JP2008263030A - Packaging board and manufacturing method of the packaging board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging board and a manufacturing method of the packaging board, wherein a misregistration of a surface packaging part is prevented and the surface packaging part is packaged on a printed board. <P>SOLUTION: In the packaging board, radiator plate cavities 31, 31 and terminal cavities 32, 32, ... for arranging a radiator plate 11 and terminals 12, 12, ... of a surface packaging part C are provided in a resist 3 of a printed board P, and projection parts 3a, 3a for abutting the radiator plate 11 to the radiator plate cavities 31, 31 are provided. A solder paste is coated on the radiator plate cavities 31, 31 and the terminal cavities 32, 32, ... , and the radiator plate 11 and the terminals 12, 12, ... are soldered to a large-sized land 2 and small-sized lands 20, 20, ... on the lower side of the resist 3 by a reflow. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting substrate in which a surface mounting component is mounted on a printed board while preventing displacement of the surface mounting component, and a method for manufacturing the mounting substrate.

  In order to mount a surface mount component having a heat sink on one side of the body and a plurality of terminals on the other side, such as a regulator IC and a power transistor, a plurality of resists on the printed circuit board are mounted on the printed circuit board. A recess was provided, a solder paste was applied to the recess, the heat sink and the terminal were disposed on the solder paste, and the heat sink and the terminal were soldered to a land below the resist by reflow.

  Since the heat sink is larger than the terminal, the amount of solder paste for soldering the heat sink is larger than the amount of solder paste for soldering the terminal, and the heat sink has more heat transfer than the terminal. Therefore, a large amount of solder paste for soldering the heat sink is melted before the solder paste for soldering the terminals, and the surface mount component is positioned by the surface tension of the melted solder. It was biased to the side.

Conventionally, in order to suppress the displacement of the surface mount component, a frame portion that covers the periphery of the recess is provided on the resist, and the surface mount component is locked to the frame portion. (See Patent Document 1).
Japanese Utility Model Publication No. 5-36876

  However, in the printed circuit board described in Patent Document 1, it is not possible to prevent the displacement of the surface-mounted component inside the recess, and the position of the terminal is shifted to the heat sink side. Since the corners abut against the recesses and a sufficient amount of solder does not adhere to the corners of the heat sink, a solder fillet of an appropriate size cannot be formed on the terminals and the heat sink, and soldering Lack of reliability.

  The present invention has been made in view of such circumstances, and by providing a protruding portion in contact with the surface-mounted component in the recessed portion, the heat sink is disposed in the recessed portion and soldered by reflow. In this case, the heat radiating plate is brought into contact with the protruding portion and locked to prevent positional displacement of the surface mount component, thereby forming a solder fillet of an appropriate size on the terminal and improving the reliability of soldering. It is an object of the present invention to provide a mounting substrate that can be made to operate.

  Further, by disposing the protrusion at the center of the recess, when the heat sink is disposed in the recess and soldering is performed by reflow, the center of the front end of the heat sink is brought into contact with the protrusion. Positioning the corners of the heat sink so that they do not contact the recesses, preventing positional displacement of the surface mount components, and attaching a sufficient amount of solder to the corners of the heat sink. An object of the present invention is to provide a mounting substrate that can improve the reliability of soldering.

  Further, the two recesses each provided with the protrusions are arranged in parallel with the resist, and the protrusions are arranged adjacent to each other so that the heat sink is disposed in the two recesses and soldered by reflow. In this case, the surface tension of the melted solder is dispersed, the center of the tip of the heat sink is brought into contact with the protrusion, and the corner of the heat sink is positioned so as not to touch the recess, To provide a mounting board that can prevent misalignment of mounting parts and can form a solder fillet by attaching a sufficient amount of solder to the corners of the heat sink to improve soldering reliability. Objective.

  Further, a mask having an opening corresponding to the recess is placed on the resist having the recess, a solder paste is applied from above the mask, the solder paste is printed on the recess, and the solder paste is printed on the solder paste. The heat sink is placed, the solder paste is melted by reflow, and the heat sink is brought into contact with the protruding portion, thereby preventing the displacement of the surface-mounted component, and having an appropriate size for the terminal. It is an object of the present invention to provide a method of manufacturing a mounting board that can form a solder fillet and improve the reliability of soldering.

  The mounting substrate according to the present invention is provided on the substrate, the land provided on the substrate, the land so as to cover the land, the resist having a recess on the land, and the recess In a mounting board provided with a surface mounting component having a heat radiating plate and soldered, a protruding portion that contacts the heat radiating plate is provided in the concave portion.

