JP2000349428A - Substrate protection cover against soldering - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate cover to protect from soldering, which is freely attachable and detachable and can repeatedly be used enabling flow soldering so that parts, such as a mounted component arranged on a substrate in a preprocess and a land where solder should not be applied, can be protected or shielded from molten solder even when those parts are present on a soldering surface of a substrate. SOLUTION: This substrate cover 11 is equipped with a substrate hold part 13 in a nearly rectangular shape which positions and holds the substrate 1 detachably and shield parts 15a and 15b which are extended inwardly from the substrate hold part 13 so that, on the reverse-side soldering surface 1a of the substrate 1, the areas 21 and 23 which should be protected from the molten solder 7 are covered; and the shield part 15b has a drain groove 29 for preventing the entry of solder flux and molten solder. Further, the substrate hold part 13 is provided with a stopper 17 for preventing the substrate 1 from floating.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder shielding board cover for shielding an area to be shielded or protected from molten solder at the time of flow soldering.

[0002]

2. Description of the Related Art In a conventional typical flow soldering process, first, as shown in FIG.
After applying a solder flux to the soldering surface 1a to be subjected to the flow soldering with a spray fluxer 3 or the like,
As shown in FIG. 5B, the substrate 1 is transported onto the flow tank 5, and the soldering surface 1a of the substrate 1 is
And soldering is performed. Here, the substrate 1
Between the flux application step of FIG. 5 (a) and the soldering step of FIG. 5 (b), the left and right edges 1b facing the transport direction.
Is transported while being gripped by the gripping mechanism for transporting the substrate.

In the conventional flow soldering method shown in FIG. 5, since the soldering is performed without covering the soldering surface 1a of the substrate 1, the molten solder 7 is formed on substantially the entire surface of the soldering surface 1a. It comes into contact.

In recent years, a double-sided mounting type board 1 as shown in FIG. 6 has become mainstream with an increase in component mounting density. In addition, such a double-sided mounting type board 1 generally includes a surface mounting type mounting component B that does not use a through hole soldered by reflow soldering,
There is a mixture of lead insertion type mounting parts A using through holes that are soldered by flow soldering,
For the convenience of a solder removing step after reflow soldering, reflow soldering is performed before flow soldering.

FIG. 7 and FIG.
As shown in FIG. 3, the electrodes 9 are provided on the lands 1 c provided on the substrate 1.
There is a press-contact type electronic component 9 (here, an LED used for night lighting, etc.) 9 for making an electric connection by pressing the contact a. In this case, a holding hole 1d for press-fitting and fixing the LED 9 is provided on the substrate 1, and a land 1c is provided on an outer peripheral portion of the holding hole 1d. As the LED 9 is press-fitted and fixed to the holding hole 1d. Thus, the electrode 9a of the LED 9 is pressed against the land 1c. The disposition of the press-contact type electronic component 9 is generally performed after the soldering process.

[0006]

However, in the conventional flow soldering method shown in FIG. 5 described above, the molten solder 7 comes into contact with substantially the entire soldering surface 1a of the substrate 1. 6, a double-sided mounting type substrate 1 as shown in FIG.
When soldering is performed as it is, if the soldering is performed as it is, the molten solder 7 comes into contact with the mounting component B that has been previously reflow-soldered to the soldering surface 1a, and the solder may adhere to the mounting component B. In addition, there is a problem that the mounted component B is broken by heat.

In the conventional flow soldering method shown in FIG. 5, the molten solder 7 comes in contact with substantially the entire soldering surface 1a of the substrate 1. In addition, there is also a problem that soldering is performed even on a portion of the substrate 1 to which the solder should not be attached (particularly, the land 1c in FIG. 7).

Accordingly, the present invention has been made in view of the above-described problems, and there is a case where a soldering surface of a board has a portion such as a mounted component disposed on the board in a previous process or a land to which solder should not be attached. Another object of the present invention is to provide a solder shielding board cover that can be detachably used repeatedly while being capable of performing flow soldering while protecting or shielding them from molten solder.

