JP2000288450A - Formation of coating film and coating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coating film forming method and a coating device, which are capable of uniformalizing the thickness of a coating film formed on a substrate and decreasing the quantity of a coating liquid to be used to the utmost. SOLUTION: The coating film is formed by discharging the coating liquid on the surface of the substrate from a coating liquid feed nozzle 80 while moving the coating liquid feed nozzle 80 above the substrate. In such a case, one or more of the discharge and the discharge rate of the coating liquid from the coating liquid feed nozzle 80, the movement and the moving speed of the coating liquid feed nozzle 80 and the rotation and the rotational speed of the substrate are properly controlled at the time of moving the coating liquid supply nozzle 80 above the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a liquid crystal display (L).
The present invention relates to a coating film forming method and a coating device for forming a coating film such as a resist film on a surface of a CD or a semiconductor substrate.

[0002]

2. Description of the Related Art For example, in the production of LCD substrates,
A circuit is formed by applying a photoresist to an LCD substrate, transferring a circuit pattern to the photoresist by using a photolithography technique, and developing the photoresist.
This step includes a coating film forming step of supplying a coating liquid onto the surface of the substrate.

As a method of forming a resist film in this case, for example, a rectangular LCD substrate is mounted and fixed on a mounting table provided in a processing container, and an opening of the processing container is closed with a lid. Then, the processing container and the mounting table are rotated together, and a resist solution (coating solution) composed of a solvent and a photosensitive resin is dropped on the center of the upper surface of the substrate, and the resist solution is applied by the rotational force and centrifugal force of the substrate There is known a method in which a substrate is spirally diffused from the center of the substrate toward the peripheral edge and applied.

In this method, a resist solution is used for an LCD.
In the process of diffusing from the center position of the substrate toward the periphery, the solvent in the resist solution evaporates and the resist solution dries. As a result, on the LCD substrate, the resist solution depends on the direction in which the resist diffuses. The viscosity is different, and the thickness of the formed resist film is different between the center part and the peripheral part of the LCD substrate.

In the above method, the resist is applied to the substrate by rotating the substrate to diffuse the resist liquid from the center of the substrate toward the peripheral portion, and the outer periphery having a peripheral speed significantly higher than the center position. A considerable amount of the resist solution is scattered from the portion toward the processing container. In this case, the amount of the resist solution dropped on the substrate surface is 10 to 20%, and the remaining 80 to 90% is scattered. In particular, when a resist liquid is applied to a rectangular LCD substrate, a very large amount of the resist liquid is wasted because the resist liquid is applied to the entire surface of the substrate without leaving any residue. recent years,
Since the size of the LCD substrate is increasing, the conventional method results in a very large waste of the resist solution.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and it is possible to make the thickness of a coating film formed on a substrate uniform and to reduce the amount of a coating solution to be used. It is an object of the present invention to provide a coating film forming method and a coating apparatus which can minimize the coating film.

[0007]

According to a first aspect of the present invention, a coating liquid is supplied from a coating liquid supply nozzle onto a surface of a substrate housed in a processing container. Forming a coating film by forming a coating film by moving the coating liquid supply nozzle on a substrate and discharging the coating liquid from the coating liquid supply nozzle onto the surface of the substrate. And a step of adjusting the film thickness of the coating film.

According to a second aspect of the present invention, there is provided a coating apparatus for forming a coating film by supplying a coating liquid on a surface of a substrate accommodated in a processing container, wherein the coating liquid supplying the coating liquid is provided. A supply mechanism, a coating liquid supply nozzle for discharging the coating liquid from the coating liquid supply mechanism onto the surface of the substrate, a nozzle moving mechanism for moving the coating liquid supply nozzle on the substrate, the coating liquid supply system, A coating apparatus is provided, comprising: control means for controlling the nozzle moving mechanism; and a film-regulating mechanism for adjusting the thickness of the coating film.

According to the present invention having such a configuration, the coating liquid supply nozzle discharges the coating liquid onto the surface of the substrate while moving the coating liquid supply nozzle on the substrate. The thickness of the coating film can be made uniform as compared with a case in which the coating liquid is discharged while the liquid is stopped. That is, for example, since the coating liquid supply nozzle can be moved to discharge the coating liquid also to the peripheral portion of the substrate, it is possible to prevent the coating liquid from drying at this peripheral portion, and The thickness of the coating film at the peripheral portion can be made substantially the same. Also, instead of discharging a large amount of coating liquid only to the center of the substrate as in the case where the coating liquid supply nozzle is stationary, the coating liquid supply nozzle is moved from the center to the peripheral edge of the substrate while moving the nozzle. Since the coating liquid can be discharged gradually, the amount of the coating liquid scattered from the substrate due to centrifugal force can be reduced during rotation of the substrate in a later process, and the amount of the coating liquid used can be reduced as much as possible. it can.

Specifically, the following forms (1) to (3) can be given. (1) Discharge or discharge speed of the coating liquid from the coating liquid supply nozzle Regarding the discharge of the coating liquid, when the coating liquid supply nozzle is moved on the substrate, the discharge of the coating liquid is performed continuously, or The ejection can be interrupted according to the position of the application liquid supply nozzle on the substrate. Regarding the coating liquid discharge speed, when the coating liquid supply nozzle is moving on the substrate, the discharge speed of the coating liquid is maintained substantially constant, or according to the position of the coating liquid supply nozzle on the substrate. The discharge speed can be changed.

