JP2008153405A - Shielding case mounting board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shielding case mounting board, in which a shielding case can be arranged only at the necessary parts on a substrate, positioning work of the shielding case is facilitated and a bonding process by a bonding material is simple and secure, and high bonding quality can be obtained, and to provide a manufacturing method of the board. <P>SOLUTION: The shielding case is provided with a rectangular top plate and four side boards, extending vertically downward from four sides of the top plate, and forms a box shape whose base is opened. An electronic circuit or an electronic component is loaded on the substrate 2. A loading region 4, on which the electronic circuit or the electronic component which requires electromagnetic shielding is loaded, is arranged, and a thin groove 3 is formed endless on a surface of the substrate 2 so as to surround the loading region 4. Solder paste is supplied into the groove 3 by a printing method. The lower part of the side board of the shielding case 1 is engaged in the groove 3, solder is melted and cooled, and solidified by a reflow device, and the shielding case is fixed to the substrate 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a shield case mounting substrate in which an electronic circuit or an electronic component is mounted on a substrate and a shield case for protecting the electronic circuit or the electronic component from a radio wave (electromagnetic field) failure or the like is mounted.

  As described in Patent Document 1, as a substrate on which an electronic circuit or an electronic component is mounted, a salai (concave portion) into which a passive element is fitted is provided on a glass epoxy copper-clad laminate, and the bottom and side surfaces of this saray Apply a cream-like electrical conductive agent to the surface, then drop the passive elements into the salai, and pass them through a reflow oven or high-temperature bath to join the passive element with the pattern stretched on the glass epoxy laminate. What is fixed is disclosed.

  Patent Document 2 discloses a printed circuit device in which a concave portion is formed in a printed circuit board, an integrated circuit chip is accommodated and attached to the concave portion and electrically connected to the printed circuit board, and the concave portion is shielded by a sub printed board. The printed circuit device described in Patent Document 2 has a purpose of increasing the density and is obtained by attaching a surface mounting component to a sub printed circuit board and electrically connecting it to the printed circuit board.

  Patent Document 3 discloses an electronic device in which an electronic component element is mounted on a multilayer wiring board, and a metal shield cover is placed on the outer periphery of the substrate so as to cover the electronic component element. In Patent Document 3, a plurality of notches are provided in the uppermost insulating layer of a multilayer wiring board, and leg portions having a shape that fits into the notches are formed on the side walls of the shield cover. The electronic component element is shielded by being electrically connected between the leg portion and the ground wiring exposed in the notch through a conductive adhesive.

Japanese Utility Model Publication No. 58-87378 Japanese Patent Laid-Open No. 9-36513 JP 2004-179562 A

  As described above, the electronic component mounting substrate disclosed in Patent Document 1 does not consider the shield against electromagnetic interference on the mounted electronic component. Further, in the printed circuit board described in Patent Document 2, the integrated circuit chip is stored in the recess, and then the recess is covered with the sub-print circuit board. And a sub-print board for mounting components.

  In the electronic device described in Patent Document 3, all the electronic components mounted on the substrate are shielded from electromagnetic waves by a shield case whose bottom edge is placed on the outer periphery of the substrate. Since all the parts are covered, there is a problem that the entire apparatus is enlarged. Also, solder fixing (connection) to the printed board of the shield case is usually done by manual soldering using thread solder and a soldering iron, which requires a lot of work and unstable soldering quality. This is a factor that hinders productivity.

  The present invention has been made in view of such problems, the shield case can be provided only at a necessary location on the substrate, the positioning operation of the shield case is easy, and the joining process using the joining material is performed. An object of the present invention is to provide a shield case mounting substrate that is simple and reliable and that can obtain high bonding quality, and a method for manufacturing the same.

  A shield case mounting substrate according to the present invention includes a substrate on which a circuit or a component is mounted, a groove formed on a surface of the substrate so as to surround at least a part of the circuit or component mounting region on the substrate, and a ceiling. A shield case having a plate and a side plate, the side plate being fitted into the groove, and a bonding material for fixing a lower end portion of the side plate to the groove in a state where the side plate of the shield case is fitted into the groove. It is characterized by that.

  In the present invention, the bonding material is preferably solder that is supplied into the groove and bonds the shield case to the groove by reflow.

  Moreover, it is preferable that the said solder is what was supplied to the said groove | channel in the state of solder paste or printing.

  Further, for example, the inner surface of the groove is plated with copper.

  The method of manufacturing a shield case mounting substrate according to the present invention is the above-described method in which an electronic circuit or an electronic component is mounted and a groove is formed on the surface so as to surround at least a part of the electronic circuit or electronic component mounting region. Solder is supplied into the groove, the side plate of the shield case having the top plate and the side plate is fitted into the groove, and the solder is reflowed to fix the lower end portion of the side plate of the shield case to the groove. It is characterized by.

