JP2752243B2 - Cap sealing jig for hybrid circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a cap sealing device for a hybrid circuit, and more particularly to a hybrid suitable for sealing a cap of a hybrid IC requiring high reliability. The present invention relates to a circuit cap sealing jig.

(Prior Art) For example, a hybrid circuit device in which electronic components such as IC elements are mounted and mounted on a predetermined surface of a ceramic wiring board, and a region in which these electronic components are mounted and mounted is covered with a cap and internally sealed. However, it is widely used in practical use. That is, it is used in a so-called packaged configuration from the viewpoint of functional stability (reliability).

The hybrid circuit device is manufactured or assembled as follows. That is, first, a ceramic wiring board provided with a weld ring layer surrounding a required circuit and an area where electronic components are to be mounted and mounted in the circuit portion is first prepared. Next, required electronic components such as IC elements are mounted and mounted on a predetermined surface of the ceramic wiring board, that is, on a surface of a region where electronic components are mounted and mounted. Thereafter, the opening edge of, for example, a metal cap prepared in advance is brought into contact with the weld ring surface (the area where the electronic component is mounted and mounted is covered with the cap),
While temporarily fixed with a plurality of small fixing jigs such as clamps and clips, the opening edge of the metal cap is welded to a weld ring surface by, for example, a laser sealing technique to seal the interior.

(Problems to be Solved by the Invention) However, the cap sealing means of the above-described hybrid circuit device is relatively complicated to operate and has problems in terms of mass production and reliability. That is, in the sealing means, first, the edge of the opening of the metal cap, for example, is aligned with the weld ring surface of the ceramic wiring board on which the required electronic components are mounted and mounted, and is brought into contact with the weld ring surface. It is necessary to temporarily fix and fix at multiple locations by hand using clamps and clips. In addition, since the temporary fixing / fixing jigs are changed and removed manually in the sealing process by laser welding, the sealing work is not only complicated, but also the time required for sealing is long. Therefore, there is a problem that mass productivity is poor. In addition, since ceramic-based hybrid circuit boards and the like generally have a warp, it is difficult to keep the temporary fixing / fixing with the temporary fixing fixture at all times in a tightly-closed state. There is also a tendency that the reliability of the stop is easily impaired.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a cap sealing jig for a hybrid circuit which can be mass-produced and highly reliable without requiring complicated operations.

[Structure of the Invention] (Means for Solving the Problems) A cap sealing jig for a hybrid circuit according to the present invention has an opening of a cap formed on a weld ring surface formed so as to surround a mounted and mounted electronic component. A base on which a hybrid substrate whose edge is welded and sealed is mounted, and a cap positioned and positioned on the surface of the hybrid substrate mounted on the base surface is fitted to one side to open a cap. A reference plate having a cutout portion that can press the weld ring surface by partially exposing the edge portion intermittently; holding / fixing means formed on the base to fix and hold the reference plate on the base surface; And a pressing means for pressing the hybrid substrate mounted on the base surface toward the reference plate and releasing the pressing.

(Operation) The cap sealing jig for a hybrid circuit according to the present invention is characterized in that the cap opening edge positioned so as to be positioned on the hybrid substrate surface is placed on a horizontal weld ring surface.
It is pressed in a state of being in close contact with a reference plate that can be pressed substantially horizontally and temporarily fixed. Thus, in the temporarily fixed state, the area where the cap opening edge part in contact with the weld ring surface is intermittently partially exposed is selectively welded and sealed, and the cap is fixed and integrated with the hybrid substrate surface. Can be realized. That is, since the cap can be fixed at a predetermined position while being held with high precision, the required sealing can be achieved with high precision and certainty.

Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a plan view of an essential part of an example of a configuration of a shrap sealing jig for a hybrid circuit according to the present invention, and FIG.
FIG. 2 is a cross-sectional view taken along the line AA. 1 is equipped
A base on which the hybrid substrate 4 to which the opening edge 3a of the cap 3 is welded and sealed is mounted on the surface of the weld ring 2 formed so as to surround the mounted electronic component. The placement area 4a is recessed on the upper surface side.
Reference numeral 5 denotes a weld which is fitted with a cap 3 positioned and arranged on the surface of the hybrid substrate 4 mounted on the base 1 and one surface intermittently partially exposes the cap opening edge 3a. This is a reference plate having a notch 5a that can be pressed on the surface of the ring 2. In other words, the reference plate 5 has an inner peripheral surface projecting intermittently so that the edge 3a of the cap opening is brought into substantially horizontal contact with the surface of the weld ring 2 and the position where the contact is made is partially exposed. It has become.