Thus, for example, when the application liquid supply nozzle is moving, the application liquid is discharged when the nozzle is located at the center of the substrate, and the application liquid is applied when the nozzle moves from the center of the substrate to the peripheral portion. Discharging of the liquid is interrupted, and thereafter, as the nozzle approaches the peripheral portion of the substrate, the coating liquid can be discharged again, so that the amount of the coating liquid can be reduced. Further, the thickness of the coating film can be made uniform.

(2) Movement or moving speed of the coating liquid supply nozzle Regarding the movement of the coating liquid supply nozzle, the movement of the coating liquid supply nozzle is performed continuously while the coating liquid supply nozzle is moving on the substrate. Alternatively, the movement can be interrupted according to the position of the application liquid supply nozzle on the substrate. Further, with respect to the moving speed, when moving the coating liquid supply nozzle on the substrate, the moving speed is maintained substantially constant, or the moving speed is changed according to the position of the coating liquid supply nozzle on the substrate. Can be

Thus, for example, the movement or the moving speed of the nozzle can be controlled so that the amount of the coating liquid ejected per unit area of the substrate becomes substantially equal.
The thickness of the coating film can be made uniform or the amount of the coating solution can be reduced.

(3) Movement or rotation of the substrate, or movement or rotation speed With respect to the movement or rotation of the substrate, when the application liquid is being discharged while moving the application liquid supply nozzle over the substrate, the substrate is kept stationary. Or the substrate can be moved or rotated. Regarding the movement or rotation speed of the substrate, when the application liquid is being ejected while moving the application liquid supply nozzle over the substrate, the movement speed or the rotation speed of the substrate is maintained substantially constant, or The movement or the rotation speed can be changed according to the position of the supply nozzle on the substrate.

Thus, for example, the movement or rotation or the movement or rotation speed of the substrate can be controlled so that the amount of the coating liquid discharged per unit area of the substrate can be made substantially equal. It is possible to make the film thickness uniform or reduce the amount of the coating solution.

[0016]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a perspective view showing a resist coating and developing system for an LCD substrate having a coating unit to which the present invention is applied.

This coating / developing processing system includes a cassette station 1 on which a cassette C accommodating a plurality of substrates G is mounted, and a plurality of processing units for performing a series of processes including resist coating and developing on the substrates G. A processing unit 2 is provided, and an interface unit 3 for transferring a substrate G between the processing unit 2 and an exposure apparatus (not shown). A cassette station 2 and an interface unit 3 are provided at both ends of the processing unit 2, respectively. Are located.

The cassette station 1 has a transport mechanism 10 for transporting an LCD substrate between the cassette C and the processing section 2. And cassette station 1
, A cassette C is loaded and unloaded. The transport mechanism 10 includes a transport arm 11 that can move on a transport path 10 a provided along the direction in which the cassettes are arranged. The transport arm 11 allows the substrate G to be moved between the cassette C and the processing unit 2.
Is carried out. The processing section 2 includes a front section 2a and a middle section 2
b and a rear section 2c, each of which has transport paths 12, 13, and 14 in the center, and each processing unit is disposed on both sides of these transport paths. Then, relay portions 15 and 16 are provided between them.

The front section 2a is provided with a main transfer device 17 movable along the transfer path 12. On one side of the transfer path 12, two cleaning units (SCR) 21a and 21b are arranged. On the other side of the transport path 12, an ultraviolet irradiation / cooling unit 25 in which an ultraviolet irradiation device (UV) and a cooling device (COL) are vertically stacked, and two heat treatment devices (HP) are vertically stacked. A heat treatment unit 26 and a cooling unit 27 in which two cooling devices (COL) are vertically stacked are arranged.

The middle section 2b is provided with a main transfer device 18 movable along the transfer path 13. On one side of the transfer path 13, a resist coating unit (CT) 22 and a peripheral edge of the substrate G are provided. A peripheral resist removal unit (ER) 23 for removing the resist of the portion is provided integrally,
On the other side of the transport path 13, a heat treatment unit 28 in which two heating devices (HP) are vertically stacked, and a heat treatment in which a heat treatment device (HP) and a cooling treatment device (COL) are vertically stacked. / Cooling unit 29, and an adhesion processing / cooling unit 30 in which an adhesion processing device (AD) and a cooling device (COL) are vertically stacked.
Is arranged.

Further, the rear stage 2c is provided with a main transfer device 19 which can move along the transfer path 14.
On one side, three development processing units (DEV) 24
a, 24b, and 24c are arranged, and on the other side of the transport path 14, a heat treatment unit 31 in which two heat treatment devices (HP) are vertically stacked, and a heat treatment device (H
P) and a cooling device (COL) are vertically stacked, and two heat treatment / cooling units 32 and 33 are arranged.

The main transfer units 17, 18, and 19 are respectively provided with an X-axis drive mechanism, a Y-axis drive mechanism in two directions in a horizontal plane,
And a vertical Z-axis drive mechanism.
A rotation drive mechanism that rotates about an axis is provided, and has arms 17a, 18a, and 19a that support the substrate G, respectively.

The processing section 2 includes a cleaning processing unit 21a and a resist processing unit 2 on one side of the transport path.
2. Only a spinner unit such as the development processing unit 24a is arranged, and only a heat processing unit such as a heating processing unit or a cooling processing unit is arranged on the other side.