[0009]

A technical means for achieving the above object is to mount on a soldering surface of a substrate for performing flow soldering, while exposing a portion of the substrate to be brought into contact with molten solder, A shielding portion that covers a shielding region of the substrate that needs to be shielded or protected from the molten solder, and that is provided integrally with or attached to the shielding portion for shielding the shielding region, and detachably holds the substrate. And a substrate holding portion for positioning and fixing the shielding portion with respect to the substrate.

Preferably, a substantially dome-shaped shielding recess covering the shielding area of the substrate is provided in a portion of the shielding portion facing the soldering surface of the substrate, and an outer peripheral portion of the shielding recess is provided. Preferably, an intrusion prevention groove for preventing the solder flux or the molten solder from entering the shielding area is provided.

Preferably, the substrate holding portion has a frame shape for positioning and holding the substrate so as to surround the substrate, and the left and right outer surfaces of the substrate holding portion have substantially the same shape as the substrate. It is preferable that a transport flange portion having a thickness of not more than one is protruded.

[0012]

FIG. 1 is a perspective view showing a state in which a solder shielding board cover (board jig) according to an embodiment of the present invention is mounted on a board, and FIG. 2 is a sectional view of FIG. And
FIG. 3 is an enlarged sectional view of a main part of FIG. 1, and FIG. 4 is a plan view showing a configuration of a main part of the substrate cover of FIG. In FIGS. 1 to 4, the same reference numerals are used for the portions common to the configurations in FIGS. 5 and 6 described above.

As shown in FIGS. 1 and 2, the solder shielding board cover 11 has a frame shape (here, a substantially rectangular frame shape) corresponding to the outer shape of the board 1 for removably positioning and holding the board 1. ), And at least one shielding portion 15a, 15b integrally extending inward from the substrate holding portion 13 and integrally formed of a predetermined heat-resistant material (here, a heat-resistant resin). Have been. In addition, after the board holding part 13 and the shielding parts 15a and 15b are formed separately, they may be fixed to each other by adhesive fixing or screw fixing, or may be assembled.

The substrate holding portion 13 has a substantially rectangular frame shape, and is provided with a step-shaped holding concave portion 13a into which the substrate 1 is fitted and held exactly. The depth of the holding recess 13 a is set to be substantially equal to the thickness of the substrate 1. Predetermined portions (here, four corners) of the outer periphery of the holding recess 13a on the upper surface side of the substrate holding portion 13
Is provided with a stopper 17 for preventing the substrate 1 fitted in the holding recess 13a from lifting up. Each stop 1
Reference numeral 7 denotes a substrate fixing position (a state shown in FIG. 1), which is rotatably fixed to the substrate holding portion 13 by a pin 17 a as indicated by an arrow 19, and in which the stopper 17 projects into the holding recess 13 a. The substrate 1 is attached and detached and fixed by appropriately rotating the respective stoppers 17 between a non-fixed position where the stoppers 17 are retracted from the holding recess 13a.

Further, the substrate holding portion 13 projects from both left and right ends to both sides with respect to the transport direction C of the substrate 1 when soldering is performed by the flow soldering device, and has the same thickness as the substrate 1. A transfer flange 19 is provided, and during flow soldering, the flange 19 of the board cover 11 is mounted on the board 1 with the board cover 11 attached.
Is held by a holding mechanism for transferring a substrate of the flow soldering apparatus, so that the substrate 1 and the substrate cover 11 are transferred integrally.

As shown in FIG. 2, the shielding portions 15a and 15b are provided on the lower surface side of the substrate 1 held by the substrate holding portion 13 so as to extend inward from the inner peripheral portion of the substrate holding portion 13.
The soldering region 25 is a portion of the soldering surface 1a which is to be brought into contact with the molten solder 7 so as to cover the shielding regions 21 and 23 to be shielded or protected from the molten solder 7 in FIG.
It is extended so that it is exposed.