  In the present invention, when the protrusion is in contact with the surface-mounted component in the recess, the heat sink is disposed in the recess and soldered by reflow. To prevent contact with the surface-mounted component.

  The mounting board according to the present invention is characterized in that the protruding portion is arranged at the center of the concave portion.

  In the present invention, by disposing the protrusion at the center of the recess, when the heat sink is disposed in the recess and soldering is performed by reflow, the center of the front end of the heat sink is used as the protrusion. Abutting and positioning so that the corners of the heat sink do not touch the recesses, preventing positional displacement of the surface mount components, and attaching a sufficient amount of solder to the corners of the heat sink A solder fillet is formed.

  The mounting substrate according to the present invention is characterized in that the two concave portions each having the protruding portion are arranged in parallel with the resist, and the protruding portions are adjacent to each other.

  In the present invention, the two recesses each having the protrusion are arranged in parallel with the resist, and the protrusions are arranged next to each other, thereby disposing the heat sink in the two recesses and soldering by reflow. When soldering is performed, the surface tension of the molten solder is dispersed, and the center of the tip of the heat sink is brought into contact with the protrusion, and the corner of the heat sink is positioned so as not to touch the recess. Then, the surface mount component is prevented from being displaced, and a sufficient amount of solder is attached to the corners of the heat radiating plate to form a solder fillet.

  The method for manufacturing a mounting substrate according to the present invention includes a substrate, a land provided on the substrate, a resist provided on the substrate so as to cover the land, and a resist having a recess on the land. In a manufacturing method of a mounting board in which a surface mounting component having a heat sink is mounted on a printed board including: a protrusion provided in the recess; a mask including an opening corresponding to the recess is placed on the resist; Applying a solder paste from above the mask, printing the solder paste in the recesses, placing the surface-mounted component on the printed solder paste, melting the printed solder paste by reflow, A heat sink is mounted in contact with the protruding portion.

  In the present invention, a protrusion is provided in the recess, a mask having an opening corresponding to the recess is placed on the resist, a solder paste is applied over the mask, and the solder paste is applied to the recess. Is printed, the heat sink is placed on the solder paste, the solder paste is melted by reflow, and the heat sink is brought into contact with the protruding portion, thereby preventing the surface-mounted component from being displaced. .

  In the mounting board according to the present invention, when the heat sink is disposed in the concave portion by providing the concave portion with a protruding portion that contacts the surface-mounted component, and soldering is performed by reflow, A heat sink is brought into contact with the protruding portion and locked to prevent positional displacement of the surface mount component, and a solder fillet of an appropriate size is formed on the terminal to improve soldering reliability. it can.

  Further, in the mounting substrate according to the present invention, when the protrusion is disposed in the center of the recess, the heat sink is disposed in the recess and soldering is performed by reflow. Position the center of the tip against the protrusion, position the corner of the heat sink so that it does not touch the recess, prevent misalignment of the surface-mounted components, and make sure that the corner of the heat sink is sufficient. A solder fillet can be formed by adhering an appropriate amount of solder, and the reliability of soldering can be improved.

  Further, in the mounting substrate according to the present invention, two of the recesses each having the protrusion are arranged in parallel with the resist, and the protrusions are arranged adjacent to each other, thereby disposing the heat sink two of the above. When the soldering is performed by reflowing when placed in the recess, the surface tension of the melted solder is dispersed, the center of the tip of the heat sink is brought into contact with the protrusion, and the corner of the heat sink is Positioning so as not to contact the concave portion, preventing displacement of the surface-mounted component, and forming a solder fillet by adhering a sufficient amount of solder to the corner of the heat radiating plate. Can be improved.

  In the mounting substrate manufacturing method according to the present invention, a protrusion is provided in the recess, a mask having an opening corresponding to the recess is placed on the resist, and a solder paste is applied over the mask. Applying, printing the solder paste in the recess, placing the heat sink on the solder paste, melting the solder paste by reflow, and contacting the heat sink to the protrusion, It is possible to prevent misalignment of the surface mount component, to form a solder fillet of an appropriate size on the terminal, and to improve the reliability of soldering.

(Embodiment 1)
Hereinafter, the present invention will be described in detail with reference to the drawings showing a mounting substrate according to the first embodiment. 1 is a schematic exploded perspective view showing an appearance of a mounting board according to Embodiment 1, and FIG. 2 is a cross-sectional view taken along the line II-II in FIG.

  In the figure, reference numeral 1 denotes a substrate of a printed circuit board P, and a rectangular large land 2 made of copper foil on the substrate 1 and four rectangular small lands 20, 20. Are arranged side by side. A resist 3 is provided so as to cover the large land 2 and the small lands 20, 20,. A surface mounting component C is mounted on the resist 3 to constitute a mounting substrate. The surface mounting component C is composed of a main body 10, a heat dissipation plate 11 protruding from the main body 10, and the heat dissipation from the main body 10. Four terminals 12, 12,... Projecting in the opposite direction to the plate 11 are provided.

  Two heat sink concave portions 31, 31 for arranging the heat sink 11 are arranged in parallel on the resist 3 on the large land 2. The heat sink recesses 31, 31 penetrate to the large land 2, and the heat sink 11 is soldered to the large land 2 by the heat sink recesses 31, 31. The heat sink recesses 31, 31 are substantially rectangular, and two protrusions 3a, 3a with which the heat sink 11 abuts are provided at the corners of the heat sink recesses 31, 31, respectively. The two protruding portions 3a and 3a are adjacent to each other, and the front end central portion 11a of the heat radiating plate 11 is in contact with the protruding portions 3a and 3a.

  In the resist 3 on the small lands 20, 20,..., Four terminal recesses 32, 32,. The terminal recesses 32, 32,... Penetrate to the small land 20, and the terminals 12, 12,... Are soldered to the small land 20 by the terminal recesses 32, 32,. .

  Next, a method for manufacturing the mounting board according to the first embodiment will be described. 3A to 3C are schematic process diagrams showing the mounting process of the surface-mounted component C, and FIG. 4 is a schematic plan view of the mounting board.

  First, a metal mask M having openings corresponding to the heat sink recesses 31, 31 and the terminal recesses 32, 32,... Is placed on the resist 3, and the solder paste 4 is applied over the metal mask M. It prints on the said heat sink recessed part 31 and 31 and the terminal recessed parts 32, 32, ... (refer Fig.3 (a)).

  Next, the metal mask M is removed, and the front end central portion 11a of the heat radiating plate 11 is located at the front end edge of the projecting portions 3a, 3a, and the terminals 12, 12,. The heat radiating plate 11 and the terminals 12, 12,... (See FIG. 3B).

  Then, the printed circuit board P is heated by reflow to melt the solder paste 4. At this time, since the heat sink 11 has a larger amount of heat transfer than the terminals 12, 12,..., The melting of the solder paste 4 on which the heat sink 11 is placed starts first. The surface mount component C is pulled toward the heat radiating plate 11 by the surface tension of the heat radiating plate 11, but the front end center portion 11 a of the heat radiating plate 11 is brought into contact with the edge of the protruding portion 3 a and is locked. Does not move toward the heat sink 11 (see FIG. 3C).

  As shown in FIG. 4, solder paste 4 adheres to the corners 11b and 11b of the heat sink 11 at the center of the heat sink recesses 31 and 31 to form solder fillets 4a and 4a. In the terminal recesses 32, 32,..., The solder paste 4 adheres to the terminals 12, 12,... To form a front fillet 4b and a back fillet 4c. Implemented in P.

  In the mounting substrate according to the first embodiment, when the heat sinks 31 and 31 are provided with the protruding portions 3a and 3a that contact the heat sink 11, the heat dissipation is performed when soldering is performed by reflow. The plate 11 is brought into contact with the projecting portions 3a and 3a and locked to prevent the positional shift of the terminals 12, 12,..., And the front fillet 4b and the back fillet 4c are connected to the terminals 12, 12,. The reliability of soldering can be improved.

  In addition, the two heat sink recesses 31, 31 each having the protrusions 3 a, 3 a are juxtaposed to the resist 3, and the protrusions 3 a, 3 a are arranged adjacent to each other to perform soldering by reflow. The surface tension of the melted solder is dispersed, the front end central portion 11a of the heat radiating plate 11 is brought into contact with the protruding portions 3a and 3a, and the front end corner portions 11b and 11b of the heat radiating plate 11 are Positioning so as not to contact the heat sink recesses 31, 31 prevents the surface-mounted component C from being displaced, and attaches a sufficient amount of solder to the tip corners 11b, 11b so that the solder fillets 4a, 4a. The reliability of soldering can be improved.