A chemical solution supply unit 34 is provided at a portion of the relay units 15 and 16 on the side where the spinner system unit is provided, and a space 35 where maintenance is possible is provided.

The interface section 3 includes an extension 36 for temporarily holding the substrate when transferring the substrate to and from the processing section 2, and two buffer stages 37 provided on both sides thereof for disposing a buffer cassette. And a substrate G between these and an exposure apparatus (not shown)
And a transport mechanism 38 for carrying in and out the wafer. The transport mechanism 38 includes the extension 36 and the buffer stage 3
The transfer arm 39 is provided on the transfer path 38a provided along the arrangement direction of the transfer unit 7 and the transfer arm 39 transfers the substrate G between the processing unit 2 and the exposure apparatus.

By integrating and integrating the processing units in this manner, space can be saved and processing efficiency can be improved.

In the coating / developing processing system configured as described above, the substrate G in the cassette C is transported to the processing unit 2, and the processing unit 2 first operates the ultraviolet irradiation / cooling unit 25 of the front stage 2 a. After the surface modification / cleaning treatment is performed by an ultraviolet irradiation device (UV) and then cooled by the cooling device (COL) of the unit, the cleaning unit (SCR)
Scrubber cleaning is performed at 21a and 21b, and the front part 2a is cleaned.
After being dried by heating in one of the heat treatment devices (HP) arranged in the cooling unit 27, the cooling device (CO
L).

Thereafter, the substrate G is transported to the middle section 2b,
In order to improve the fixability of the resist, a hydrophobic treatment (H) is performed by an adhesion treatment device (AD) in the upper stage of the unit 30.
MDS processing), and after cooling by the lower cooling device (COL), the resist is applied by the resist coating unit (CT) 22 and the extra resist on the periphery of the substrate G is removed by the peripheral resist removal unit (ER) 23. . Thereafter, the substrate G is pre-baked in one of the heat treatment apparatuses (HP) arranged in the middle section 2b, and cooled by the lower cooling apparatus (COL) of the unit 29 or 30.

Thereafter, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. And
The substrate G is carried in again via the interface unit 3,
If necessary, any one of the heat treatment devices (H
After performing post exposure bake processing in P),
Development processing is performed in any of the development processing units (DEV) 24a, 24b, and 24c, and a predetermined circuit pattern is formed. The developed substrate G is subjected to a post-baking process in any one of the heat treatment devices (HP) in the subsequent section 2c, and then cooled by a cooling device (COL).
The cassette is stored in a predetermined cassette on the cassette station 1 by the transfer mechanism 10.

Next, the resist coating unit (CT) 22 to which the coating film forming method and the coating apparatus of the present invention are applied will be described.

FIG. 2 shows a coating unit (CT) 22 which is a coating apparatus according to an embodiment of the present invention.
A spin chuck 40 for holding the LCD substrate G in a horizontal state so as to be rotatable by vacuum suction;
A rotatable processing container (rotating cup) 42 having a processing chamber 41 surrounding the upper portion and the outer peripheral portion of which is open at the top, and an opening 42a of the rotating cup 42 can be closed and the cup 42 can be closed. A lid 46 detachably provided with respect to the arm, a robot arm 50 for moving the lid 46 between a closed position and a standby position, and a hollow ring disposed so as to surround the outer peripheral side of the rotating cup 42. A drain cup 44, a drive motor 51 for rotating the spin chuck 40 and the rotating cup 42, a jet head 90 movably provided above the spin chuck 40, and a jet head 9.
And a nozzle moving mechanism 100 for holding the nozzle 0 and moving it between the jetting stand-by position and the substrate upper position. Spout 90
It has a structure in which a solvent supply nozzle 70 for supplying a solvent A (for example, a thinner) of a coating liquid and a resist liquid supply nozzle 80 for supplying a resist liquid B as a coating liquid are closely attached and integrated.

A solvent A and a resist solution B flowing through the solvent supply path and the resist solution supply path from the nozzles 70 and 80 are respectively supplied with a predetermined temperature (for example, 23).
° C) is provided.

The spin chuck 40 is formed of, for example, a heat-resistant synthetic resin such as polyetheretherketone (PEEK), and is driven based on a preset program, and is driven by a drive motor 51 capable of changing the rotation speed. It can be rotated (rotated) in the horizontal direction via a rotating shaft 52 that is rotated, and can be moved in the vertical direction by driving a lifting cylinder 53 connected to the rotating shaft 52. In this case, the rotating shaft 52 is connected to the spline bearing 57 so as to be slidable in the vertical direction. The spline bearing 57 is fitted on the inner peripheral surface of a rotating inner cylinder 56a rotatably mounted on the inner peripheral surface of the fixed collar 54 via a bearing 55a. A driven pulley 58a is mounted on the spline bearing 57, and a belt 59a is stretched between the driven pulley 58a and a driving pulley 51b mounted on a driving shaft 51a of the driving motor 51. Therefore, the rotation shaft 52 is rotated by the drive of the drive motor 51 via the belt 59a, and the spin chuck 40 is rotated. The lower side of the rotating shaft 52 is disposed in a cylinder (not shown),
In this cylindrical body, the rotating shaft 52 is
The rotation chuck 52 is connected to the lifting cylinder 53 via the rotation axis 0, and the rotation shaft 52 is vertically movable by driving the lifting cylinder 53, whereby the spin chuck is moved in the vertical direction.

