 220 to the first timer 115a of the three timers 115, the second timer 115b is a lead-free transfer delay time of the wire, the third The timer 115c sets the temperature control of the soldering iron 220, and these timers 115 are set differently depending on the object to be soldered (S10).

When the preparation work is completed, the operator places the capacitor or other lead-free solder on a top surface of the condenser pedestal 405 in a stable posture that is good for lead-free soldering. In this state in which the lead-free soldering is ready, the operator presses the start button 113.

Accordingly, in the automatic lead-free soldering device, the lifting device 200 is lowered under the control of the controller. The lifting device 200 descends the first cylinder 210 coupled to the adjustment bolt 211 is lowered.

The first cylinder 210 is lowered as the piston rod of the first cylinder 210 is drawn out from the adjustment bolt 211, and the first cylinder 210 is lowered, and the fixed plate 202 is the first cylinder 210. Lowered together with, the fixing plate 202 is smoothly lowered by combining the two pillars 201 and the ball bush 203 (S11).

The lowering of the fixed plate 202 lowers the soldering iron 220 fixed to one side hollow 222, and the lowered soldering iron 220 protrudes at a predetermined position of the condenser placed on the condenser pedestal 405. Contact.

The lead-free in contact with the soldering iron 220 is melted and fused by the heated soldering iron 220.

The contact time of the soldering iron 220 is in contact with the first timer 115a for a predetermined time, and when the contacting time is over, the soldering iron 220 is raised. This soldering iron 220 is raised by the operation of the first cylinder 210 according to the control signal of the controller (S12).

In addition, the elevating device 200 can be adjusted to a high or low height by the adjustment bolt 211 fixed to the upper plate of the case 100, the height adjustment of the elevating device 200 is the lifting of the soldering iron 220 It can save time.

As the lifting device 200 is raised in this way, the transfer device 300 transfers the lead-free wound around the bobbin toward the soldering iron 220.

That is, the lead-free transfer is a state that spans between the third transfer port 330 from the bobbin through the first transfer port 310 to the second transfer hole 320, the first and second guides (322,332), Under the control of the controller, the piston rod 352 of the third cylinder 350 is lowered.

Accordingly, the lead-free is maintained by the first transfer support 324 and the first pressure port (353) by the lowering of the first pressure port (353) coupled to the piston rod (352). In this state, the third cylinder 340 operates the second transfer port 320 in the direction of the pedestal 400.

The second transfer hole 320 is moved along the guide bar 325 installed on one side in the left direction of FIG. 2, and the lead-free transfer to the second transfer hole 320 is performed by the third transfer hole 330. It protrudes from the front end of the three through holes 331 (S13).

As such, after the second transfer port 320 is moved, the fourth cylinder 360 installed in the third transfer port 330 is operated. The fourth cylinder 360 is fixed to the lead-free placed on the second transfer support 334 by the operation of the piston rod 361.

That is, the lead-free conveyed to the second conveying hole 320 discharges the lead-free to the third through hole 331 of the third conveying port 330 in the same length as the conveyed distance of the second conveying hole (320).

As described above, when lead-free is fixed to the third port 330, the second port 320 is retracted. The retraction of the second feed hole 320 raises the piston rod 352 of the third cylinder 350 to release the fixed lead-free. In addition, as the second cylinder 340 returns the extracted piston rod, only the second transfer hole 320 is retracted (S14).

In addition, the operator stably places the new lead-free soldering object while discharging the solderless product from the condenser work bench 405 during the soldering iron 220 and the lead-free transfer time.

This automatic lead-free soldering device is immediately switched to a work standby state after the end of the circulation process so that the next work can be performed.

The present invention improves the quality of lead-free soldering by reducing the work time and continuously maintaining the lead-free soldering temperature because the work from the lowering of the soldering iron to the lead-free resupply process is performed in a single cycle. In addition, according to the lead-free soldering work object and the thickness of the lead-free, such as the heating temperature of the soldering iron, the lead-free transfer distance, etc., it is useful to provide the convenience to work properly as necessary.

Claims (10)

A case with a soldering iron protruding from the front and a fixing plate on the back, An elevating device for elevating the fixed plate along a column fixed to the upper case of the case by operating a first cylinder installed on a lower surface of the fixed plate on which the soldering iron is installed; A transfer device for installing lead-free bobbins wound in a wire form on the fixed plate and transferring lead-free to a plurality of transfer holes installed on the same horizontal line as the fixed plate; An automatic lead-free soldering device, characterized in that it comprises a pedestal on which the lead-free soldering object is placed while being adjusted to the lower portion of the soldering iron. The method of claim 1, The elevating device is a control bolt fastened to be adjusted to the upper case of the case, the fixed bolt on both sides of the control bolt, a fixed cylinder to guide the fixing plate, the first cylinder is installed on the lower end of the adjusting bolt and the fixing plate, hollow on one side of the fixing plate Automatic lead-free soldering device characterized in that the formed fixed frame is installed. The method of claim 2, The transfer device includes a first transfer port installed at a position adjacent to the fixing plate, a second transfer hole spaced apart from the first transfer hole in the soldering iron direction, and a third transfer hole spaced apart from the second transfer hole in the soldering iron direction. Automatic lead-free soldering device characterized in that the installation. The method of claim 3, The pedestal is fixed to the vertical frame formed with a projection protruding to the front of the lower soldering iron, an automatic lead-free soldering device characterized in that the height adjustment bolt for adjusting the height of the condenser pedestal is installed on the vertical frame. The method of claim 4, wherein The transfer device is provided with a second cylinder for transferring the second transfer port between the first transfer port and the second transfer port, a third cylinder for temporarily fixing the lead-free in the form of a wire is installed on the upper surface of the second transfer port And a third cylinder installed at a position spaced apart from the second transfer port, wherein a fourth cylinder for temporarily fixing the lead-free in the form of a wire is installed on an upper surface thereof. The method of claim 5, The second transfer port of the transfer device is a lead-free soldering device is formed on one side, the lead-free soldering device, characterized in that the first transfer support is installed on the upper surface of the second transfer port to be stably fixed lead-free. The method of claim 6, The third transfer port of the transfer device is a lead-free soldering device is formed on one side through the lead-free, automatic transfer soldering apparatus, characterized in that the second transfer support is installed on the upper surface of the third transfer port to secure the lead-free. A soldering iron is installed on the front of the case, a bobbin with a lead-free winding in the form of a wire is installed on the back of the case, a lifting device for elevating the soldering iron is installed inside the case, and a transfer device for transferring the lead-free wound on the bobbin is installed. In the method of controlling the workbench to place the lead-free solder object under the soldering iron, Setting a contact time of the soldering iron and a distance for transferring the lead-free wound around the bobbin; Lowering the soldering iron with a lifting device; Lead-free soldering the soldering iron for a set time and then raising the soldering iron; Transferring the lead-free wound around the bobbin by the operation of the transfer device in the soldering iron direction by a predetermined length; And a transfer device is retracted after the lead-free transfer is performed. The method of claim 8, The soldering iron lowering step is a control method of an automatic lead-free soldering device characterized in that the fixing plate is lowered by the operation of the first cylinder installed on the bottom of the fixed plate and the soldering iron installed on one side simultaneously. The method of claim 8, The lead-free transfer step may be performed by the operation of a second cylinder installed between the first and second feed holes in a state where the lead-free is fixed by the lowering of the third cylinder installed on the upper surface of the second feed hole via the first feed hole. A control method for an automatic lead-free soldering apparatus characterized by moving the lead-free by movement.

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