JPS63273400A - Electronic component mounting device - Google Patents

Abstract

PURPOSE:To raise the mounting accuracy by supplying a soldering medium to a mounting region while altering the relative position of soldering medium supply means and a substrate on substrate placing means along the region under the control of control means, and then mounting it by component feeding and mounting means to eliminate the waste of flux. CONSTITUTION:An electronic component is contained in a tray 11. Control means reads out a control program from a memory, reciprocates a moving body 15 to a tray 11a, releases an attraction head 16, and places it on a base 17. Soldering medium supply means 5 supplies it in a suitable amount only to the mounting region of a substrate 110 from a flux head by the control means. Then, a feeding and mounting head moves on the base 17 to attract a component, carry it to the region and position it. A heating current is supplied from a transformer 58 to solder the component to the region. With this configuration,. the supply of the component, the coating of the flux, the feeding and mounting of the component are efficiently repeated to improve the mass productivity.

Description

[Detailed Description of the Invention] [Object of the Invention] (Field of Industrial Application) The present invention is applicable to, for example, a flat package (FlatPaCk
The present invention relates to an electronic component mounting apparatus that mounts electronic components such as a(le) type ICs at predetermined positions on a substrate.

(Prior Art) In this type of electronic component mounting apparatus, there are the following steps: transportation and positioning of a board on which electronic components are to be mounted, supply of flux as a soldering medium to a predetermined area of the positioned board, and supply of flux. The device is configured to transfer and mount (solder) electronic components to a predetermined area of the board.

However, in the past, the supply of flux to a predetermined area of the board was done manually, and after this rough flux application work, electronic components were manually transferred one by one to the flux application area. It was soldered.

For this reason, the mounting efficiency of electronic components is extremely low, resulting in a lack of mass production. In addition, problems such as wasted flux due to supplying more flux than necessary to the board and variations in the accuracy of mounting electronic components on the board occur. be.

(Problems to be Solved by the Invention) As described above, the conventional apparatus has problems in that it lacks mass productivity, leads to unnecessary consumption of flux, and leads to a decrease in mounting accuracy.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component mounting apparatus that is excellent in mass productivity, eliminates unnecessary consumption of soldering media, and has good mounting accuracy.

[Structure of the Invention] (Means for Solving the Problems) The electronic component mounting apparatus of the present invention has a board mounting device configured to place a board on which an electronic component is to be mounted and to be movable over a predetermined range. a soldering medium supplying means for supplying a soldering medium in a non-contact manner to a mounting area formed on the board placed on the board mounting means; an electronic component transfer/mounting means for transferring and mounting electronic components to a mounting area supplied with the soldering medium and a control means for operating each of the means at predetermined timing; After supplying the soldering medium to the mounting area while changing its relative position with respect to the board on the mounting means along the mounting area, the electronic component is mounted by the electronic component transfer/mounting means.

(for production) The operation of the apparatus having the above configuration will be explained below.

The board on which the electronic component mounting area is formed is placed on the board mounting means.

The soldering medium supply means supplies the soldering medium to the mounting area on the board under the control of the control means. At this time, the control means controls the relative position between the soldering medium supply means and the board on the board mounting means Since the position changes along the mounting area of the board, the soldering medium can be supplied only to the mounting area without waste.

Thereafter, the electronic component transfer/mounting device transfers and mounts the electronic component to the mounting area on the board to which the soldering medium has been supplied under the control of the control means.

(Example) Examples of the present invention will be described in detail below.

The electronic component mounting apparatus 1 shown in FIGS. 1 to 3 includes an apparatus main body 2, an electronic component supply means 3 built into the apparatus main body 2, a board mounting means 4, a soldering medium supply means 5, and a transport/
and a mounting means 6.

As shown in FIGS. 1 and 2, the electronic component supply means 3 is mounted on the upper surface of the device main body 2 by a support 7 over a range from the left end of the device main body 2 to the right side of the center. The base 8 is supported in a horizontal arrangement, and above the base 8, the horizontal arrangement extends from approximately the center of the base 8 toward the right side to near the right end of the device main body 2. The constructed X-direction guide rail 9 and the base 8
on the right side of the X-direction guide rail 9 and below the X-direction guide rail 9. a Y-direction guide rail 1Q arranged in the Y direction perpendicular to
, a second tray 11b for mounting a large number of flat package type ICs 100, one end side is connected to this tray part 11, and the other end side is connected to the Y direction guide rail 10. Y placed below
a screw body 14 screwed onto a drive body 13 driven by a direction drive motor 12; an X-direction movable body 15 guided in the X direction by the X-direction guide rail 9; In the figure, there is a supply head 16 that has the ability to suction the electronic component 100 fixed to the lower end, and a center portion is located on the base 8 and directly below the head portion 16a of the supply head 16. a rotatable electronic component mounting table 17 arranged to
an X-direction drive motor 18 for applying a driving force in the X-direction to the
The power transmission unit 19 includes a power transmission section 19 that transmits power to the directional moving body 15. The Y-direction drive motor 12. The X-direction drive motor 18 constitutes an electronic component supply drive section 20 .

As shown in FIGS. 1 and 3, the substrate mounting means 4 includes:
An X-table 21 is placed on the lower side of the base 8 in FIG. a substrate table 23 consisting of a Y table 22;
It includes an X table drive section 24 that moves the X table 21 in the X direction, and a Y table drive section 25 that moves the Y table 22 in the Y direction.

The Y-table drive unit 25 screws a fixing member 27 fixed to the lower side of the Y-table 22 to a rotary screw body 26 arranged rotatably in the Y direction on the lower side of the Y-table 22. It also has a Y-table drive motor 28 that applies rotational force to the rotary screw body 26, and the Y-table drive motor 28 drives the Y-table 22 in the Y direction.

The X table driving section 24 has fixing members 30 protruding from the lower side of the X table 21 screwed into a pair of two rotating screw bodies arranged in the X direction on the Y table 22, and It has an X-table drive motor 30 that applies rotational force to each rotary screw body 29, and this X-table drive motor 30 drives the X-table 21 in the X direction. The X table drive section 24 and the Y table drive section 25 constitute a substrate table drive section 31.

Further, as shown in FIG. 3, a substrate mounting table 32 is provided on the X table 21, and the substrate 110 is placed and fixed on this substrate mounting table 32.

The soldering medium supply means 5 is attached to a support stand 33 that is fixedly arranged near the electronic component mounting table 17 on the base stand 8, and is driven in the Y direction and the Z direction (vertical direction). There is. That is, this soldering medium supply means 5 is
a horizontal support stand 34 horizontally arranged on the support stand 33;
A flux head support 35 supported in a vertical arrangement by the horizontal support 34, a flux head 36 protruding downward from the lower end of the flux head support 35, and a flux head 36 provided above the flux head support 35. a protruding piston 37 for driving a flux head;
The flux head 36 is connected to the piston rod 37a of the piston 37, and the displacement of the piston rod 37a is controlled by the flux head 36.
a connecting member 38 for transmitting power to the flux head support 35° cylinder 37. It includes a Y-direction driving piston 39 that drives the flux head 36 in the Y-direction.

The piston 27. Y direction drive piston 39
The flux head drive unit 40 is configured by the above.

In addition, 41 in FIG. 1 is a flux dispenser that stores flux as a soldering medium provided on the base 8, and from this flux dispenser 41 to the flux head 36 as shown in FIG. Flux is supplied through a pipe body 42 such as a vinyl pipe.

Here, a specific example of the flux head 36 will be explained with reference to FIG. 4.

The flux head 36 shown in the figure is arranged concentrically with a first cylindrical body 44 having a connecting portion 43 of the tube body 42, and is arranged concentrically with the first cylindrical body 44, and A second cylindrical body 45 fitted below the second cylindrical body 44 , a third cylindrical body 46 fitted below the second cylindrical body 45 , and a third cylindrical body 46 fitted below the second cylindrical body 44 . A cylindrical head portion 4 removably fitted to the lower side of the
7, and the second. Flow rate adjustment that adjusts the flux flow 1 that flows through the flow path 48 that is screwed into the overlapping portion of the third cylindrical body 45.46 and is formed concentrically in the center of each cylindrical body 44, 45.46. 49. Further, the cylindrical head portion 47 has an extraction hole 47 arranged concentrically with the flow path 48.
a is drilled, and the flux is extracted from the extraction hole 47a to the mounting area (wiring pattern area) 111 of the board 110.