  In the manufacturing method of the mounting board according to the first embodiment, the radiator plate 11 is disposed in the center of the heat sink plate recesses 31, 31 so that the heat sink 11 is replaced with the heat sink plate recesses 31, 31. When the soldering is performed by reflowing, the surface tension of the melted solder is dispersed, and the center portion 11a of the heat sink 11 is brought into contact with the protruding portions 3a and 3a, thereby mounting the surface mounted component. The tip corner 11b is positioned so as not to contact the heat sink recesses 31 and 31 to prevent the surface mount component C from being misaligned, and the tip corner 11b is sufficient for the tip corner 11b. Solder fillets 4a and 4a can be formed by attaching an appropriate amount of solder, and the reliability of soldering can be improved.

  The protrusions 3a and 3a may be provided on one side of the heat sink recesses 31 and 31 so that a sufficient amount of solder adheres to the tip corners 11b and 11b. It is not restricted to providing in a part.

(Embodiment 2)
Hereinafter, the present invention will be described in detail with reference to the drawings showing a mounting board according to a second embodiment. FIG. 5 is a schematic exploded perspective view showing the appearance of the mounting board according to the second embodiment, and FIG. 6 is a schematic plan view of the mounting board.

  A heat radiating plate recess 41 in which the heat radiating plate 11 is arranged is provided in the resist 3 on the large land 2. The heat sink recess 41 penetrates to the large land 2, and the heat sink 11 is soldered to the large land 2 by the heat sink recess 41. The heat radiating plate recess 41 has a rectangular shape, and a protruding portion 3b with which the front end central portion 11a of the heat radiating plate 11 abuts is provided at one side central portion of the heat radiating plate concave portion 41. The mounting substrate according to the second embodiment is manufactured by a manufacturing method similar to the manufacturing method of the mounting substrate according to the first embodiment.

  In the mounting substrate according to the second embodiment, the heat sink 11 is disposed in the heat sink recess 41 by disposing the protrusion 3a in the central portion of one side of the heat sink recess 41, and by reflow. When soldering is performed, the front end central portion 11a of the heat radiating plate 11 is brought into contact with the protruding portion 3b, and the front end corner portions 11b and 11b of the heat radiating plate 11 are not brought into contact with the heat radiating plate concave portion 41. Positioning is performed to prevent displacement of the surface-mounted component C, and a sufficient amount of solder is attached to the tip corners 11b and 11b to form solder fillets 4a and 4a, thereby improving soldering reliability. be able to.

  Among the configurations of the mounting substrate according to the second embodiment, the same reference numerals are given to the same configurations as those of the first embodiment, and detailed description thereof is omitted.

2 is a schematic exploded perspective view showing an appearance of a mounting board according to Embodiment 1. FIG. It is II-II sectional drawing of FIG. It is a typical process figure showing a mounting process of surface mounting parts. 3 is a schematic plan view of a mounting board according to Embodiment 1. FIG. FIG. 5 is a schematic exploded perspective view showing an appearance of a mounting board according to a second embodiment. 6 is a schematic plan view of a mounting board according to Embodiment 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Large land 3 Resist 3a, 3b Protrusion part 4 Solder paste 4a Solder fillet 4b Front fillet 4c Back fillet 10 Main body 11 Heat sink 11a Tip center part 11b Tip corner part 12 Terminal 20 Small land 31, 41 Heat sink concave part 32 terminal Recess P Printed circuit board C Surface mount component

Claims (4)

A substrate, a land provided on the substrate, a resist provided on the substrate so as to cover the land, a resist having a recess on the land, and soldered at the recess, In a mounting substrate comprising a surface mounting component having a plate,
A mounting board characterized in that a protruding portion that abuts the heat radiating plate is provided in the recess.   The mounting substrate according to claim 1, wherein the projecting portion is arranged at the center of the concave portion.   The mounting substrate according to claim 1, wherein the two concave portions each having the protruding portion are juxtaposed with the resist, and the protruding portions are adjacent to each other. Surface mounting having a heat sink on a printed circuit board comprising a substrate, a land provided on the substrate, and a resist provided on the substrate so as to cover the land and having a recess on the land. In a manufacturing method of a mounting board for mounting components,
Providing a protrusion in the recess,
A mask having an opening corresponding to the recess is placed on the resist,
Applying a solder paste from above the mask, printing the solder paste in the recess,
Place the surface mount component on the printed solder paste, melt the printed solder paste by reflow,
A mounting board manufacturing method, wherein the heat sink is mounted in contact with the protruding portion.

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