JP2000506619A - 光学式高さ測定器、このような高さ測定器を有する表面検査デバイス、及びこの検査デバイスを有するリソグラフィックデバイス - Google Patents
光学式高さ測定器、このような高さ測定器を有する表面検査デバイス、及びこの検査デバイスを有するリソグラフィックデバイスInfo
- Publication number
- JP2000506619A JP2000506619A JP10528589A JP52858998A JP2000506619A JP 2000506619 A JP2000506619 A JP 2000506619A JP 10528589 A JP10528589 A JP 10528589A JP 52858998 A JP52858998 A JP 52858998A JP 2000506619 A JP2000506619 A JP 2000506619A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- radiation
- height measuring
- inspection
- reflected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.第1の表面に対向する第2の反射表面を有する透明物体の当該第1の表面の 高さを測定する為の光学式の高さ測定器であって、主光線が第1の表面上の法 線に対して第1の角を成して延在する収束測定ビームを供給する為の放射源ユ ニットと、第1の表面によって反射された放射ビームを検出する為の位置感応 検出ユニットとを具え、前記放射ビームの主光線が前記法線に対して第1の角 に対して逆の第2の角を成して延在し、絞りが反射された放射ビームの放射路 で第1の表面と検出ユニットとの間に配置されている当該光学式の高さ測定器 において、絞りの配置位置及び開口位置を、第1の反射された前記放射ビーム だけが前記開口を通過して検出ユニットに到達できるようなものとして、第2 の表面により反射された第2の放射ビームを絞りにより遮蔽することを特徴と する光学式の高さ測定器。 2.前記測定ビームの焦点を前記物体の背後の平面で合わせ、絞りを第1の反射 ビームの焦平面と第2の反射ビームの焦平面との間の平面に配置したことを特 徴とする請求項1に記載の光学式の高さ測定器。 3.絞り開口が、第1の反射された放射ビームの主光線と第2の反射された放射 ビームの主光線との間の距離にほぼ等しい直径を有することを特徴とする請求 項1或いは2に記載の光学式の高さ測定器。 4.測定ビームと前記第1の表面上の法線との間の角度を50°程度としたこと を特徴とする請求項1乃至3のいずれか1項に記載の光学式の高さ測定器。 5.第1の表面の領域で測定ビームによって形成された放射スポットと絞りとの 間の距離をできるかぎり短くしたことを特徴とする請求項1乃至4のいずれか 1項に記載の光学式の高さ測定器。 6.物体の少なくとも1つの表面を検査する為の光学式の検査デバイスであって 、少なくとも1つの検査ビームを供給する為の放射源と、検査すべき表面に向 かって検査ビームを案内し且つこのビームの焦点を合わせる為の各検査ビーム 用の光学系と、検査すべき表面に対して検査ビームを移動させて全表面を走査 する走査手段と、検査すべき表面に対して垂直な方向でこの表面の位置をチェ ッ クする為の高さ測定器とを含む、光学式の検査デバイスにおいて、前記高さ測 定器を請求項1乃至5のいずれか1項に記載のような測定器としたことを特徴 とする光学式の検査デバイス。 7.リソグラフィックマスク上の埃粒子を検出し且つリソグラフィックマスクの 欠陥を検出する為のマスク検査デバイスであって、請求項6に記載の光学式の 検査デバイスによって構成されたマスク検査デバイス。 8.基板上にマスクのパターンを結像する為のリソグラフィック装置であって、 照明系と、マスクを収容する為のマスクテーブルと、基板を収容する為の基板 テーブルとを含む当該リソグラフィック装置において、請求項7に記載のマス ク検査デバイスを、マスクテーブルに向かうマスク供給路に配置したことを特 徴とするリソグラフィック装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96203736 | 1996-12-24 | ||
EP96203736.2 | 1996-12-24 | ||
PCT/IB1997/001546 WO1998028661A2 (en) | 1996-12-24 | 1997-12-08 | Optical height meter, surface-inspection device provided with such a height meter, and lithographic apparatus provided with the inspection device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000506619A true JP2000506619A (ja) | 2000-05-30 |
JP4163258B2 JP4163258B2 (ja) | 2008-10-08 |
Family
ID=8224779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52858998A Expired - Fee Related JP4163258B2 (ja) | 1996-12-24 | 1997-12-08 | 光学式高さ測定器、このような高さ測定器を有する表面検査デバイス、及びこの検査デバイスを有するリソグラフィックデバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | US6166808A (ja) |
EP (1) | EP0892910A2 (ja) |
JP (1) | JP4163258B2 (ja) |
KR (1) | KR100496913B1 (ja) |