Here, the shielding area 21 is set to protect and shield the mounted component B already soldered to the soldering surface 1a of the substrate 1 from the molten solder 7 by reflow soldering or the like. The shielding portion 15a that covers the shielding region 21 prevents the molten solder 7 from adhering to the mounted component B and prevents the mounted component B from being broken by the heat of the molten solder 7.

The shielding region 23 is formed by melting a portion of the substrate 1 to which the solder is not to be adhered (for example, a land 1c to which a mounting component such as the LED 9 is pressed and connected in a later step) by the molten solder 7.
The shielding portion 15b that covers the shielding region 23 prevents the molten solder 7 from entering the shielding region 23.

The soldering area 25 is an area on the soldering surface 1a of the substrate 1 where the lead for performing the flow soldering of the mounted component A is located. In the flow soldering, the molten solder 7 is soldered. It comes into contact with the region 25 and soldering of the mounted component A is performed.

On the surface of each of the shielding portions 15a and 15b facing the soldering surface 1a of the substrate 1, there are provided substantially dome-shaped shielding concave portions 27a and 27b which cover the shielding regions 21 and 23. When the board cover 11 is mounted on the board 1,
The outer peripheral portions of the shielding concave portions 27a and 27b are brought into close contact with the soldering surface 1a of the substrate 1 and
Mounting component B and land 1 housed in 7a, 27b
c and the like are protected and shielded from the molten solder 7.

At least one of the shielding portions 15a and 15b that requires more complete shielding performance (here, the shielding portion 1
5b), as shown in FIG. 3 and FIG.
b, shielding recess 27b abutting on soldering surface 1a of substrate 1
A groove (intrusion prevention groove) 29 for preventing the intrusion of the solder flux and the molten solder 7 is provided in the outer peripheral portion so as to surround the shielding concave portion 27b. Here, the groove 29 is formed with the shielding portion 15 facing the outside of the shielding region 23 so that the solder flux and the molten solder 7 entering the groove 29 are smoothly discharged to the outside of the shielding region 23 of the substrate 1.
b. Opening and communicating with the side surface.

When the flow soldering of the substrate 1 is performed, as shown in FIG. 1, the substrate cover 11 is attached to the substrate 1 with the soldering surface 1a to be soldered facing downward. After mounting, the substrate 1 is set together with the substrate cover 11 in a flow soldering apparatus. At this time, the substrate 1 is transported to the flow tank 5 together with the substrate cover 11 through the solder flux application step by causing the gripping mechanism of the flow soldering device to grip both flange portions 19 of the substrate cover 11. ing.

Thus, the shielding portion 1 of the substrate cover 11
By 5a and 15b, flow soldering is performed in a state where the shielding regions 21 and 23 of the substrate 1 are protected and shielded from the solder flux and the molten solder 7. After the flow soldering is completed, the board cover 11 is removed from the board 1, and the board is mounted on a new board 1 so that it can be used repeatedly.

As described above, according to the present embodiment, the solder shielding substrate cover 11 according to the present embodiment is attached to the substrate 1 during flow soldering, so that the soldering surface 1a of the substrate 1 Even in the case where there are parts such as the mounting component B disposed on the substrate 1 in the previous process and the lands 1c to which the solder 7 should not be attached, these parts are separated from the solder flux and the molten solder 7 by the shielding parts 15a and 15b. Flow soldering can be performed while protecting and shielding.

Further, the substrate holding unit 13 allows the substrate cover 1
Since the substrate cover 1 is detachably mounted on the substrate 1, the substrate cover 11 can be used repeatedly, which is economical.

Further, on the outer peripheral portion of the shielding concave portion 27b of the shielding portion 15b of the substrate cover 11, a groove 2 for preventing the penetration of the solder flux and the molten solder 7 into the shielding region 23 is provided.
9, the solder flux and the molten solder 7 are separated from the shielding region 23 by a capillary phenomenon or the like via a gap between the shielding portion 15b and the surface (soldering surface) 1c of the substrate 1.
Intrusion into the inside can be effectively prevented, and the shielding performance can be improved.