The transfer/mounting means 6 has a head support 50 supported in a vertical arrangement by the horizontal support 34, and a transfer/mounting head consisting of a heat sink 51 and a heater chip 52 is mounted below the head support 50. A head driving piston 54 is disposed above the head support body 50 while supporting the section 53 in a vertical arrangement.

The transfer/mounting head section 53 is driven in seven directions by a head driving piston 54.

Further, the head support body 50. Transfer/mounting head section 53
The head driving piston 54 is driven in the Y direction by the Y direction driving piston 39. The head driving piston 54. A transfer/mounting head drive unit 55 is constituted by the Y-direction driving piston 39 and the like.

Roughly speaking, a transformer 58 consisting of a first transformer 56° and a second transformer 57 is arranged on the base 8, and a heating current is supplied from the transformer 58 to the heater chip 52.

In general, the transfer/mounting head section 5 including the heater chip 52
No. 3 has the ability to suction and hold the electronic component '100 shown in FIG. In addition, 101 in FIG. 5 is the electronic component body, 10
2 are lead terminals protruding outward from the four sides of the electronic component body 101.

FIG. 6 shows an example of a board 110 on which the electronic component 100 is to be mounted, and the number of lead terminals corresponding to the lead terminals 102 is arranged on the surface of the board 110.

A shaped mounting area (wiring pattern) 111 is formed.

Next, referring to FIG. 7, the control system of the above-described embodiment device will be explained.

This control system includes a control means 60 that controls the entire electronic component supply means 3. The board mounting means 4 is connected to the soldering medium supply means 5 and the transfer/mounting means 6, respectively, and the control means 60 is connected to a memory 61 in which a control program for this device is stored in advance, and each operation by this device is connected to the board mounting means 4. It is constructed by connecting an operating section 62 for issuing commands.

Next, the operation of the device having the above configuration will be explained using the substrate 110 shown in FIG.
A case will be described in which the electronic component 100 shown in FIG. 5 is mounted in the mounting area 111 of FIG.

Note that a large number of electronic components 100 are placed on the first tray 11a in advance, and the supply head 16° flux head 36. It is assumed that the transfer/mounting head sections 53 are in the positions shown in FIG. 1, respectively.

When an operation start command is given from the operation unit 62 in this state, the control means 60 loads the control program from the memory 61, and
Based on this, the X-direction drive motor 18 is first started to move the X-direction moving body 15 and supply head 16 toward the first tray 11a. Then, the supply head 16 is connected to the first tray 11a.
-H supply head 1 at the stage where it reaches the electronic component 100 above.
Stop 6.

After the electronic component 100 is sucked by the suction gate function of the supply head 16 at this position, the X-direction drive motor 1
8 is reversed, the supply head 16 and the electronic component 100 are transferred to the initial position, and the electronic component 100e is placed on the electronic component mounting table 17.

Thereafter, after the suction function of the supply head 16 is canceled, the supply head 16 is removed from the electronic component mounting table 100 in order to move on to the next supply operation of the electronic component 100.

On the other hand, the flux head drive unit 40 from the soldering medium supply means 5 drives the flux head 36 under the control of the control means 60 to the mounting area 14111 on the board 110 positioned and fixed on the board mounting table 32. Apply 7 lux.

The flux is applied to the mounting area 111 by the flux head 36 as shown in FIG.
7 is performed without contacting the substrate 110, and the relative position of the flux head 36 and the mounting area 111 is set to the flux head drive unit 40 and the substrate table drive unit 31.
The driving is performed while changing along the mounting area vi, 111. Moreover, by setting the flow rate adjustment section 49 at an appropriate position at this time, the flux can be adjusted to the mounting area 1.
An appropriate amount of flux is applied only to No. 11, thereby avoiding waste of flux as in conventional devices.

