JP2000503948A - リキッドのフォトイメージを造るソルダーマスクのためのソフトパックパッケージ及びディスペンシングシステム - Google Patents
リキッドのフォトイメージを造るソルダーマスクのためのソフトパックパッケージ及びディスペンシングシステムInfo
- Publication number
- JP2000503948A JP2000503948A JP9527644A JP52764497A JP2000503948A JP 2000503948 A JP2000503948 A JP 2000503948A JP 9527644 A JP9527644 A JP 9527644A JP 52764497 A JP52764497 A JP 52764497A JP 2000503948 A JP2000503948 A JP 2000503948A
- Authority
- JP
- Japan
- Prior art keywords
- components
- container
- reaction product
- mixed
- bag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 73
- 239000007788 liquid Substances 0.000 title description 10
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 79
- 238000002156 mixing Methods 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 35
- 239000000203 mixture Substances 0.000 claims abstract description 33
- 238000005192 partition Methods 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims 1
- 239000000047 product Substances 0.000 abstract description 12
- 238000007650 screen-printing Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000007766 curtain coating Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000013056 hazardous product Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000020357 syrup Nutrition 0.000 description 1
- 239000006188 syrup Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/04—Partitions
- B65D25/08—Partitions with provisions for removing or destroying, e.g. to facilitate mixing of contents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
- B01F31/55—Mixers with shaking, oscillating, or vibrating mechanisms the materials to be mixed being contained in a flexible bag submitted to periodical deformation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F33/00—Other mixers; Mixing plants; Combinations of mixers
- B01F33/50—Movable or transportable mixing devices or plants
- B01F33/501—Movable mixing devices, i.e. readily shifted or displaced from one place to another, e.g. portable during use
- B01F33/5011—Movable mixing devices, i.e. readily shifted or displaced from one place to another, e.g. portable during use portable during use, e.g. hand-held
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/71—Feed mechanisms
- B01F35/713—Feed mechanisms comprising breaking packages or parts thereof, e.g. piercing or opening sealing elements between compartments or cartridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/71—Feed mechanisms
- B01F35/713—Feed mechanisms comprising breaking packages or parts thereof, e.g. piercing or opening sealing elements between compartments or cartridges
- B01F35/7133—Opening clips which seal openings between the compartments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/32—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents for packaging two or more different materials which must be maintained separate prior to use in admixture
- B65D81/3261—Flexible containers having several compartments
- B65D81/3266—Flexible containers having several compartments separated by a common rupturable seal, a clip or other removable fastening device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
- Bag Frames (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US59384196A | 1996-01-30 | 1996-01-30 | |
| US08/593,841 | 1996-01-30 | ||
| PCT/US1997/000319 WO1997028053A1 (en) | 1996-01-30 | 1997-01-10 | Soft pack package and dispensing system for liquid photoimageable solder mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000503948A true JP2000503948A (ja) | 2000-04-04 |
Family
ID=24376420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9527644A Pending JP2000503948A (ja) | 1996-01-30 | 1997-01-10 | リキッドのフォトイメージを造るソルダーマスクのためのソフトパックパッケージ及びディスペンシングシステム |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0877709A4 (ko) |
| JP (1) | JP2000503948A (ko) |
| KR (1) | KR100306129B1 (ko) |
| CN (1) | CN1209783A (ko) |
| AU (1) | AU732745B2 (ko) |
| CA (1) | CA2244775A1 (ko) |
| IL (1) | IL124970A (ko) |
| WO (1) | WO1997028053A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007527796A (ja) * | 2004-03-08 | 2007-10-04 | セワード リミテッド | 材料混合器及びこのような材料混合器に用いられるバッグ |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040224541A1 (en) * | 2003-05-09 | 2004-11-11 | Murata Co., Ltd. | Apparatus and method for forming solder wicking prevention zone and electronic part |
| KR100614299B1 (ko) * | 2004-12-29 | 2006-08-21 | 대우조선해양 주식회사 | 반응물탱크를 내장한 액체화학물저장탱크 |
| EP1679114A1 (de) * | 2005-01-10 | 2006-07-12 | Mark Zajdel | Vorrichtung und Verfahren zur Herstellung von Substanzmischungen |
| KR100864782B1 (ko) * | 2006-06-08 | 2008-10-22 | 목은상 | 씨리얼과 우유 또는 음료를 함께 먹을 수 있는 우유팩 |
| GB201708154D0 (en) * | 2017-05-22 | 2017-07-05 | Cambtek Ltd | Apparatus for agitating a liquid |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2932385A (en) * | 1956-03-05 | 1960-04-12 | Minnesota Mining & Mfg | Multicompartment package with internal breaker strip |
| US3983994A (en) * | 1975-01-29 | 1976-10-05 | Ihor Wyslotsky | Flexible package |
| US4479983A (en) * | 1983-01-07 | 1984-10-30 | International Business Machines Corporation | Method and composition for applying coatings on printed circuit boards |
| SE447346B (sv) * | 1985-03-29 | 1986-11-10 | Tetis Plasttetningar Ab | Sett att intimt blanda minst tva viskosa eller pastaformiga komponenter med varandra samt anordning for genomforande av settet |
| US4805767A (en) * | 1987-06-18 | 1989-02-21 | Newman Duncan A C | Package system |
| US5158214A (en) * | 1991-03-11 | 1992-10-27 | Jnj Industries Inc. | Solder paste applicator and mixing tool |
| DE4204181A1 (de) * | 1992-02-13 | 1993-08-19 | Degussa | Mischpackbeutel |
| US5287961A (en) * | 1992-10-23 | 1994-02-22 | W.R. Grace & Co.-Conn. | Multi-compartment package having improved partition strip |
| US5370221A (en) * | 1993-01-29 | 1994-12-06 | Biomet, Inc. | Flexible package for bone cement components |
| JPH07187242A (ja) * | 1993-06-01 | 1995-07-25 | K Jasai Z | 緩衝保護装置 |
-
1997
- 1997-01-10 KR KR1019980705705A patent/KR100306129B1/ko not_active IP Right Cessation
- 1997-01-10 AU AU15744/97A patent/AU732745B2/en not_active Ceased
- 1997-01-10 IL IL12497097A patent/IL124970A/en not_active IP Right Cessation
- 1997-01-10 CN CN97191962A patent/CN1209783A/zh active Pending
- 1997-01-10 JP JP9527644A patent/JP2000503948A/ja active Pending
- 1997-01-10 CA CA002244775A patent/CA2244775A1/en not_active Abandoned
- 1997-01-10 WO PCT/US1997/000319 patent/WO1997028053A1/en not_active Application Discontinuation
- 1997-01-10 EP EP97901958A patent/EP0877709A4/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007527796A (ja) * | 2004-03-08 | 2007-10-04 | セワード リミテッド | 材料混合器及びこのような材料混合器に用いられるバッグ |
Also Published As
| Publication number | Publication date |
|---|---|
| AU1574497A (en) | 1997-08-22 |
| AU732745B2 (en) | 2001-04-26 |
| CA2244775A1 (en) | 1997-08-07 |
| IL124970A (en) | 2001-04-30 |
| CN1209783A (zh) | 1999-03-03 |
| WO1997028053A1 (en) | 1997-08-07 |
| IL124970A0 (en) | 1999-01-26 |
| KR100306129B1 (ko) | 2002-08-08 |
| EP0877709A1 (en) | 1998-11-18 |
| EP0877709A4 (en) | 2000-04-05 |
| KR19990081987A (ko) | 1999-11-15 |
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