A connecting cylinder 61 is fixed to the upper end of a rotating outer cylinder 56b mounted on the outer peripheral surface of the fixed collar 54 via a bearing 55b, and the rotating cup 42 is mounted via the connecting cylinder 61. Have been. A bearing 52 having a sealing function is interposed between the bottom 42 b of the rotating cup 42 and the lower surface of the spin chuck 40, and the rotating cup 42 is rotatable relative to the spin chuck 40. A driven pulley 58b is mounted on the rotary outer cylinder 56b.
A belt 59b is stretched around a drive pulley 51b mounted on the drive motor 51. Therefore, the drive from the drive motor 51 is transmitted to the rotating cup 42 by the belt 59b, and the rotating cup 42 is rotated.

In this case, the diameter of the driven pulley 58b is formed to be the same as the diameter of the driven pulley 58a mounted on the rotary shaft 52, and the belts 59a, 5a are driven by the same drive motor 51.
9b, the rotating cup 42 and the spin chuck 40 are rotated at the same speed.

The rotating cup 42 has a side wall 42c whose diameter is reduced upward, and the surface of the side wall 42c is a tapered surface 42e. An inward flange 42d is formed at the upper end of the side wall 42c toward the inside.
Air supply holes 64 are formed in the inward flange 42d of the rotation cup 42 at appropriate intervals in the circumferential direction, and exhaust holes 65 are formed in appropriate positions in the circumferential direction below the side wall 42c. By providing the air supply hole 64 and the exhaust hole 65 in this manner, when the rotating cup 42 rotates, the air flowing into the processing chamber 41 from the air supply hole 64 flows to the outside from the exhaust hole 65, so that the rotation of the rotary cup 42 At this time, it is possible to prevent the inside of the processing chamber 41 from becoming negative pressure,
The lid 46 can be easily opened without requiring a large force when the lid 46 is opened from FIG.

On the other hand, an annular passage 44a is provided inside the drain cup 44, and an exhaust port 66 is provided at an appropriate place (for example, four places in the circumferential direction) on the outer peripheral wall thereof. 66 is connected to an exhaust device (not shown). Also, at the upper part on the inner peripheral side of the drain cup 44,
A radial exhaust passage 67 communicating with the annular passage 44a and the exhaust port 66 is formed. By providing the exhaust port 66 in the outer peripheral portion of the drain cup 44 and forming the exhaust passage 67 in the upper portion on the inner peripheral side of the drain cup 44, the exhaust gas scattered by the centrifugal force in the processing chamber 41 during the rotation process is exhausted. The mist flowing into the drain cup 44 through the hole 64 is prevented from rising to the upper side of the rotating cup 42, and the mist can be discharged to the outside from the exhaust port 66.

The annular passage 44a is provided with a drain cup 44
The outer wall 44b rising from the bottom of the drain cup 44 and the inner wall 44c hanging down from the ceiling of the drain cup 44 define a detour, so that exhaust can be performed uniformly. Drain holes 44e are provided at appropriate intervals along the circumferential direction on the bottom 44d located between the outer wall 44b and the inner wall 44c.

A tapered surface 44f having a taper corresponding to the tapered surface 42e of the rotary cup 42 is formed on the inner peripheral surface of the drain cup 44.
2 and the tapered surface 44 of the drain cup 44
f, a minute gap is formed. By forming the tapered minute gap that expands downward in this manner, a pressure difference is induced from a peripheral speed difference generated between the top and bottom of the minute gap when the rotating cup 42 rotates, and this pressure difference is rotated. By promoting the airflow from the upper side to the lower side of the minute gap in the outer peripheral portion of the cup 42, it is possible to prevent the exhaust mist in the drain cup 44 from scattering outside the rotary cup 42 through the minute gap.

Further, even if there is a mist which is directed upward through the minute gap and scatters outside the rotary cup 42, the mist is discharged from the exhaust port 66 through the exhaust passage 67 and the annular passage 44 a in the drain cup 44. You. Here, the case where the drain cup 44 is disposed so as to surround the outer peripheral side of the rotary cup 42 has been described, but the drain cup 44 does not necessarily need to be disposed on the outer peripheral side of the rotary cup 42.
It may be arranged on the lower side of the rotating cup 42.

The lid 46 is provided with a support member 49 extending upward at the center of the upper surface thereof, and a head 48 having a diameter larger than that of the support member 49 is provided at the upper end thereof. When the cover 46 is opened and closed, a head 48 provided on a top surface of the cover 46 with a support member 49 interposed therebetween is disposed as shown in FIG.
As shown by a two-dot chain line, the robot arm 50 is inserted and the robot arm 50 is
The robot arm 50 is moved up and down after engaging the locking pin 50a protruding therefrom.

A baffle plate (not shown) formed of a perforated plate or the like having a size equal to or larger than the substrate G attached to the lid 46 at the center portion is provided at an intermediate position between the lid 46 and the substrate G. ) Can also be arranged. By arranging the baffle plate in this manner, the processing chamber 4 can be more reliably formed during the coating process.
1 can be prevented from occurring.

The solvent supply nozzle 70 is connected to a solvent tank 73 via a solvent supply tube 71 serving as a solvent supply path and an opening / closing valve 72, and supplies a nitrogen (N ₂ ) gas into the solvent tank 73. Thus, the solvent A in the solvent tank 73 is supplied onto the substrate G by the pressure. In this case, the flow rate of the solvent A is controlled by controlling the pressure of the N ₂ gas, and a predetermined amount of the solvent A is supplied for a predetermined time.

The resist solution supply nozzle 80 is provided with a resist solution tank 82 (coating solution) containing a resist solution B via a resist solution supply tube 81 which is a resist solution supply passage so that the resist solution can be discharged toward the substrate G. Supply source). The tube 81 has a suck back valve 83, an air operation valve 84, and a bubble removing mechanism 8 for separating and removing bubbles in the resist solution B.
5, a filter 86 and a bellows pump 87 are sequentially provided. The bellows pump 87 can be expanded and contracted by a driving unit. By controlling the expansion and contraction, a predetermined amount of the resist liquid B can be discharged to the surface of the substrate G through the resist liquid supply nozzle 80. It has become. With this bellows pump 87, the conventional resist solution B
The supply amount of the resist solution B smaller than the supply amount of the resist solution B can be controlled. The drive section linearly moves the screw 88a by rotating the nut 88b, and a ball screw mechanism 88 including a screw 88a having one end attached to one end of the bellows pump and a nut 88b screwed to the screw. A motor 89 is provided.

The suck-back valve 83 provided in the resist liquid supply system discharges the resist liquid B remaining on the inner wall of the tip of the resist liquid supply nozzle 80 due to surface tension after the resist liquid is discharged from the resist liquid supply nozzle 80. It is drawn back into the resist liquid supply nozzle 80, thereby preventing the remaining resist liquid from solidifying. In this case, the resist liquid supply nozzle 80 discharges a small amount of the resist liquid B, and the resist liquid B is supplied to the resist liquid supply nozzle 8 by the negative pressure of the suck back valve 83 as usual.
When it is returned to 0, the air near the tip of the nozzle 80 is also drawn into the nozzle 80, and the residue of the resist solution B adhering to the tip of the nozzle 80 enters the nozzle 80 and only causes clogging of the nozzle 80. Alternatively, the dried resist becomes particles and contaminates the substrate G.
The yield may be reduced.

The jet head 90 is provided so as to be movable by a nozzle moving mechanism 100. Specifically, as shown in FIG. 3, the nozzle moving mechanism 100 includes a support member 101 for supporting the jet head 90, a rotary shaft 102 for supporting the support member 101 rotatably and reciprocally, and a support member 10
And a driving means (not shown) for driving the driving device 1. With this configuration, the jet head 90 provided on the support member 101 can rotate in the direction of the arrow E in the drawing and can advance and retreat in the direction of the arrow F in the drawing with the rotation shaft 102 as the rotation axis. The resist liquid and the solvent are supplied to the substrate G from the solvent supply nozzle 70 and the resist liquid supply nozzle 80 while being moved in the directions of the arrows E and F in the figure.

FIG. 4 shows another example of the movement locus of the resist liquid supply nozzle. A pair of shafts 105 that are movable in the direction of arrow H so as to sandwich the rotating cup 42 is provided,
The resist solution supply nozzle 80 and the solvent supply nozzle 70 are supported by a support member 104 spanned between both shafts 105. The supply of the resist solution to the resist solution supply nozzle 80 is performed via a resist solution supply tube 81, and the supply of the solvent to the solvent supply nozzle 70 is performed via a solvent supply tube 71. A pair of guide members 1 for guiding each shaft 105 is provided outside the rotating cup 42.
06 is provided. A pair of pulleys 109 are attached to the outside of each guide member 106, respectively.
A belt 107 is wound around the pulley 109. A shaft 105 is attached to the belt 107, and one pulley is attached to a shaft of a motor 108. Accordingly, the rotation of the motor 108 causes the pair of shafts 105 to move along the direction of the arrow H by the belt drive while being guided by the guide rails 106, respectively.
The resist liquid supply nozzle 80 and the solvent supply nozzle 70 supported by the nozzles are movable along the arrow H direction.
When the resist liquid is not applied, the resist liquid supply nozzle 80 is moved to a retreat position shown by a two-dot chain line separated from the substrate G. As described above, the movement trajectory of the resist liquid supply nozzle 80 may be either the arc shape shown in FIG. 3 or the linear shape shown in FIG.

In the present embodiment, as described below, when the resist liquid supply nozzle 80 is moving on the substrate G, the discharge of the resist liquid from the resist liquid supply nozzle 80, its discharge speed, One or more of the movement of the resist solution supply nozzle 80, the movement speed thereof, the rotation of the substrate G, and the rotation speed thereof are appropriately controlled.

FIG. 5 shows this control system. As shown in this figure, a unit controller 110 provided for controlling the resist coating unit (CT) 22 includes a motor 89 capable of controlling the position and speed for driving the nozzle moving mechanism 100 and the bellows pump 87. (For example, a stepping motor) and a drive motor 51 for rotating the substrate G are connected. The movement of the nozzle, the discharge of the resist, and the rotation of the substrate are controlled by the unit controller 110.

The nozzle moving mechanism 100 for moving the resist solution supply nozzle 80 has a built-in motor whose position and speed can be controlled, for example, a stepping motor. The driving motor 51 for rotating the substrate G is also provided. A motor whose position and speed can be controlled, for example, a stepping motor is used. Accordingly, when the resist liquid supply nozzle 80 is moved on the substrate G, the nozzle 80 is moved by the nozzle moving mechanism 100 while accurately controlling the position and speed thereof based on the pulse signal from the unit controller 110. be able to.

When discharging the resist solution from the resist solution supply nozzle 80, the unit controller 110
The bellows pump 87 is driven by the motor 89 on the basis of the pulse signal from the CPU, whereby the discharge amount or discharge speed of the resist liquid can be accurately controlled.

Further, when the substrate G is rotated, the substrate G can be rotated by the drive motor 51 while controlling the position and speed of the substrate G accurately based on the pulse signal from the unit controller 110.

In accordance with the position of the resist solution supply nozzle 80, the discharge of the resist solution, its discharge speed, the nozzle 80
When controlling one or more of the movement of the resist, the movement speed thereof, the rotation of the substrate G, and the rotation speed thereof, a position pulse signal of the resist solution supply nozzle 80 is input from the nozzle movement mechanism 100 to the unit controller 110. , The unit controller 110 calculates the pulse signals of the nozzle moving mechanism 100, the motor 89, and the driving motor 51 corresponding to the position of the nozzle 80, and transmits the calculated signals to the nozzle moving mechanism 100, the motor 89, and the driving motor 51. Is controlled based on this pulse signal. At this time, a feedback pulse signal is transmitted from the nozzle moving mechanism 100, the motor 89, and the drive motor 51 to the unit controller 110 to perform feedback control.

Next, a coating operation for coating a resist solution on the surface of the substrate G by the resist coating unit (CT) 22 configured as described above will be described. First, the lid 46 of the rotating cup 42 is opened, the substrate G is transported onto the stationary spin chuck 40 by a transport arm (not shown), and the substrate G is held on the spin chuck 40 by vacuum suction.

In this state, the spin chuck 40 is driven to rotate, and the substrate G is rotated at a lower speed than the steady rotation during processing (for example, 100 to 600 rpm, acceleration: 300 to 500 rpm).
m / sec), and simultaneously, the rotating cup 42 is rotated at the same speed. During this rotation, the solvent is supplied from the solvent supply nozzle 70 of the spout 90, which is gripped by the support member 101 by the moving mechanism 100 and moved above the center of the substrate G, onto the substrate surface as a solvent A of the coating liquid, for example, ethyl cellosolve acetate (ECA). For example, supply 26.7cc (for example, dripping)
I do. Alternatively, the solvent A may be dropped while the substrate G is stationary without being rotated, and then the substrate A may be rotated.

After supplying the solvent A in this manner, the nozzle moving mechanism 100 rotates the support member 101 in, for example, the direction of arrow E in FIG. The resist liquid is discharged from the liquid supply nozzle 80 toward the substrate G to form a resist film on the entire surface of the substrate G. Further, as shown in FIG. 4, the resist liquid may be discharged while the resist liquid supply nozzle 80 is moved linearly.

In this embodiment, when the resist liquid supply nozzle 80 is moving on the substrate G, the resist liquid is discharged from the resist liquid supply nozzle 80, the discharge speed, the movement of the resist liquid supply nozzle 80, Its moving speed, substrate G
, And one or more of the rotation speeds thereof are appropriately controlled so that the thickness of the resist film can be made uniform or the amount of the resist used can be reduced.

The details are as follows. (1) Discharge or discharge speed of the resist liquid from the resist liquid supply nozzle Regarding the discharge of the resist liquid, (a) when the resist liquid supply nozzle 80 is moving on the substrate G, the pulse signal from the unit controller 110 Based on the motor 89
Is controlled to drive the bellows pump 87 continuously to discharge the resist solution, or (b) the motor 89 is controlled based on the position pulse signal of the resist solution supply nozzle 80 to control the bellows pump 87. Drive, which
According to the position of the resist liquid supply nozzle 80 on the substrate G,
The discharge of the resist solution is interrupted.

Further, regarding the discharge speed of the resist solution, (a) when the resist solution supply nozzle 80 is moving on the substrate G, the motor 89 is controlled based on the pulse signal from the unit controller 110 to control the bellows. The bellows pump 87 is driven by driving the pump 87 to maintain the discharge speed of the resist liquid substantially constant, or (b) controlling the motor 89 based on the position pulse signal of the resist liquid supply nozzle 80. The discharge speed of the resist liquid is changed according to the position of the resist liquid supply nozzle 80 on the substrate.

Thus, for example, when the resist liquid supply nozzle 80 is moving, when the nozzle 80 is located at the center of the substrate G, the resist liquid is discharged, and the nozzle 80 is moved to the center of the substrate G. When the nozzle 80 approaches the periphery of the substrate G, the discharge of the resist solution can be stopped, and then the resist solution can be discharged again as the nozzle 80 approaches the periphery of the substrate G, thereby reducing the amount of the resist solution used. Can be planned. Further, the uniformity of the resist film can be improved by changing the discharge speed.

In other words, by controlling the discharge of the resist liquid from the resist liquid supply nozzle 80 or the discharge speed, or both of them, the thickness of the resist film can be made uniform and the amount of the resist liquid can be reduced.

(2) Movement or moving speed of resist solution supply nozzle Regarding movement of the resist solution supply nozzle 80, (a) when the resist solution supply nozzle 80 is moved on the substrate G,
The nozzle moving mechanism 100 is controlled based on a pulse signal from the unit controller 110 to continuously move the resist solution supply nozzle 80, or (b) based on a position pulse signal of the resist solution supply nozzle 80. By controlling the nozzle moving mechanism 100, the movement of the resist solution supply nozzle 80 is interrupted according to the position of the resist solution supply nozzle 80 on the substrate G.

Further, regarding the moving speed of the resist liquid supply nozzle 80, (a) when the resist liquid supply nozzle 80 is moving on the substrate G, the unit controller 110
Controlling the nozzle moving mechanism 100 based on the control signal from the controller to keep the moving speed substantially constant, or (b)
The nozzle moving mechanism 100 is controlled based on the position signal of the resist solution supply nozzle 80, and the resist solution supply nozzle 80 is controlled.
The moving speed is changed according to the position on the substrate.

Thus, for example, the movement of the nozzle 80 and / or the movement speed thereof can be controlled so that the amount of the resist liquid discharged per unit area of the substrate G becomes substantially equal. And the amount of the resist solution can be reduced.

(3) Rotation or Rotation Speed of Substrate The rotation of the substrate G is based on a pulse signal from the unit controller 110 when the resist liquid is ejected while moving the resist liquid supply nozzle 80 over the substrate G. By controlling the drive motor 51, the substrate G is stopped or the substrate G is rotated.

Further, regarding the rotation speed of the substrate G,
(A) When discharging the resist liquid while moving the resist liquid supply nozzle 80 on the substrate G, the drive motor 5 is driven based on a position pulse signal from the unit controller 110.
1 to maintain the rotation speed of the substrate G substantially constant, or (b) controlling the drive motor 51 based on the position pulse signal of the resist solution supply nozzle 80 to control the substrate G
Is changed in accordance with the position of the resist solution supply nozzle 80 on the substrate.

Thus, for example, the rotation and / or the rotation speed of the substrate G can be controlled so that the amount of the resist solution discharged per unit area of the substrate G becomes substantially equal. And the amount of the resist solution can be reduced.

Although not shown, the substrate G may be moved (for example, moved linearly or rocked) instead of rotating the substrate G. Again, in this case,
Similarly, when discharging the resist liquid while moving the resist liquid supply nozzle 80 on the substrate G, it is possible to control the substrate G to be stationary or to move the substrate G. The moving speed of the substrate G can be maintained substantially constant, or the moving speed can be changed according to the position of the resist solution supply nozzle 80 on the substrate.

After the resist solution is supplied as described above, the supply of the resist solution is stopped, the resist solution supply nozzle 80 is moved to the standby position, and the lid 46 is moved by the robot arm 50 to the upper opening of the rotary cup 42. The substrate G is sealed in the rotating cup 42 by closing the substrate 42a.

Thus, the opening 4 of the rotating cup 42
The spin chuck 40 and the rotary cup 42 are rotated (for example, 1350r) while the lid 2a is closed and closed by the lid 46.
pm, acceleration: 500 rpm / sec) to adjust the thickness of the resist film.

After the coating process is completed, the spin chuck 4
After stopping the rotation of the rotation cup 42 and the rotating cup 42, the lid 46 is moved to the standby position by the robot arm 50,
The substrate G is taken out by the transfer arm (not shown), and the coating operation is completed.

Note that the present invention is not limited to the above embodiment, and various modifications are possible. For example, in the above-described embodiment, an example in which the present invention is applied to a resist coating unit and a resist liquid is used as a coating liquid has been described. However, the present invention is applied to a developing unit, and a developing liquid may be used as a coating liquid. The same effect as described above can be obtained, and the present invention can be applied to other coating liquids. Further, in the above embodiment, the case where the LCD substrate is used as the object to be processed has been described. However, the present invention is not limited to this, and the present invention can be applied to the formation of a coating film on another substrate such as a semiconductor wafer.

[0073]

As described above, according to the present invention,
Since the coating liquid supply nozzle discharges the coating liquid from the coating liquid supply nozzle to the surface of the substrate while moving the coating liquid supply nozzle on the substrate, compared to the conventional case where the coating liquid supply nozzle is discharged while the coating liquid supply nozzle is stationary. The thickness of the coating film can be made uniform. That is, for example, by moving the application liquid supply nozzle,
Since the coating liquid can be discharged also to the periphery of the substrate,
Drying of the coating solution at the peripheral portion can be prevented, and the thickness of the coating film at the central portion and the peripheral portion of the substrate can be made substantially the same. Also, instead of discharging a large amount of coating liquid only to the center of the substrate as in the case where the coating liquid supply nozzle is stationary, the coating liquid supply nozzle is moved from the center to the peripheral edge of the substrate while moving the nozzle. Since the coating liquid can be discharged gradually, the amount of the coating liquid scattered from the substrate due to centrifugal force can be reduced during rotation of the substrate in a later process, and the amount of the coating liquid used can be reduced as much as possible. it can.

[Brief description of the drawings]

FIG. 1 is a plan view showing a resist coating and developing system to which the present invention is applied.

FIG. 2 is a cross-sectional view illustrating a resist coating unit as a coating device applied to the implementation of the coating liquid forming method of the present invention.

FIG. 3 is a perspective view showing a moving mechanism of a resist liquid supply nozzle in the resist coating unit of FIG. 2;

FIG. 4 is a perspective view showing a moving mechanism of another resist liquid supply nozzle in which the resist liquid supply nozzle moves linearly.

