JPH05308200A - Method and apparatus for fixation of board - Google Patents

Abstract

PURPOSE:To correct the warp of a prescribed hoard and to hold the prescribed board uniformly so as to be a plane shape in a board fixation method and a board fixation apparatus wherein a chip component is mounted on the prescribed board. CONSTITUTION:A clamper 5 which is provided with window-shaped opening parts 9B in parts corresponding to component mounting regions 9A in a board 9 is used, and inessential parts 9B in the board 9 are pressed onto a backup plate 7. Thereby, the board 9 can be held uniformly so as to be a plane shape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate fixing method and a substrate fixing apparatus, and is particularly suitable for mounting a chip component on a resin substrate which is easily warped.

[0002]

2. Description of the Related Art Conventionally, when mounting a component such as a chip-shaped circuit element on a substrate, a so-called chip mounter configured to adsorb the component to the tip of a nozzle and mount the component at a predetermined position on the substrate is known. It is used. In this type of chip mounter, by supporting the substrate from the back side with pins or backup plates, it is possible to prevent the substrate from bending due to the pressing force applied by the mounting nozzle when mounting components. It is supposed to do.

[0003]

However, a substrate made of a resin member generally tends to warp. When such a substrate is supported by the backup plate, a gap is created between the substrate and the backup plate when the component mounting surface of the substrate is convexly warped.

Therefore, when the component is mounted by the nozzle, the pressing force of the nozzle causes the substrate on which the component is mounted to bend in the direction in which the substrate is in close contact with the backup plate. As a result, the mounting position on the substrate changes, which makes it difficult to mount the component at an accurate position.

The present invention has been made in consideration of the above points, and an object of the present invention is to propose a substrate fixing method and a substrate fixing device capable of uniformly holding a substrate in a flat state when mounting components on the substrate. And

[0006]

In order to achieve the above object, according to the invention of claim 1, in a substrate fixing method for mounting a chip component on a substrate, a substrate to be component mounted is placed on a backup plate. This is achieved by sandwiching the board with the backup plate and a clamper having an opening formed at a location corresponding to the component mounting area of the board.

Further, the above object is, in the invention of claim 2, a backup plate for mounting a substrate on which components are to be mounted, and an opening is formed at a position corresponding to a component mounting region of the substrate. A backup plate and a clamper, which are held at positions opposite to each other with the board interposed therebetween, are driven so as to move back and forth toward the backup plate. The backup plate and the clamper sandwich the board on which the component is mounted. This can also be achieved by the substrate fixing device configured.

[0008]

For convenience of understanding, the operation based on the above configuration will be described with reference to the reference numerals of corresponding portions in the embodiment. A clamper 5 in which, for example, a window-shaped opening 5B is formed in a portion corresponding to the mount area 9A of the substrate 9 on which components are to be mounted.
Thus, the substrate 9 placed on the backup plate 7 is pressed. As a result, each mounting area 9 of the substrate 9
The mount unnecessary portion 9B provided around A is pressed by the clamper 5 toward the backup plate 7 side. Therefore, the entire substrate 9 can be brought into close contact with the backup plate 7, and the substrate 9 can be held uniformly in a plane.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. The examples described below are
Since it is a preferred specific example of the present invention, various technically preferable limitations are given, but the scope of the present invention is, unless otherwise stated in the following description, limiting the present invention.
It is not limited to these modes.

In FIG. 1, reference numeral 1 generally indicates a substrate mounting device of a chip mounter. The substrate fixing device 1 is
The backup plate 7 that supports the back surface of the substrate 9 on which components are to be mounted, and the actuator 3 that is held at a position facing the backup plate 7 with the substrate 9 interposed therebetween.
The clamper 5 is driven by the.

In the present embodiment, the actuator 3 is composed of an air cylinder, and its output shaft 4 can be driven in the direction indicated by arrow a or in the opposite direction. A wind clamper 5 is fixed to the tip of the output shaft 4. As a result, the wind clamper 5 can move back and forth in a direction of approaching and separating from a substrate 7 placed on a backup plate 7 described later.

In this embodiment, the wind clamper 5 has a predetermined frame 5A and a window-shaped opening 5B surrounded by the frame 5A, and the window 5A serves as a backup. The substrate 9 placed on the plate 7 can be pressed.

The frame 5A of the wind clamper 5 avoids the component mounting area 9A of the substrate 9 and the mount unnecessary portion 9
Only B is pressed, and as will be described later,
When the board 9 is pressed and held on the backup plate 7 by the wind clamper 5, the component mount region 9 of the board 9 is opened through the opening 5B of the wind clamper 5.
The component 10 can be mounted on A by a predetermined mounting nozzle (not shown).

That is, the opening formed in the wind clamper 5 is not limited to a square shape as shown in the figure,
The shape can be appropriately determined according to the component mounting area of the board on which the component is to be mounted. Therefore, in this embodiment, the case where the opening 5B is completely surrounded by the frame body 5A is shown as the shape of the wind clamper 5, but the present invention is not limited to this, and for example, a part of the frame body 5A is cut. The shape may be used.

Further, the mounting nozzle for sucking the mounting component sucks the predetermined component 10 at the tip portion thereof and the substrate 9
The frame body 5A of the wind clamper 5 is thin so that it does not interfere with the tip of the mounting nozzle. Therefore, in order to give the frame body 5A of the wind clamper 5 sufficient strength, this frame body 5A is preferably formed of stainless steel.

The backup plate 7 is provided at a position opposed to the wind clamper 5 with the substrate 9 interposed therebetween, and the substrate 9 can be stably placed on the backup plate 7. As a result, by driving the actuator 3, the wind clamper 5 is moved in the direction indicated by the arrow a, and the board 9 can be pressed onto the backup plate 7 by the wind clamper 5. Therefore, the substrate 9 can be held between the wind clamper 5 and the backup plate 7.

In this embodiment, the substrate 9 shown in the figure is used.
The chip-shaped component 10 such as a circuit element can be mounted on both front and back surfaces. For this reason, the substrate mounting surface 7A of the backup plate 7 on which the substrate 9 is mounted is provided with perforation holes or openings at positions corresponding to the components mounted on the back surface side of the substrate 9, whereby the substrate It is designed to avoid interference with the components mounted on the back surface of 9.

The substrate fixing device according to the present embodiment is constructed as described above. Next, the operation of the device will be described to explain the method of fixing the substrate.

A substrate 9 on which components are to be mounted is placed on the backup plate 7 as shown in the figure. Next, the output shaft 4 of the actuator 3 is operated to lower the wind clamper 5 fixed to the drive shaft 4 toward the backup plate 7 and the substrate 9 placed on the backup plate 7 and the substrate 9 is moved by the wind clamper 5. Press.

At this time, since the frame body 5A of the wind clamper 5 is formed so as to surround each opening 5B, each of the substrates 9 pressed onto the backup plate 7 by the wind clamper 5 is The periphery of the component mounting area 9A is pressed onto the backup plate 7 by the frame 5A of the wind clamper 5. Therefore, in this state, the entire substrate is uniformly held in a flat state in a state of being in close contact with the backup plate 7, whereby the warpage of the substrate 9 can be corrected.

Thus, by mounting the component 10 on the component mounting area 9A of the substrate 9 in this state, even if the pressing force of the mounting nozzle is applied to the substrate 9 on which the component is to be mounted, the entire substrate 9 is backed up. Since the plate 9 is evenly attached to the plate 7, the substrate 9 can be prevented from bending. Moreover, the window clamper 5 is provided with a window-shaped opening 5B at a position corresponding to this area so as to avoid the component mounting area of the board.
Since this is formed, work is not hindered when mounting components by the mounting nozzle.

According to the above-mentioned structure, the substrate 9 can be held uniformly in a plane, so that it is possible to prevent the substrate 9 from being bent when the component 10 is mounted. Parts can be mounted on.
Thus, it is possible to reduce the defect rate and the number of correction steps in the mounting process of the mounting component 10, and the product yield can be improved accordingly.

In the above embodiment, the case where the component 10 is mounted on both sides of the substrate 9 has been described, but the present invention is not limited to this, and the case where the component 10 is mounted only on one side of the substrate 9 is also described. The invention can be applied. In this case, the substrate mounting surface 7 of the backup plate 7
It is not necessary to provide a drill hole in A. Further, in the above embodiment, the case where the wind clamper 5 made of stainless steel is used has been described, but the present invention is not limited to this, and wind clampers made of various other materials can be used.

[0024]

As described above, according to the present invention, by pressing the unmountable portion of the substrate onto the backup plate by using the clamper having the opening portion at the portion corresponding to the component mounting area of the substrate, The entire substrate can be held uniformly in a plane. Therefore, the warp of the substrate can be corrected when the component is mounted, which allows the component to be mounted at a more accurate position.

[Brief description of drawings]

FIG. 1 is a perspective view showing a substrate fixing device according to the present invention.

[Explanation of symbols]

 1 Board Fixing Device 3 Actuator 4 Output Shaft 5 Wind Clamper 5A Frame 5B Opening 7 Backup Plate 9 Board 9A Parts Mounting Area 9B Unnecessary Mounting Area.

Claims (2)

[Claims] 1. A substrate fixing method for mounting a chip component on a substrate, wherein the substrate on which the component is to be mounted is placed on a backup plate, and the backup plate and a portion corresponding to a component mounting area of the substrate are opened. A method of fixing a substrate, comprising: sandwiching the substrate with a clamper having a portion formed therein. 2. A backup plate on which a board on which a component is to be mounted is placed, and an opening is formed at a position corresponding to a component mounting area of the board, and the backup plate is held at a position facing the backup plate with the board interposed therebetween. Together with a clamper that is driven to move back and forth toward the backup plate,
A board fixing device configured to sandwich the board on which the component is to be mounted by the backup plate and the clamper.