Reference numeral 6 denotes a holding / operating one-touch operation formed on the base 1 for fixing and holding the reference plate 5 on the surface of the base 1.
A fixing shaft 6b attached to each corner of the base with elasticity provided by a spring 6a, forming a fixing means,
The reference plate 5 includes a fixing pin 6d which extends through the fixed shaft 6b in a playless manner and which is advanced and retracted by operating the handle 6c. Here, the elastic resilience may be provided by, for example, rubber or a leaf spring instead of the spring 6a. Numeral 7 designates a holding means for holding the reference plate 5 on the surface of the base 1, and a concave portion provided on the surface of the base 1 so that the reference plate 5 is engaged with and held by the base 1. Generally, it is formed coaxially with the mounting area 4a (recessed) of the hybrid substrate 4.

Further, reference numeral 8 denotes a pressing means for pressing the hybrid substrate 4 mounted on the base 1 surface toward the reference plate 5 side. Are arranged corresponding to the mounting area 4 a (recessed) of the hybrid substrate 4 of the base 1. In the drawing, reference numeral 9 denotes a reference hole for positioning in a sealing jig for a hybrid circuit.

Next, an example of using the sealing jig for a hybrid circuit having the above configuration will be described.

First, a hybrid board 4 on which required electronic components are mounted
Is placed on the predetermined area 4a of the base 1, and then the cap 3 is positioned on the surface of the hybrid substrate 4. Thus, the opening edge 3a of the cap 3 is brought into contact with the surface of the weld ring 2, and the reference plate 5 is positioned and disposed on the reference plate holding means 7 of the base 1. Next, the holding / fixing means 6 for the reference plate is driven and operated, and the reference plate 5 is held.
Is fixed to the base 1, and the pressing means 8 is driven and operated so that the hybrid substrate 4 is attached to the reference plate 5 forming the hobo horizontal plane.
Press.

As described above, the opening edge 3a of the cap 3 is aligned with the weld ring 2 of the hybrid substrate 4 with high precision and is brought into close contact with the surface, and then the cap opening edge 3a that is partially exposed is provided. The position where the surface of the weld ring 2 is in contact with the surface of the weld ring 2 is selectively irradiated with, for example, a laser beam, and partially welded and sealed.
Attach to the surface. Thus, after the cap 3 is partially welded and sealed to the surface of the hybrid substrate 4, the reference plate fixing means 6 is driven and operated to release the reference plate 5 from the fixing of the base 1, while the pressing means 8 Is driven and operated to release the close contact between the hybrid substrate 4 and the reference plate 5 and remove the hybrid substrate 4 from the hybrid circuit sealing jig.

In this manner, the cap 3 is partially welded to the surface of the hybrid substrate 4 to temporarily fix the hybrid circuit sealed body, and the remaining area (part) is welded and sealed by a conventional means. The required weld seal can be achieved easily and reliably.

[Effects of the Invention] As described above, according to the cap sealing device for a hybrid circuit according to the present invention, the opening edge 3a of the cap 3 is easily brought into close contact with the surface of the weld ring 2 and brought into contact therewith. Can be fixed and supported. That is, the opening edge 3a of the cap 3 and the surface of the weld ring 2 are brought into uniform contact with each other as a result of the engagement with the reference plate and the pushing up of the hybrid substrate by the pressing means. In the case where warpage is observed, highly reliable cap sealing can be achieved. Thus, it can be said that the cap sealing jig for a hybrid circuit of the present invention does not require complicated manual operations and is mass-produced, and provides many practical advantages.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration example of a main part of a cap sealing jig for a hybrid circuit according to the present invention, and FIG.
It is sectional drawing along the A line. DESCRIPTION OF SYMBOLS 1 ... Base 2 ... Weld ring 3 ... Cap 3a ... Opening edge of cap 4 ... Hybrid board 4a ... Hybrid board mounting area 5 ... Reference plate 5a ... Notch of reference plate ( Cap fitting part) 6 Holding / fixing means 6a Spring 6b Fixed shaft 6c Handle 6d Reference plate fixing pin 7 Reference plate holding means 8 Pressing means 9 Positioning reference Hole

Claims (1)

(57) [Claims] 1. A base on which a hybrid substrate to which an opening edge of a cap is welded and sealed is placed on a weld ring surface formed so as to surround a mounted and mounted electronic component, and the base surface A reference plate having a notch that can be pressed against the weld ring surface by fitting a cap positioned and arranged on the surface of the hybrid substrate to be mounted on one side and exposing a part of the cap opening edge to one side. Holding and fixing means formed on the base for fixing and holding the reference plate on the base surface, and pressing means for pressing and releasing the pressing of the hybrid substrate mounted on the base surface toward the reference plate side. A cap sealing jig for a hybrid circuit, comprising: