CA2244775A1 - Soft pack package and dispensing system for liquid photoimageable solder mask - Google Patents

Soft pack package and dispensing system for liquid photoimageable solder mask Download PDF

Info

Publication number
CA2244775A1
CA2244775A1 CA002244775A CA2244775A CA2244775A1 CA 2244775 A1 CA2244775 A1 CA 2244775A1 CA 002244775 A CA002244775 A CA 002244775A CA 2244775 A CA2244775 A CA 2244775A CA 2244775 A1 CA2244775 A1 CA 2244775A1
Authority
CA
Canada
Prior art keywords
components
container
reaction product
mixing
solder mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002244775A
Other languages
English (en)
French (fr)
Inventor
Ethan J. Mccague
Timothy C. Burgess
Curtis A. Fischer
David Stone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2244775A1 publication Critical patent/CA2244775A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B65D25/04—Partitions
    • B65D25/08—Partitions with provisions for removing or destroying, e.g. to facilitate mixing of contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
    • B01F31/55—Mixers with shaking, oscillating, or vibrating mechanisms the materials to be mixed being contained in a flexible bag submitted to periodical deformation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00—Other mixers; Mixing plants; Combinations of mixers
    • B01F33/50—Movable or transportable mixing devices or plants
    • B01F33/501—Movable mixing devices, i.e. readily shifted or displaced from one place to another, e.g. portable during use
    • B01F33/5011—Movable mixing devices, i.e. readily shifted or displaced from one place to another, e.g. portable during use portable during use, e.g. hand-held
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/71—Feed mechanisms
    • B01F35/713—Feed mechanisms comprising breaking packages or parts thereof, e.g. piercing or opening sealing elements between compartments or cartridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/71—Feed mechanisms
    • B01F35/713—Feed mechanisms comprising breaking packages or parts thereof, e.g. piercing or opening sealing elements between compartments or cartridges
    • B01F35/7133—Opening clips which seal openings between the compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/32—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents for packaging two or more different materials which must be maintained separate prior to use in admixture
    • B65D81/3261—Flexible containers having several compartments
    • B65D81/3266—Flexible containers having several compartments separated by a common rupturable seal, a clip or other removable fastening device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Bag Frames (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CA002244775A 1996-01-30 1997-01-10 Soft pack package and dispensing system for liquid photoimageable solder mask Abandoned CA2244775A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59384196A 1996-01-30 1996-01-30
US08/593,841 1996-01-30

Publications (1)

Publication Number Publication Date
CA2244775A1 true CA2244775A1 (en) 1997-08-07

Family

ID=24376420

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002244775A Abandoned CA2244775A1 (en) 1996-01-30 1997-01-10 Soft pack package and dispensing system for liquid photoimageable solder mask

Country Status (8)

Country Link
EP (1) EP0877709A4 (ko)
JP (1) JP2000503948A (ko)
KR (1) KR100306129B1 (ko)
CN (1) CN1209783A (ko)
AU (1) AU732745B2 (ko)
CA (1) CA2244775A1 (ko)
IL (1) IL124970A (ko)
WO (1) WO1997028053A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040224541A1 (en) * 2003-05-09 2004-11-11 Murata Co., Ltd. Apparatus and method for forming solder wicking prevention zone and electronic part
JP2007527796A (ja) * 2004-03-08 2007-10-04 セワード リミテッド 材料混合器及びこのような材料混合器に用いられるバッグ
KR100614299B1 (ko) * 2004-12-29 2006-08-21 대우조선해양 주식회사 반응물탱크를 내장한 액체화학물저장탱크
EP1679114A1 (de) * 2005-01-10 2006-07-12 Mark Zajdel Vorrichtung und Verfahren zur Herstellung von Substanzmischungen
KR100864782B1 (ko) * 2006-06-08 2008-10-22 목은상 씨리얼과 우유 또는 음료를 함께 먹을 수 있는 우유팩
GB201708154D0 (en) * 2017-05-22 2017-07-05 Cambtek Ltd Apparatus for agitating a liquid

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2932385A (en) * 1956-03-05 1960-04-12 Minnesota Mining & Mfg Multicompartment package with internal breaker strip
US3983994A (en) * 1975-01-29 1976-10-05 Ihor Wyslotsky Flexible package
US4479983A (en) * 1983-01-07 1984-10-30 International Business Machines Corporation Method and composition for applying coatings on printed circuit boards
SE447346B (sv) * 1985-03-29 1986-11-10 Tetis Plasttetningar Ab Sett att intimt blanda minst tva viskosa eller pastaformiga komponenter med varandra samt anordning for genomforande av settet
US4805767A (en) * 1987-06-18 1989-02-21 Newman Duncan A C Package system
US5158214A (en) * 1991-03-11 1992-10-27 Jnj Industries Inc. Solder paste applicator and mixing tool
DE4204181A1 (de) * 1992-02-13 1993-08-19 Degussa Mischpackbeutel
US5287961A (en) * 1992-10-23 1994-02-22 W.R. Grace & Co.-Conn. Multi-compartment package having improved partition strip
US5370221A (en) * 1993-01-29 1994-12-06 Biomet, Inc. Flexible package for bone cement components
JPH07187242A (ja) * 1993-06-01 1995-07-25 K Jasai Z 緩衝保護装置

Also Published As

Publication number Publication date
AU1574497A (en) 1997-08-22
AU732745B2 (en) 2001-04-26
JP2000503948A (ja) 2000-04-04
IL124970A (en) 2001-04-30
CN1209783A (zh) 1999-03-03
WO1997028053A1 (en) 1997-08-07
IL124970A0 (en) 1999-01-26
KR100306129B1 (ko) 2002-08-08
EP0877709A1 (en) 1998-11-18
EP0877709A4 (en) 2000-04-05
KR19990081987A (ko) 1999-11-15

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Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued