JP2000323308A - 表面実装型デバイスおよびその実装方法 - Google Patents
表面実装型デバイスおよびその実装方法Info
- Publication number
- JP2000323308A JP2000323308A JP11127857A JP12785799A JP2000323308A JP 2000323308 A JP2000323308 A JP 2000323308A JP 11127857 A JP11127857 A JP 11127857A JP 12785799 A JP12785799 A JP 12785799A JP 2000323308 A JP2000323308 A JP 2000323308A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- insulating
- color
- insulating case
- fusible alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 47
- 229910000743 fusible alloy Inorganic materials 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims description 45
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 239000000155 melt Substances 0.000 claims description 17
- 238000010586 diagram Methods 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 4
- 230000004907 flux Effects 0.000 abstract description 13
- 238000010521 absorption reaction Methods 0.000 abstract description 9
- 239000004020 conductor Substances 0.000 description 41
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000002411 adverse Effects 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 5
- 229920001707 polybutylene terephthalate Polymers 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11127857A JP2000323308A (ja) | 1999-05-10 | 1999-05-10 | 表面実装型デバイスおよびその実装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11127857A JP2000323308A (ja) | 1999-05-10 | 1999-05-10 | 表面実装型デバイスおよびその実装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000323308A true JP2000323308A (ja) | 2000-11-24 |
| JP2000323308A5 JP2000323308A5 (enrdf_load_stackoverflow) | 2006-05-25 |
Family
ID=14970390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11127857A Withdrawn JP2000323308A (ja) | 1999-05-10 | 1999-05-10 | 表面実装型デバイスおよびその実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000323308A (enrdf_load_stackoverflow) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007123129A (ja) * | 2005-10-28 | 2007-05-17 | Sanyo Electric Co Ltd | 保護素子とこの保護素子を備えるパック電池 |
| JP2007194387A (ja) * | 2006-01-19 | 2007-08-02 | Murata Mfg Co Ltd | 電子部品及び電子部品製造方法 |
| JP2007316023A (ja) * | 2006-05-29 | 2007-12-06 | Morihiro Shimano | コンタクトプローブ |
| US7504925B2 (en) | 2005-05-27 | 2009-03-17 | Infineon Technologies Ag | Electric component with a protected current feeding terminal |
| US7508295B2 (en) | 2005-05-27 | 2009-03-24 | Infineon Technologies Ag | Protection circuit |
| US7554432B2 (en) | 2005-05-27 | 2009-06-30 | Infineon Technologies Ag | Fuse element with trigger assistance |
| CN104882342A (zh) * | 2014-02-28 | 2015-09-02 | 斯玛特电子公司 | 复合保护装置 |
| CN104882850A (zh) * | 2014-02-28 | 2015-09-02 | 斯玛特电子公司 | 阻断电流和电压异常状态的复合保护元件 |
| US20150262775A1 (en) * | 2014-03-17 | 2015-09-17 | Smart Electronics Inc. | Fuse resistor |
| JP2016004783A (ja) * | 2014-06-13 | 2016-01-12 | スマート エレクトロニクス インク | 複合保護素子 |
| KR20170007320A (ko) * | 2014-05-02 | 2017-01-18 | 리텔퓨즈 인코포레이티드 | 리플로우 가능 회로 보호 장치 |
-
1999
- 1999-05-10 JP JP11127857A patent/JP2000323308A/ja not_active Withdrawn
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7504925B2 (en) | 2005-05-27 | 2009-03-17 | Infineon Technologies Ag | Electric component with a protected current feeding terminal |
| US7508295B2 (en) | 2005-05-27 | 2009-03-24 | Infineon Technologies Ag | Protection circuit |
| US7554432B2 (en) | 2005-05-27 | 2009-06-30 | Infineon Technologies Ag | Fuse element with trigger assistance |
| DE102005024346B4 (de) * | 2005-05-27 | 2012-04-26 | Infineon Technologies Ag | Sicherungselement mit Auslöseunterstützung |
| JP2007123129A (ja) * | 2005-10-28 | 2007-05-17 | Sanyo Electric Co Ltd | 保護素子とこの保護素子を備えるパック電池 |
| JP2007194387A (ja) * | 2006-01-19 | 2007-08-02 | Murata Mfg Co Ltd | 電子部品及び電子部品製造方法 |
| JP2007316023A (ja) * | 2006-05-29 | 2007-12-06 | Morihiro Shimano | コンタクトプローブ |
| JP2015165495A (ja) * | 2014-02-28 | 2015-09-17 | スマート エレクトロニクス インク | 複合保護素子 |
| US9722418B2 (en) | 2014-02-28 | 2017-08-01 | Smart Electronics Inc. | Complex protection device |
| DE102015102083B4 (de) * | 2014-02-28 | 2019-11-28 | Smart Electronics Inc. | Komplexe Schutzvorrichtung |
| CN104882342A (zh) * | 2014-02-28 | 2015-09-02 | 斯玛特电子公司 | 复合保护装置 |
| JP2015165498A (ja) * | 2014-02-28 | 2015-09-17 | スマート エレクトロニクス インク | 複合保護素子 |
| CN104882342B (zh) * | 2014-02-28 | 2018-01-26 | 斯玛特电子公司 | 复合保护装置 |
| CN104882850A (zh) * | 2014-02-28 | 2015-09-02 | 斯玛特电子公司 | 阻断电流和电压异常状态的复合保护元件 |
| US9697969B2 (en) * | 2014-03-17 | 2017-07-04 | Smart Electronics Inc. | Fuse resistor |
| JP2015177190A (ja) * | 2014-03-17 | 2015-10-05 | スマート エレクトロニクス インク | ヒューズ抵抗器 |
| US20150262775A1 (en) * | 2014-03-17 | 2015-09-17 | Smart Electronics Inc. | Fuse resistor |
| KR20170007320A (ko) * | 2014-05-02 | 2017-01-18 | 리텔퓨즈 인코포레이티드 | 리플로우 가능 회로 보호 장치 |
| JP2017515293A (ja) * | 2014-05-02 | 2017-06-08 | リテルヒューズ・インク | リフロー型回路保護デバイス |
| KR102111832B1 (ko) | 2014-05-02 | 2020-05-15 | 리텔퓨즈 인코포레이티드 | 리플로우 가능 회로 보호 장치 |
| JP2016004783A (ja) * | 2014-06-13 | 2016-01-12 | スマート エレクトロニクス インク | 複合保護素子 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060403 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060403 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20070703 |