In this way, the mounting area 1 by the flux head 36 is
After applying flux to No. 11, it is time to transfer and
The mounting head drive section 55 first moves the transfer/mounting head section 53 to the electronic component mounting table 17 under the control of the control means 60.
Then, the head driving piston 54 operates to bring the heater chip 52 of the transfer/mounting head section 53 into contact with the electronic component 100 and simultaneously hold it by suction.

In this state, the transfer/mounting head unit 53 is transferred by the transfer/mounting head drive unit 40 onto the mounting area 111 on the board 110 coated with flux, and the leads of the electronic component 100 are roughly held by suction. From positioning the terminals 102 and the mounting area 111, soldering the lead terminals 102 and the mounting area 111 by supplying heating current from the transformer 58 of the heater chip 52, releasing the electronic component 100 from the transfer/mounting head section 53, etc. A series of operations are performed, whereby the electronic component 100 is mounted in the mounting area 111 with high precision.

Thereafter, the substrate table driving section 31 moves the substrate table 23 in the X direction or the Y direction under the control of the control means 60 to prepare for mounting in the next stage mounting area 111.

Further, the electronic component supply drive section 20 operates the supply head 16 in the same manner as described above during the above-described flux supply by the flux head 36 and the transfer and mounting operation of the electronic component 100 by the transfer/mounting head section 53. The next electronic component 100 is placed on the electronic component mounting table 1 by reciprocating in the Y direction.
7. Place it on top.

In this way, electronic components 100 are supplied one after another.

Application of flux to mounting area 111, electronic component 100
Since the transportation and mounting of the parts can be repeated efficiently, mass productivity can be improved.

The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the invention.

[Effects of the Invention] According to the present invention described in detail above, it is possible to provide an electronic component mounting apparatus that does not waste soldering media, has good mounting accuracy, and is excellent in mass productivity.

[Brief explanation of drawings]

Fig. 1 is a plan view of an embodiment of the device of the present invention, Fig. 2 is a front view of the device, Fig. 3 is a side view of the device, and Fig. 4 is an enlarged cutaway cross section showing an example of a flux head in the device. figure,
FIG. 5 is a plan view showing an example of electronic components mounted by the same device, FIG. 6 is a partial perspective view showing a board in the same device, and FIG. 7 is a block diagram showing a control system of the same device. DESCRIPTION OF SYMBOLS 1... Electronic component mounting device, 3... Electronic component supply means, 4... Board mounting means, 5... Soldering medium supply means, 6... Transfer/mounting means, 44... a first cylindrical body;
45... second cylindrical body, 46... third cylindrical body, 4
7... Cylindrical head part, 48... Channel, 60... Control means, 100... Electronic component, Fig. 5 Fig. 6 Concave Fig. 7

Claims (3)

[Claims] (1) A board mounting means configured to place a board on which electronic components are to be mounted and to be movable over a predetermined range;
a soldering medium supply means for supplying a soldering medium in a non-contact manner to a mounting area formed on the board placed on the board mounting means; and a soldering medium is supplied by the soldering medium supply means. It has an electronic component transfer/mounting means for transferring and mounting electronic components to a mounting area, and a control means for operating each of the means at predetermined timings, and a control means for operating the respective means at predetermined timings, An electronic component mounting apparatus characterized in that after supplying a soldering medium to the mounting area while changing its relative position with respect to the board along the mounting area, the electronic component is mounted by the electronic component transfer/mounting means. . (2) The soldering medium supply means includes a cylindrical body provided with a flow path through which flux as a soldering medium flows, and a cylindrical head attached to the tip of the cylindrical body to extract the flux to the outside. 2. The electronic component mounting apparatus according to claim 1, further comprising a flow rate adjustment unit capable of adjusting the flow rate of the flux flowing through the flow path provided in the cylindrical body. (3) The supply of the soldering medium to the mounting area on the board of the soldering medium supply means is performed under control by a control means based on a predetermined control program. Electronic component mounting equipment.