JPH11207250A - Film forming method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a uniform resist film on an LCD substrate while suppressing scattering of a treatment solution. SOLUTION: While an LCD substrate is rotated by a spin chuck 32, a solvent is fed to a position shifted from a center of the LCD substrate G through a solvent feed nozzle 91. Then, after quantity of the solvent on the LCD substrate G is reduced, in the condition wherein rotation of the LCD substrate G is stopped, a resist solution is fed to the center of the LCD substrate G from a resist solution feed nozzle 92. Further, a rotary cup 55 is closed by a lid 71 before the resist solution is diffused on the LCD substrate G so as to form a resist film while the LCD substrate G is being rotated at a higher speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming method for forming a film such as a resist film on a substrate such as an LCD substrate or on a layer formed on the substrate.

[0002]

2. Description of the Related Art As is well known, in the field of semiconductor manufacturing technology, semiconductor layers, insulator layers,
When an electrode layer is selectively etched into a predetermined pattern, a resist film is formed on the surface of an LCD substrate as in the case of a semiconductor wafer.

In forming such a resist film,
For example, a rectangular LCD substrate is held on a rotatable spin chuck in a processing chamber, a resist solution is dropped on the center of the upper surface of the LCD substrate, and the LCD substrate is rotated, and the resist solution is rotated by centrifugal force. There is known a method for diffusing the nucleus. In this case, to improve the film thickness uniformity,
Application by a closed cup rotation method is a general method.

[0004]

However, in this method, the solvent in the resist liquid evaporates in the process of diffusing the resist liquid from the center position of the LCD substrate toward the periphery. As a result, the viscosity of the resist liquid differs on the LCD substrate depending on the direction in which the resist liquid diffuses, and the thickness of the formed resist film may be different between the central portion and the peripheral portion of the LCD substrate.

The present invention has been made in view of the above circumstances, and has as its object to provide a new film forming method capable of uniformly forming a film with a processing solution on a substrate. Another object of the present invention is to provide a new film forming method capable of suppressing the scattering of the processing liquid.

[0006]

According to a first aspect of the present invention, there is provided a method for forming a film, comprising supplying a processing liquid onto a substrate and diffusing the processing liquid by rotating the substrate. In the method of forming a film of the processing solution on a substrate,
Supplying the solvent of the processing solution to a position shifted from the center of the substrate,
Rotating the substrate to diffuse the solvent onto the substrate; thereafter, supplying the processing liquid to the center of the substrate with the substrate stopped; and then rotating the substrate to deposit the processing liquid on the substrate. And a step of diffusing.

According to this method, the solvent of the processing liquid is applied onto the substrate before the step of supplying the processing liquid onto the substrate. Therefore, the processing liquid can be diffused to the periphery of the substrate, and a film having a uniform thickness can be formed on the substrate by the processing liquid. In addition, since the rotation of the substrate is stopped when the processing liquid is supplied to the substrate, the scattering of the processing liquid during the supply can be prevented. For this reason, generation of particles can be effectively suppressed. In addition, the solvent of the processing liquid is well compatible with the processing liquid, and when the processing liquid supplied to the substrate comes into contact with the processing liquid, the solvent can smoothly move on the substrate without repelling the processing liquid. When the processing liquid is, for example, a resist liquid, it is thinner, and when the processing liquid is, for example, a developing liquid, it is water.

According to a second aspect of the present invention, there is provided a method of forming a film of a processing liquid on a substrate by supplying a processing liquid onto a substrate, diffusing the processing liquid by rotating the substrate, and forming a film of the processing liquid on the substrate. Supplying the solvent of the processing liquid to a position deviated from the center of the substrate, rotating the substrate to diffuse the solvent on the substrate, and thereafter reducing the amount of the solvent on the substrate; And a step of supplying the processing liquid to the center of the substrate with the substrate stopped, and thereafter, a step of rotating the substrate to diffuse the processing liquid onto the substrate.

According to this method, since the rotation of the substrate is stopped when the processing liquid is supplied to the substrate, it is possible to prevent scattering during the supply. Further, since the solvent is applied to the substrate before supplying the processing liquid to the substrate, the processing liquid spreads to the peripheral portion of the substrate, and a uniform film can be formed on the substrate. Further, since the supply of the solvent of the processing liquid to the central portion of the substrate becomes unnecessary, the solvent of the processing liquid to be used can be reduced. In addition, since the amount of solvent on the substrate is reduced before the processing liquid is supplied, the range of scattering due to the processing liquid coming into contact with the solvent of the processing liquid can be reduced, and the amount of scattering processing liquid can be reduced. In addition, the processing liquid can be smoothly diffused to the periphery of the substrate. Therefore, the processing liquid smoothly moves on the solvent, and an appropriate film of the processing liquid can be formed. In order to reduce the amount of the solvent on the substrate, for example, it is suggested that the solvent on the substrate is shaken off to some extent by rotating the substrate, or the solvent is slightly dried.

According to a third aspect of the present invention, there is provided a method for forming a film, comprising: a rotary mounting table for rotating a substrate; a processing container accommodating the rotary mounting table and having an opening on the upper surface through which the substrate can pass; In a method of forming a film of a processing liquid on a substrate using a film forming apparatus having a lid capable of closing an opening,
A step of supplying a solvent of a processing liquid to a position deviated from the center of the substrate with the lid opened, and rotating the substrate to diffuse the solvent onto the substrate; and thereafter, in a state where the substrate is stopped. Supplying the processing liquid to the center of the substrate, and then
Rotating the substrate with the lid closed and diffusing the processing liquid onto the substrate.

According to this method, the solvent of the processing liquid is applied to the substrate before the step of supplying the processing liquid to the substrate. Therefore, the processing liquid can be diffused to the peripheral part of the substrate by the rotation of the substrate, and a film having a uniform thickness can be formed on the substrate by the processing liquid.
Further, since the processing liquid is supplied onto the stopped substrate, when the processing liquid is supplied to the substrate, scattering of the processing liquid can be prevented. Further, when the processing liquid supplied on the substrate is diffused, the processing liquid on the substrate does not scatter outside because the lid is closed. Therefore, it is possible to prevent the outside of the processing container from being contaminated by the scattered processing liquid.

According to a fourth aspect of the present invention, there is provided a method for forming a film, comprising: a rotary mounting table for rotating a substrate; a processing container accommodating the rotary mounting table and having an opening formed on the upper surface through which the substrate can pass; In a method of forming a film of a processing liquid on a substrate using a film forming apparatus having a lid capable of closing an opening,
With the lid open, supplying a solvent of the processing liquid to a position deviated from the center of the substrate, rotating the substrate and diffusing the solvent onto the substrate, and then measuring the amount of the solvent on the substrate. The process of reducing, the process of supplying the processing liquid to the center of the substrate while the substrate is stopped, and the process of rotating the substrate with the lid closed and diffusing the processing liquid onto the substrate are then performed. It is characterized by having.

According to this method, since the processing liquid is supplied onto the stopped substrate, the processing liquid can be prevented from scattering when the processing liquid is supplied to the substrate. Further, when the processing liquid supplied onto the substrate is diffused by rotation of the substrate, the processing is performed with the lid closed, so that the processing liquid scattered from the substrate does not scatter outside the processing container. Further, in order to supply the processing liquid to the center of the substrate after reducing the amount of the solvent on the substrate by, for example, drying, the processing liquid is appropriately and uniformly diffused to the substrate by the subsequent rotation of the substrate. It becomes possible.
In order to reduce the amount of the solvent on the substrate, for example, it is suggested that the solvent on the substrate is shaken off to some extent by rotating the substrate, or the solvent is slightly dried.

Further, the solvent of the processing liquid used in the film forming method according to the first, second, third or fourth aspect of the invention is supplied annularly around the center of the substrate as in the fifth aspect of the invention. Alternatively, the power may be supplied to the entire peripheral portion of the substrate as in the sixth aspect of the present invention.

[0015] Even in such a configuration, the solvent is applied to the substrate before the processing liquid is supplied to the substrate as in the case of the first to fourth aspects of the present invention. The processing liquid spreads to the portion, and it is possible to form a uniform film of the processing liquid on the substrate. Further, since the supply of the solvent of the processing liquid to the central portion of the substrate becomes unnecessary, the solvent of the processing liquid to be used can be reduced.

According to a seventh aspect of the present invention, in the method of forming a film of the processing liquid on the substrate, the processing liquid is supplied onto the substrate, and the processing liquid is diffused by rotating the substrate. Supplying the processing liquid solvent to a position deviated from the substrate center and supplying the processing liquid to the center of the substrate; and then rotating the substrate to diffuse the processing liquid and the processing liquid solvent onto the substrate. And a step of causing

According to this method, the processing liquid and the solvent of the processing liquid are simultaneously supplied to the substrate.
The processing time of the substrate can be reduced as compared with the case where the processing liquid and the solvent of the processing liquid are separately supplied to the substrate as in the invention described in (1). Therefore, it is possible to improve the throughput.

[0018] In the film forming method according to the present invention, there is provided a process container having a rotary mounting table for rotating a substrate, an opening on the upper surface for accommodating the rotary mounting table and through which the substrate can pass. In a method of forming a film of a processing liquid on a substrate using a film forming apparatus having a lid capable of closing an opening,
A step of supplying the solvent of the processing liquid to a position deviated from the center of the substrate while supplying the processing liquid to the center of the substrate with the lid opened, and then rotating the substrate with the lid closed. And a step of diffusing the processing liquid and the solvent of the processing liquid onto the substrate.

According to this method, since the processing liquid and the solvent of the processing liquid are simultaneously supplied to the substrate, the throughput can be improved as compared with the case where these are separately supplied. The processing liquid and the solvent of the processing liquid supplied onto the substrate are diffused on the substrate with the lid closed. Therefore, the processing liquid and the solvent of the processing liquid do not scatter due to the rotation of the substrate, and it is possible to prevent contamination of the processing container outside.

According to a seventh aspect of the present invention, as in the ninth aspect of the present invention, the solvent of the processing solution is supplied in a ring around the center of the substrate, and the processing solution is applied to the center of the substrate. Alternatively, the solvent of the processing liquid may be supplied to the entire peripheral portion of the substrate and the processing liquid may be supplied to the center of the substrate.

In this case, as in the case of the fifth and sixth aspects of the present invention, since the solvent is applied to the substrate before the processing liquid is supplied to the substrate, the processing is performed to the peripheral portion of the substrate. The liquid spreads, and it is possible to form a uniform film on the substrate with the processing liquid. Since the supply of the solvent of the processing liquid to the central portion of the substrate becomes unnecessary, the solvent of the processing liquid to be used can be reduced. Further, in order to simultaneously supply the processing liquid and the solvent of the processing liquid to the substrate, the processing liquid may be supplied to the substrate.
As in the case of the invention described above, it is possible to improve the throughput as compared with the case where these are supplied separately.

[0022]

Embodiments of the present invention will be described below with reference to the accompanying drawings. This embodiment is embodied as a method for forming a resist film by supplying a resist solution to an LCD substrate. Figure 1
1 shows an overview of a coating and developing apparatus that incorporates a coating film forming apparatus for performing this method of forming a resist film and performs a series of photolithography steps.

The coating and developing apparatus 1 includes, for example, a loader unit 2 for loading and unloading a rectangular LCD substrate G, and an LCD.
A first processing unit 3 for processing the substrate G, and a second processing unit 5 connected to the first processing unit 3 via the interface unit 4
Between the second processing unit 5 and, for example, the exposure apparatus 6 or the like.
It comprises an interface section 7 for exchanging the CD substrate G.

The loader unit 2 includes a cassette station 1
The cassette station 10 has a plurality of cassettes 11 for storing unprocessed LCD substrates G and a plurality of cassettes 12 for storing processed LCD substrates G. The loader unit 2 is provided with a loading / unloading tweezers 13 for loading or unloading an unprocessed LCD substrate G. The loading / unloading tweezers 13 is configured to be movable in the Y and Z directions and rotatable in the θ direction.

The first processing unit 3 includes various processing apparatuses for performing predetermined processing on the LCD substrate G, and includes the main transfer arm 1.
5 are arranged on both sides of the conveyance path 16. That is,
A brush scrubber 17 for cleaning the LCD substrate G taken out of the cassette 11, an adhesion device 18 for applying a hydrophobic treatment to the LCD substrate G, a cooling device 19 for cooling the LCD substrate G to a predetermined temperature, and a developing device 20 Is arranged.