WO (1) | WO1998028661A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112213241A (zh) * | 2019-07-12 | 2021-01-12 | 日新电机株式会社 | 尘埃堆积探测装置 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3919149B2 (ja) * | 2000-03-24 | 2007-05-23 | パイオニア株式会社 | 光ヘッド装置 |
FR2811761B1 (fr) * | 2000-07-17 | 2002-10-11 | Production Rech S Appliquees | Ellipsometre a haute resolution spatiale fonctionnant dans l'infrarouge |
US6870611B2 (en) * | 2001-07-26 | 2005-03-22 | Orbotech Ltd. | Electrical circuit conductor inspection |
JP2002195819A (ja) * | 2000-12-27 | 2002-07-10 | Nikon Corp | 形状測定方法、形状測定装置、露光方法、露光装置、及びデバイス製造方法 |
US7385698B1 (en) | 2001-01-09 | 2008-06-10 | J.A. Woollam Co., Inc. | System and method of selectively monitoring sample front and backside reflections in ellipsometer and the like systems |
US7768660B1 (en) | 2001-01-09 | 2010-08-03 | J.A. Woollam Co., Inc. | Non-destructive approach to ellipsometric monitoring of a film coating on the inner surface of a tube shaped sample |
US7477388B1 (en) | 2001-01-09 | 2009-01-13 | J.A. Woollam Co., Inc. | Sample masking in ellipsometer and the like systems including detection of substrate backside reflections |
US7232695B2 (en) * | 2005-06-10 | 2007-06-19 | International Business Machines Corporation | Method and apparatus for completely covering a wafer with a passivating material |
US8152365B2 (en) * | 2005-07-05 | 2012-04-10 | Mattson Technology, Inc. | Method and system for determining optical properties of semiconductor wafers |
DE102006015792A1 (de) * | 2006-04-05 | 2007-10-18 | Isra Surface Vision Gmbh | Verfahren und System zur Formmessung einer reflektierenden Oberfläche |
JP2008071839A (ja) * | 2006-09-12 | 2008-03-27 | Canon Inc | 表面位置検出方法、露光装置及びデバイスの製造方法 |
US20080117438A1 (en) * | 2006-11-16 | 2008-05-22 | Solvision Inc. | System and method for object inspection using relief determination |
US7733505B2 (en) * | 2007-03-26 | 2010-06-08 | The Boeing Company | Attitude detection system and method |
US8189194B2 (en) * | 2008-09-12 | 2012-05-29 | Cognex Corporation | Direct illumination machine vision technique for processing semiconductor wafers |
US8570516B2 (en) * | 2008-09-12 | 2013-10-29 | Cognex Corporation | Infrared direct illumination machine vision technique for semiconductor processing equipment |
JP5206344B2 (ja) * | 2008-11-14 | 2013-06-12 | オムロン株式会社 | 光学式計測装置 |
KR101209857B1 (ko) * | 2009-02-20 | 2012-12-10 | 삼성코닝정밀소재 주식회사 | 유리 표면 이물 검사 장치 및 방법 |
US9140655B2 (en) * | 2012-12-27 | 2015-09-22 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Mother glass inspection device and mother glass inspection method |
CN104034508B (zh) * | 2013-03-08 | 2017-01-11 | 佳能株式会社 | 光学检查设备和光学检查系统 |
KR101744149B1 (ko) * | 2016-02-26 | 2017-06-07 | 이영우 | 기판 검사장치 |
