JP2000307031A - 両面電気相互接続フレキシブル回路 - Google Patents

両面電気相互接続フレキシブル回路

Info

Publication number
JP2000307031A
JP2000307031A JP2000080572A JP2000080572A JP2000307031A JP 2000307031 A JP2000307031 A JP 2000307031A JP 2000080572 A JP2000080572 A JP 2000080572A JP 2000080572 A JP2000080572 A JP 2000080572A JP 2000307031 A JP2000307031 A JP 2000307031A
Authority
JP
Japan
Prior art keywords
copper
film
flexible circuit
vias
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2000080572A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000307031A5 (enExample
Inventor
Donald C Abbott
シー、アボット ドナルド
A Furecchetto Raymond
エイ、フレッチェット レイモンド
Szabo Robert
サボ ロバート
Steve Smith
スミス スチーブ
Christopher Smith
スミス クリストファー
West David
ウェスト デビッド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JP2000307031A publication Critical patent/JP2000307031A/ja
Publication of JP2000307031A5 publication Critical patent/JP2000307031A5/ja
Abandoned legal-status Critical Current

Links

Classifications

    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H10W70/635—
    • H10W70/688—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H10W72/075—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W72/951—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2000080572A 1999-03-23 2000-03-22 両面電気相互接続フレキシブル回路 Abandoned JP2000307031A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12573599P 1999-03-23 1999-03-23
US125735 2002-04-18

Publications (2)

Publication Number Publication Date
JP2000307031A true JP2000307031A (ja) 2000-11-02
JP2000307031A5 JP2000307031A5 (enExample) 2007-04-19

Family

ID=22421163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000080572A Abandoned JP2000307031A (ja) 1999-03-23 2000-03-22 両面電気相互接続フレキシブル回路

Country Status (2)

Country Link
US (1) US6365974B1 (enExample)
JP (1) JP2000307031A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101569889B1 (ko) 2013-12-23 2015-11-17 한국기계연구원 신축성을 가지는 유연 전자소자의 접속방법 및 이에 의해 제조된 유연 전자소자
CN115023807A (zh) * 2020-01-24 2022-09-06 3M创新有限公司 与嵌入式电子部件的电气连接

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026012A (ja) * 2000-07-05 2002-01-25 Murata Mfg Co Ltd 半導体装置及びその製造方法
US6429527B1 (en) 2001-01-17 2002-08-06 International Business Corporation Method and article for filling apertures in a high performance electronic substrate
US6888256B2 (en) * 2001-10-31 2005-05-03 Infineon Technologies Ag Compliant relief wafer level packaging
US7202556B2 (en) * 2001-12-20 2007-04-10 Micron Technology, Inc. Semiconductor package having substrate with multi-layer metal bumps
US7723210B2 (en) 2002-11-08 2010-05-25 Amkor Technology, Inc. Direct-write wafer level chip scale package
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
JP4369348B2 (ja) 2004-11-08 2009-11-18 新光電気工業株式会社 基板及びその製造方法
TWI250629B (en) 2005-01-12 2006-03-01 Ind Tech Res Inst Electronic package and fabricating method thereof
US7232740B1 (en) 2005-05-16 2007-06-19 The United States Of America As Represented By The National Security Agency Method for bumping a thin wafer
US7572681B1 (en) * 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US7902660B1 (en) 2006-05-24 2011-03-08 Amkor Technology, Inc. Substrate for semiconductor device and manufacturing method thereof
US7919868B2 (en) * 2007-08-15 2011-04-05 Qimonda Ag Carrier substrate and integrated circuit
US20100149773A1 (en) * 2008-12-17 2010-06-17 Mohd Hanafi Mohd Said Integrated circuit packages having shared die-to-die contacts and methods to manufacture the same
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8324511B1 (en) 2010-04-06 2012-12-04 Amkor Technology, Inc. Through via nub reveal method and structure
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8440554B1 (en) 2010-08-02 2013-05-14 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8487445B1 (en) 2010-10-05 2013-07-16 Amkor Technology, Inc. Semiconductor device having through electrodes protruding from dielectric layer
US8791501B1 (en) 2010-12-03 2014-07-29 Amkor Technology, Inc. Integrated passive device structure and method
US8390130B1 (en) 2011-01-06 2013-03-05 Amkor Technology, Inc. Through via recessed reveal structure and method
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9543384B2 (en) 2015-02-26 2017-01-10 SK Hynix Inc. Semiconductor package
KR102497583B1 (ko) 2015-10-27 2023-02-10 삼성전자주식회사 유연한 연결부를 갖는 반도체 장치 및 그 제조방법
EP4185252B1 (en) 2020-07-24 2025-09-03 Hollister Incorporated Double-sided sensor device for ostomy leak detection system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5691245A (en) * 1996-10-28 1997-11-25 He Holdings, Inc. Methods of forming two-sided HDMI interconnect structures

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101569889B1 (ko) 2013-12-23 2015-11-17 한국기계연구원 신축성을 가지는 유연 전자소자의 접속방법 및 이에 의해 제조된 유연 전자소자
CN115023807A (zh) * 2020-01-24 2022-09-06 3M创新有限公司 与嵌入式电子部件的电气连接

Also Published As

Publication number Publication date
US6365974B1 (en) 2002-04-02

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