The second processing section 5 includes a plurality of heating processing devices 21 for heating the LCD substrate G to a predetermined temperature,
Coating film forming apparatus 2 for applying a resist solution to the surface of substrate G
2 and a peripheral edge removing device 23 for removing an unnecessary resist film applied to the peripheral edge of the LCD substrate G are disposed on both sides of the transport path 26 of the main transport arm 25.

As shown in FIG. 2, the coating film forming apparatus 22 is provided with a spin chuck 32 for vacuum-holding and holding the horizontal LCD substrate G. The lower part of the spin chuck 32 is connected to a rotary shaft 43 connected to a lifting cylinder 42 via a vacuum seal part 40.
The rotating shaft 43 is configured to be slidable on a spline bearing 44.

Further, a driven pulley 50a is mounted on the spline bearing 44, and a driven pulley 51 mounted on a driving shaft 51a of a driving motor 51 is mounted on the driven pulley 50a.
A belt 52a is stretched between the belt 52b and b. Therefore,
The spin chuck 32 is configured to be able to rotate in the horizontal direction by operation of the drive motor 51.
The rotating shaft 43 is formed so as to be movable in the vertical direction by the operation of the lifting cylinder 42. Therefore, the spin chuck 32 is configured to be movable in the vertical direction by the operation of the lifting cylinder 42.

The coating film forming apparatus 22 is provided with a rotating cup 55 so as to surround the upper part and the outer peripheral part of the spin chuck 32. Inside the rotating cup 55, a processing chamber 56 for processing the LCD substrate G is formed.
An opening is formed in the center of the lower surface 55b of the rotating cup 55. The spin chuck 32 is inserted into the processing chamber 56 from this opening.

In the lower part of the rotary cup 55, the lower surface 55 b of the rotary cup 55 is
The rotating outer cylinder 61b is connected to a fixed collar 63 via a bearing 62b. The fixed collar 63 is connected to a rotating inner cylinder 65a via a bearing 64, and the rotating shaft 43 is connected to the rotating inner cylinder 65a via a spline bearing 44. A labyrinth seal portion (not shown) is formed on the opposing surface of the fixed collar 63 and the rotating inner cylinder 65a and on the opposing surface of the fixed collar 63 and the rotating outer cylinder 61b. Thus, the rotary cup 55 is configured so that contaminants generated from the lower drive system do not enter the inside of the rotary cup 55.

A driven pulley 66 is attached to the rotary outer cylinder 61b.
b is attached. This driven pulley 66b is a belt 6
7b, it is connected to the drive pulley 51b of the drive motor 51. Therefore, similarly to the case of the spin chuck 32, the rotating cup 55 is also configured to rotate in the horizontal direction by operating the drive motor 51. Since the diameter of the driven pulley 50a contributing to the rotation of the spin chuck 32 and the diameter of the driven pulley 66b contributing to the rotation of the rotating cup 55 are equal to each other, the spin chuck 32 and the rotating cup rotated by the same drive motor 51 are used. 55 are configured to rotate at the same rotational speed as each other.

As shown in FIG. 3, a fixing pin 70a projecting in the vertical direction is provided on the upper surface of the rotating cup 55. The fixing pin 70a is connected to the opening 55 of the rotating cup 55.
a is fitted to a fitting recess 71b provided in a lid 71 which can be opened and closed so as to be openable and closable. Therefore, the rotating cup 55 is configured to be closed by the lid 71 by fitting the fixing pin 70a and the fitting recess 71b to each other. Also, the fixing pin 70
The top of a is formed in a spherical shape, and is configured to suppress dust generation due to contact with the fitting recess 71b.

On the upper surface of the lid 71, an air supply hole 72 is provided, and a projecting support portion 73 is formed. The support portion 73 is provided with a plurality of locking grooves 73a.
A locking pin (not shown) projecting from a robot arm 75 which is a lid moving means for attaching and detaching the lid 71 to and from a.

The side wall of the rotary cup 55 is formed as a tapered surface whose inner surface is tapered upward. Therefore, when air is supplied into the processing chamber 56 from the air supply hole 72 provided in the lid 71, this air flows along the tapered surface of the upper surface and is provided at an appropriate position in the circumferential direction below the side wall of the rotating cup 55. The exhaust port 76 is configured to be exhausted.