FIG. 5 is a block diagram showing a control system of the resist coating unit shown in FIG. 2;

[Explanation of symbols]

 Reference numeral 22: resist coating unit 40: spin chuck (film regulating means, substrate driving means) 41: processing chamber 51: drive motor (film regulating means, substrate driving means) 70: solvent supply nozzle 80: resist liquid supply nozzle (coating liquid supply) Nozzle) 87 Bellows pump (discharge means) 90 Spout head 100 Nozzle moving mechanism (nozzle moving means) 110 Unit controller G LCD board

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G03F 7/16 502 G03F 7/16 502 H01L 21/027 H01L 21/30 564C F-term (reference) 2H025 AA00 AB16 AB17 EA05 4D075 AC64 AC84 AC92 AC94 DA06 DC21 DC22 4F041 AA06 AB01 BA05 BA12 BA21 BA34 BA56 4F042 AA06 AA07 BA04 BA05 BA08 BA12 EB18 EB29 5F046 CD01 CD06 JA02 JA03 JA05 JA06 JA08 JA10 JA24 LA04 LA06 LA07

Claims (14)

[Claims] 1. A coating film forming method for forming a coating film by supplying a coating liquid from a coating liquid supply nozzle on a surface of a substrate housed in a processing container, comprising: Forming a coating film by discharging a coating liquid from the coating liquid supply nozzle onto the surface of the substrate while moving the coating film; and adjusting the film thickness of the coating film. Forming method. 2. When the application liquid supply nozzle is moving on the substrate, the application liquid is continuously discharged from the application liquid supply nozzle, or the application liquid is supplied to the position of the application liquid supply nozzle on the substrate. 2. The method according to claim 1, wherein the discharge is interrupted accordingly. 3. When the coating liquid supply nozzle is moving on a substrate, the discharge speed of the coating liquid from the coating liquid supply nozzle is maintained substantially constant, or the coating liquid supply nozzle The method according to claim 1, wherein the discharge speed is changed according to the position. 4. The method according to claim 1, wherein the movement of the application liquid supply nozzle is continuously performed, or the movement is interrupted in accordance with the position of the application liquid supply nozzle on the substrate. The method for forming a coating film according to claim 1. 5. When the application liquid supply nozzle is moving on the substrate, the moving speed of the application liquid supply nozzle is maintained substantially constant, or according to the position of the application liquid supply nozzle on the substrate. The method according to any one of claims 1 to 4, wherein the moving speed is changed. 6. The substrate according to claim 1, wherein the substrate is stopped or moved or rotated while the coating liquid supply nozzle is discharging the coating liquid while moving on the substrate. The method for forming a coating film according to any one of the above items. 7. The moving speed or the rotating speed of the substrate is maintained substantially constant, or the moving speed or the rotating speed is changed according to the position of the coating liquid supply nozzle on the substrate. 7. The method for forming a coating film according to item 6. 8. A coating apparatus for forming a coating film by supplying a coating liquid onto a surface of a substrate housed in a processing container, comprising: a coating liquid supply mechanism for supplying the coating liquid; A coating liquid supply nozzle for discharging the coating liquid onto the surface of the substrate, a nozzle moving mechanism for moving the coating liquid supply nozzle on the substrate, and a control means for controlling the coating liquid supply system and the nozzle moving mechanism And a film adjusting mechanism for adjusting the thickness of the coating film. 9. The control device according to claim 1, wherein the application liquid supply nozzle is continuously ejected from the application liquid supply nozzle when the application liquid supply nozzle is moving on the substrate by the nozzle moving mechanism. The coating apparatus according to claim 8, wherein the coating liquid supply mechanism is controlled so as to interrupt the discharge of the coating liquid in accordance with a position of the liquid supply nozzle on the substrate. 10. The control means according to claim 1, wherein said nozzle moving mechanism keeps the discharge speed of the coating liquid from the coating liquid supply nozzle substantially constant when the coating liquid supply nozzle is moving on the substrate. The coating apparatus according to claim 8, wherein the coating liquid supply mechanism is controlled such that a discharge speed changes according to a position of the coating liquid supply nozzle on the substrate. 11. The control means, when moving the coating liquid supply nozzle on the substrate, continuously moves the coating liquid supply nozzle, or moves the coating liquid supply nozzle to a position on the substrate. The coating apparatus according to any one of claims 8 to 10, wherein the nozzle moving mechanism is controlled so that the movement is interrupted in response. 12. The control device according to claim 11, wherein the moving speed of the application liquid supply nozzle is maintained substantially constant when the application liquid supply nozzle is moved on the substrate by the nozzle moving device, The coating apparatus according to any one of claims 8 to 11, wherein the coating liquid supply nozzle is controlled so as to be changed according to a position on the substrate. 13. The apparatus further comprising a substrate driving mechanism for moving or rotating the substrate, wherein the control unit is configured to discharge the application liquid while the application liquid supply nozzle is being moved on the substrate by the nozzle moving unit. Resting the substrate, or
The coating apparatus according to any one of claims 8 to 12, wherein the coating apparatus is controlled to move or rotate the substrate. 14. When the application liquid supply nozzle is discharging the application liquid while moving on the substrate by the nozzle moving means, the control means keeps the moving speed or the rotation speed of the substrate substantially constant. 14. The coating apparatus according to claim 13, wherein the substrate driving mechanism is controlled to change the position of the coating liquid supply nozzle on the substrate.