TWI673491B (zh) * | 2017-02-17 | 2019-10-01 | 特銓股份有限公司 | 光箱結構及應用彼光學檢測設備 |
TWI689721B (zh) * | 2017-02-17 | 2020-04-01 | 特銓股份有限公司 | 基於利用光學技術掃描透明板材表面污染之方法及其系統 |
TWI673486B (zh) * | 2018-02-13 | 2019-10-01 | 特銓股份有限公司 | 光學檢測設備及其光源尋邊機構 |
US11004253B2 (en) * | 2019-02-21 | 2021-05-11 | Electronic Arts Inc. | Systems and methods for texture-space ray tracing of transparent and translucent objects |
US11988615B2 (en) * | 2019-02-28 | 2024-05-21 | Lumina Instruments Inc. | Region prober optical inspector |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3807870A (en) * | 1972-05-22 | 1974-04-30 | G Kalman | Apparatus for measuring the distance between surfaces of transparent material |
US3857637A (en) * | 1973-01-10 | 1974-12-31 | Ppg Industries Inc | Surface distortion analyzer |
GB1566398A (en) * | 1975-11-07 | 1980-04-30 | Planer Ltd G | Thickness measurements |
FR2504281A1 (fr) * | 1981-04-16 | 1982-10-22 | Euromask | Appareil de projection a dispositif de mise au point |
JPS58113706A (ja) * | 1981-12-26 | 1983-07-06 | Nippon Kogaku Kk <Nikon> | 水平位置検出装置 |
JPH03231103A (ja) * | 1990-02-07 | 1991-10-15 | Mizojiri Kogaku Kogyosho:Kk | 透明板被覆薄膜の光学的測定方法 |
GB2248926B (en) * | 1990-10-17 | 1994-08-31 | Pilkington Plc | Apparatus for determining the surface topography of an article |
JP3109840B2 (ja) * | 1990-12-28 | 2000-11-20 | キヤノン株式会社 | 面状態検査装置 |
JP2933736B2 (ja) * | 1991-02-28 | 1999-08-16 | キヤノン株式会社 | 表面状態検査装置 |
US5510892A (en) * | 1992-11-25 | 1996-04-23 | Nikon Corporation | Inclination detecting apparatus and method |
US5737074A (en) * | 1995-12-05 | 1998-04-07 | New Creation Co., Ltd. | Surface inspection method and apparatus |
-
1997
- 1997-12-04 US US08/984,748 patent/US6166808A/en not_active Expired - Lifetime
- 1997-12-08 KR KR10-1998-0706527A patent/KR100496913B1/ko not_active IP Right Cessation
- 1997-12-08 JP JP52858998A patent/JP4163258B2/ja not_active Expired - Fee Related
- 1997-12-08 WO PCT/IB1997/001546 patent/WO1998028661A2/en active IP Right Grant
- 1997-12-08 EP EP97913397A patent/EP0892910A2/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112213241A (zh) * | 2019-07-12 | 2021-01-12 | 日新电机株式会社 | 尘埃堆积探测装置 |
JP2021015037A (ja) * | 2019-07-12 | 2021-02-12 | 日新電機株式会社 | 塵埃堆積検知装置 |
JP7234838B2 (ja) | 2019-07-12 | 2023-03-08 | 日新電機株式会社 | 塵埃堆積検知装置 |
CN112213241B (zh) * | 2019-07-12 | 2024-05-17 | 日新电机株式会社 | 尘埃堆积探测装置 |
Also Published As
Publication number | Publication date |
---|---|
WO1998028661A2 (en) | 1998-07-02 |
US6166808A (en) | 2000-12-26 |
KR100496913B1 (ko) | 2005-09-30 |
KR19990087136A (ko) | 1999-12-15 |
JP4163258B2 (ja) | 2008-10-08 |
WO1998028661A3 (en) | 1998-08-13 |
EP0892910A2 (en) | 1999-01-27 |
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