On the other hand, a hollow ring-shaped drain cup 80 is disposed around the rotary cup 55 to receive the waste discharged from the rotary cup 55. An annular passage 80a is provided inside the drain cup 80. The annular passage 80a is detoured by a wall 80b rising from the bottom of the drain cup 80 and a wall 80c hanging from the ceiling of the drain cup 80, and a bottom portion located between the wall 80b and the wall 80c. Are provided with drain holes 80d at appropriate intervals in the circumferential direction. The walls 80b and 80c are provided for the purpose of gas-liquid separation by inertial collision in which gas mist or the like entering the drain cup 80 collides with the walls 80b and 80c to liquefy.

An exhaust device (not shown) is provided at an appropriate location (for example, four locations in the circumferential direction) on the outer peripheral wall of the annular passage 80a.
Is provided with an exhaust port 81 connected to the exhaust port 81. Therefore, LC
Mist generated during the rotation processing of the D substrate G
Flows into the drain cup 80 through the annular passage 80
It is configured to be exhausted to the outside from the exhaust port 81 through a.

The coating film forming apparatus 22 is provided with a processing liquid supply mechanism for supplying a processing liquid such as a resist liquid to the LCD substrate G, as shown in FIG. As shown in FIGS. 5 and 6, the processing liquid supply mechanism 90 supplies a solvent supply nozzle 91 for supplying a solvent (hereinafter, referred to as a “solvent”) A of the resist liquid to the LCD substrate G, And a resist liquid supply nozzle 92 for supplying.

The solvent supply nozzle 91 and the resist solution supply nozzle 92 are both connected to the rotation arm 105 connected to the rotation mechanism 105.
06. The rotation of the rotation arm 105 by driving the rotation mechanism 105 allows the rotation arm 106 to rotate freely in the θ direction indicated by the reciprocating arrow in FIG. 4 between the standby position and the position above the LCD substrate G.

The solvent supply nozzle 91 is connected to a solvent supply tube 95 through which the solvent A flows, and the solvent supply tube 95 is connected to the solvent supply tank 9 via an opening / closing valve 96.
7 is connected. A gas supply source (not shown) is connected to the solvent supply tank 97 via a supply pipe 98, so that a carrier gas is supplied into the solvent supply tank 97. By changing the pressure of the carrier gas supplied into the solvent supply tank 97 by an appropriate pressure means (not shown), the amount of the solvent A supplied to the LCD substrate G can be controlled. Have been.

The resist liquid supply nozzle 92 has substantially the same configuration as the solvent supply nozzle 91. That is, the resist solution supply nozzle 92 is connected to a resist solution supply tube 99 in which the resist solution B flows, and the resist solution supply tube 99 is connected to the resist solution tank 101 via the opening / closing valve 100. A gas supply source (not shown) is connected to the resist liquid tank 101 through a supply pipe 102, and is configured such that a carrier gas such as a nitrogen gas is supplied into the resist liquid tank 101. . Further, by controlling the pressure of the carrier gas supplied into the resist liquid tank 101 by an appropriate pressure means (not shown), the amount of the resist liquid B supplied to the LCD substrate G can be controlled. Is configured.

The temperature of the solvent A flowing in the solvent supply tube 95 and the temperature of the resist solution B flowing in the resist solution supply tube 99 are set to predetermined temperatures by the temperature adjusting mechanism 110. That is, as shown in FIG. 5, the temperature control mechanism 110 is provided with temperature control liquid supply paths 111 formed so as to surround the solvent supply tube 95 and the resist liquid supply tube 99 respectively. A solvent A and a resist solution B are provided at both ends of the temperature adjusting liquid supply path 111.
Are circulated for respectively circulating. The circulation path 112 is provided with a circulation pump 113 for circulating the temperature adjustment liquid C and a thermo module 114 for maintaining the temperature adjustment liquid C at a constant temperature.

Note that the solvent supply tube 95 and the resist solution supply tube 99 are surrounded by the respective temperature control solution supply passages 111 to the vicinity of the distal end. Therefore, the configuration is such that the solvent A or the resist solution B can be supplied to the LCD substrate G at a suitable temperature of, for example, 23 ° C.

The coating film forming apparatus for performing the method of forming a resist film according to the embodiment of the present invention is configured as described above. Next, the operation and effect of the resist film forming method using the coating film forming apparatus will be described.