In a flow soldering apparatus in which the side edges of the substrate 1 are gripped by a predetermined gripping mechanism during the flow soldering and the substrate 1 is transported, the substrate 1 is provided on the substrate cover 11 by the gripping mechanism. Since the substrate 1 can be transported together with the substrate cover 11 by gripping the two flange portions 19, there is an advantage that the substrate cover 11 according to the present embodiment can be used without changing the existing equipment configuration. is there.

[0028]

According to the first aspect of the present invention, it is necessary to shield or protect from the molten solder in the substrate by mounting the solder shielding substrate cover according to the present invention on the substrate during flow soldering. The shielded area can be shielded from the molten solder, so if components to be mounted are already arranged in the previous process, or solder should be attached to the soldering surface of the board where flow soldering is to be performed. Even when there are portions such as lands that are not, flow soldering can be performed while protecting or shielding them from the molten solder by the shielding portion.

Further, since the solder shielding board cover is detachably mounted on the board by the board holding portion, the solder shielding board cover can be used repeatedly, which is economical.

According to the second aspect of the present invention, the outer peripheral portion of the shielding recess in the shielding portion of the solder shielding substrate cover is provided with:
Since an intrusion prevention groove is provided to prevent the solder flux or the molten solder from entering the shielding area, the solder flux or the molten solder is shielded by a capillary phenomenon or the like through a gap between the shielding part and the substrate surface. Intrusion into the inside can be effectively prevented, and the shielding performance can be improved.

According to the third aspect of the present invention, the transporting flange portion having substantially the same thickness as the substrate is provided on the left and right outer surfaces of the substrate holding portion having the frame shape. In a flow soldering apparatus in which a substrate is transported by gripping both side edges of a substrate by a predetermined gripping mechanism during flow soldering, a flange portion provided on a substrate holding portion of a substrate cover by the gripping mechanism Therefore, there is an advantage that the board cover for solder shielding according to the present invention can be used without changing the existing equipment configuration because the board can be transported together with the board cover.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a state in which a solder shielding board cover according to an embodiment of the present invention is mounted on a board.

FIG. 2 is a sectional view of FIG.

FIG. 3 is an enlarged sectional view of a main part of FIG.

FIG. 4 is a plan view showing a configuration of a main part of the board cover of FIG. 1;

5 (a) and 5 (b) are views showing a conventional typical flow soldering method. FIG.

FIG. 6 is a diagram showing a typical double-sided mounting board.

FIG. 7 is a perspective view showing a configuration of an LED which is a press-contact type mounting component and an LED disposition portion of a substrate.

FIG. 8 is a diagram showing a state in which the LED of FIG. 6 is provided on a substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 3 Spray fluxer 5 Flow tank 7 Molten solder 9 LED 11 Solder shielding board cover 13 Board holding part 15a, 15b Shielding part 17 Stopper 19 Flange part 21, 23 Shielding area 25 Soldering area 27a, 27b Shielding recess 29 Groove A, B Mounting parts

Claims (3)

[Claims] 1. A shielded area of the substrate which is mounted on a soldering surface of a substrate where flow soldering is to be performed and which needs to be shielded or protected from the molten solder while exposing a portion of the substrate to be brought into contact with the molten solder. A shielding portion for covering the shielding region, and a substrate provided integrally with or attached to the shielding portion, and positioning and fixing the shielding portion with respect to the substrate by detachably holding the substrate. A board cover for solder shielding, comprising: a holding portion. 2. A substantially dome-shaped shielding recess covering the shielding area of the substrate is provided at a portion of the shielding portion facing the soldering surface of the substrate, and an outer peripheral portion of the shielding recess is provided. 2. The solder shielding board cover according to claim 1, further comprising an intrusion preventing groove for preventing intrusion of the solder flux or the molten solder into the shielding area. 3. 3. The substrate holding portion has a frame shape for positioning and holding the substrate so as to surround the substrate, and the left and right outer surfaces of the substrate holding portion have substantially the same thickness as the substrate. 3. The solder shielding board cover according to claim 1, wherein a transfer flange having a projection is provided.