  According to the present invention, a groove is formed on the surface of the substrate so as to surround an electronic circuit or electronic component that needs to be shielded, and the shield case side plate is fitted into the groove, and the shield case is disposed on the substrate. Therefore, the shield case only needs to have a shape that surrounds and seals only the necessary electronic circuits or electronic components. The device can be miniaturized, and the shield case can be shielded simply by fitting the side plate of the shield case into the groove. Since the case can be positioned, positioning work is easy.

  Further, according to the method for manufacturing a shield case mounting board of the present invention, solder is supplied into the groove, the side plate of the shield board is fitted into the groove, and the shield case is fixed to the board simply by reflowing the solder. Therefore, the shield case can be easily and quickly joined to a predetermined position with high accuracy.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings. 1 and 2 are views showing an embodiment of the present invention. FIG. 1 is a perspective view of a shield case as viewed from below, FIG. 2 (a) is a plan view of the substrate 2, and FIG. 2 (b) is A of the substrate. FIG. 2C is a cross-sectional view taken along the line BB of the substrate. As shown in FIG. 1, the shield case 1 has a rectangular top plate and a four-side plate extending vertically downward from four sides of the top plate, and has a box shape with an open bottom.

  The substrate 2 is a mounting substrate in which an electronic circuit (not shown) is formed on the surface of the substrate or an electronic component (not shown) is mounted on the substrate, and an electronic circuit that requires an electromagnetic shield. Or the mounting area | region 4 in which an electronic component is mounted is provided. Other areas on the surface of the substrate 2 do not require electromagnetic shielding.

  A narrow groove 3 is formed on the surface of the substrate 2 in an endless manner so as to surround a mounting area 4 on which an electronic circuit or electronic component that requires shielding is mounted. The shape of the groove 3 is aligned with the lower edge of the side plate of the shield case 1, so that the lower part of the shield case 1 can be fitted into the groove 3.

  Next, the operation and manufacturing method of the shield case mounting substrate configured as described above will be described. First, a solder paste (not shown) as a bonding material is supplied into the groove 3 by a method such as printing. Next, the lower part of the side plate of the shield case 1 is inserted into the groove 3. As a result, the shield case 1 is positioned with respect to the substrate 2. Thereafter, the lower part of the four side plates of the shield case 1 is fixed to the substrate 1 in the groove 3 by melting and cooling and solidifying the solder supplied into the groove 3 by a reflow device.

  Thus, in this embodiment, since it can solder collectively with a reflow soldering apparatus, the shield case 1 and the board | substrate 2 can be connected and fixed quickly and easily. Further, in the present embodiment, the groove 3 is provided and the lower part of the shield case 1 is fitted into the groove 3 so that the shield case 1 is fixed in the groove 3. Further, it can be provided on the substrate without any special position adjustment work. Furthermore, in this embodiment, the entire area on the substrate 2 is not covered with the shield case 1 but only the area (mounting area 4) where electromagnetic shielding is required is covered with the shield case 1, thereby avoiding the enlargement of the apparatus. Can do.

  The width of the groove 3 needs to have a width necessary for the lower portion of the shield case 1 to be inserted, and needs to be larger than the plate thickness of the shield case 1. If the thickness is too large, the positioning accuracy of the shield case 1 by the groove 3 is insufficient. Therefore, the width of the groove 3 needs to be set appropriately according to the plate thickness of the shield case 1.

It is a perspective view from the lower part which shows the shield case 1 used in embodiment of this invention. (A) is a top view of a board | substrate, (b) is sectional drawing by the AA line of (a), (c) is sectional drawing by the BB line of (a).

Explanation of symbols

1: Shield case 2: Substrate 3: Groove 4: Mounting area

Claims (5)

A substrate on which an electronic circuit or an electronic component is mounted; a groove formed on a surface of the substrate so as to surround at least a part of the mounting region of the electronic circuit or the electronic component on the substrate; and a top plate and a side plate. A shield case comprising: a shield case in which the side plate is fitted into the groove; and a bonding material for fixing a lower end portion of the side plate to the groove in a state in which the side plate of the shield case is fitted into the groove. Case mounting board. The shield case mounting board according to claim 1, wherein the bonding material is solder that is supplied into the groove and bonds the shield case to the groove by reflow. The shield case mounting substrate according to claim 2, wherein the solder is supplied to the groove in a solder paste or printed state. 4. The shield case mounting substrate according to claim 1, wherein an inner surface of the groove is plated with copper. 5. Solder is supplied into the groove on a substrate on which an electronic circuit or an electronic component is mounted and a groove is formed on the surface so as to surround at least a part of the electronic circuit or electronic component mounting region. A method for manufacturing a shield case mounting board, comprising: inserting the side plate of a shield case into the groove, and reflowing the solder to fix a lower end portion of the side plate of the shield case to the groove.

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