The LCD substrate G, which has been subjected to the hydrophobic treatment by the adhesion device 18 of the first processing unit 3 and has been cooled by the cooling processing unit 19, is then transferred to the second processing unit 5 and coated by the main transfer arm 25. It is carried into the film forming apparatus 22. Thereafter, the LCD substrate G carried into the coating film forming apparatus 22 is vacuum-sucked to the spin chuck 32 and rotated at a first rotation speed of, for example, 200 rpm by the rotation of the spin chuck 32. In addition,
Mist generated in the processing chamber 56 when the LCD substrate G is rotated flows into the drain cup 80 and is exhausted to the outside through an exhaust port 81 provided in the drain cup 80. Therefore, the upper side of the rotating cup 55 is not contaminated by the mist that has risen.

During the period from when the LCD substrate G is conveyed to the coating film forming apparatus 22 to when the LCD substrate G is rotated at the first rotation speed, the rotating arm 106 which has been in the standby position by the operation of the rotating mechanism 105 is moved. It rotates to the operating position above the center of G. Next, the solvent A set at a predetermined temperature by the temperature adjusting mechanism 110 from the solvent supply nozzle 91 provided on the rotating arm 106 is applied onto the LCD substrate G rotating at the first rotation speed of 200 rpm for, for example, 2 seconds. Supplied.

At this time, the solvent supply nozzle 9 is
The solvent A supplied from 1 is supplied to a point P at a position shifted from the center point Q of the LCD substrate G as shown in FIG. This point P is, for example, a position substantially corresponding to the vicinity of the outer periphery of the spin chuck 32. When the solvent A is supplied to this point P, as shown by the hatched portion in FIG. And diffuses radially outward of the circle having the radius PQ. Therefore, the solvent A is located at the center of the LCD substrate G.
Is not supplied.

Next, in order to reduce the amount of the solvent A supplied to the LCD substrate G, the LCD substrate G is
Spin for 3 seconds at rpm. Thereafter, the drive of the drive motor 51 is stopped to stop the rotation of the spin chuck 32 and the rotation cup 55, and the LCD substrate G is moved to the spin chuck 3
Stop on 2.

Thereafter, a resist solution B set at a predetermined temperature is supplied from the resist solution supply nozzle 92 onto the LCD substrate G.
Supply. At this time, the resist solution B supplied to the LCD substrate G is supplied to a center point Q which is the center of the LCD substrate G as shown in FIG. The supply amount and the supply time of the resist solution B supplied to the LCD substrate G are, for example, 14 cc, 3
Set each to seconds.

After the supply of the resist solution B to the LCD substrate G is completed, the rotating arm 105 is operated by operating the rotating mechanism 105.
06 retreats from the operating position and returns to the standby position. Thereafter, as shown in FIG. 3, the robot arm 75 is inserted below the support portion 73, and a locking pin (not shown) projecting from the robot arm 75 is engaged with the locking groove 73a of the support portion 73. Thereafter, the robot arm 75 is lowered, and the opening 55 a of the rotating cup 55 is closed with the lid 71.

The opening 55a of the rotating cup 55 is
After closing with the spin chuck 32 and the rotating cup 55
Are rotated at a second rotation speed higher than the first rotation speed. By rotating the LCD substrate G at the second rotation speed, the resist liquid B supplied on the LCD substrate G is diffused, and the thickness of the resist film formed on the LCD substrate G is adjusted. The above process is shown in the flowchart of FIG.

As described above, according to the present embodiment, the LCD
When the resist solution B is supplied to the substrate G, the rotation of the LCD substrate G is stopped. Therefore, the resist liquid B does not scatter outside or around the rotating cup 55. Therefore, generation of particles due to the scattered resist liquid B can be prevented.

In order to supply the resist solution B after supplying the solvent A to the LCD substrate G, the resist solution B
Extends to the corners of the peripheral portion of the LCD substrate G. Therefore, it is possible to form a uniform resist film on the LCD substrate G. Then, the resist solution B is supplied after the solvent A on the LCD substrate G is reduced, so that the solvent A
In this case, the adhesiveness between the resist solution B and the LCD substrate G is not reduced and the amount of the scattered resist solution B can be reduced as compared with the case where the amount of the resist solution B is not reduced.

In order to suppress the scattering of the resist solution B, the resist solution B supplied on the LCD substrate G contributes to the formation of a resist film more efficiently than in the conventional case. It is possible to save the amount of the resist solution B.

The solvent A is supplied to a point P shifted from the center of the LCD substrate G, and the solvent A is not supplied to the center of the LCD substrate G. Accordingly, the amount of the solvent A used can be reduced by the amount that the solvent A is not supplied to the center of the LCD substrate G.

After the resist film having a predetermined thickness is formed on the LCD substrate G as described above, the rotation of the spin chuck 32 and the rotation cup 55 are both stopped, and the opening 55a of the rotation cup 55 is closed. The closed lid 71 is opened. At this time, in the processing chamber 56 of the rotating cup 55, the air introduced from the air supply hole 72 of the lid 71 is exhausted from the exhaust port 76. When opening the body 71, no great force is required.
Therefore, the lid 71 can be easily opened.

Then, the LCD substrate G is transported to the peripheral edge removing device 23 continuously. After the unnecessary resist film around the LCD substrate G is removed by the peripheral edge removing device 23, the heat treatment device 3 is removed by the main transfer arm 25.
Transport to zero.

In the present embodiment, an example has been described in which the solvent A is first supplied to the LCD substrate G, and then the resist solution B is supplied. However, the present invention is not limited to this example, and the solvent A And the resist solution B can be simultaneously supplied to the LCD substrate G.

That is, for the LCD substrate G whose rotation has been stopped, the solvent A is supplied to a point P on the LCD substrate G,
The resist solution B is simultaneously supplied to the point Q on the LCD substrate G, respectively. Then, after the supply of the solvent A and the resist liquid B is completed, the lid 71 may be closed, and then the LCD substrate G may be rotated.

According to this method, since the solvent A and the resist solution B are simultaneously supplied to the LCD substrate G, the processing time is shortened compared to the case where the solvent A and the resist solution B are separately supplied. Can be. Therefore, it is possible to improve the throughput.

According to this method, after the solvent A and the resist solution B are simultaneously supplied to the LCD substrate G,
The D substrate G is being rotated. Therefore, the resist liquid B can be uniformly diffused to the peripheral corners of the LCD substrate G, and the resist film can be formed on the LCD substrate G with a uniform thickness.

Further, in order to supply the solvent A and the resist solution B to the LCD substrate G whose rotation has been stopped, the solvent A
And scattering of the resist solution B to the outside when the resist solution B is supplied. In addition, since the LCD substrate G is rotated after the lid 71 is closed, the resist solution B on the LCD substrate G does not scatter to the outside or the periphery of the rotating cup 55, so that contamination can be prevented.

In this embodiment, the solvent A is supplied to the point P corresponding to the vicinity of the outer periphery of the spin chuck 32, but the present invention is not limited to this example. That is,
If the number of rotations and the rotation time of the LCD substrate are changed in the step of reducing the solvent A, the solvent A can be supplied to a position outside the point P. At this time, if the solvent A is supplied inside the inscribed circle of the LCD substrate G, the loss of the solvent A supplied to the LCD substrate G can be suppressed.

Further, the resist liquid supply nozzle 92 for supplying the resist liquid B to the LCD substrate G has been described as an example, but the E2 nozzle 1 shown in FIG.
It is also possible to use 15.

Further, in the present embodiment, an example has been described in which the solvent A is supplied from the solvent supply nozzle 91 to the point P shifted from the center of the LCD substrate G. However, the present invention is not limited to this. For example, FIG. Using the solvent supply nozzle 116 shown,
It can be proposed to supply the solvent A to the LCD substrate G.

The solvent supply nozzle 116 has an annular flat surface and a solvent discharge port 1 formed on the lower surface.
17 are arranged annularly. Therefore, the solvent A discharged from the solvent discharge port 117 can be supplied annularly to the LCD substrate G. Such a solvent supply nozzle 11
When using No. 6, the solvent A can be supplied annularly around the point Q, which is the center of the LCD substrate G, as shown by oblique lines in FIG.

Further, if a resist solution discharge port (not shown) for discharging the resist solution B is provided at the center of the lower surface of the solvent supply nozzle 116, the solvent A for the LCD substrate G can be formed.
At the same time as the supply of the resist solution B.

In addition, the rotation speed of the spin chuck 32 and the rotation speed of the rotating cup 55 may be appropriately changed by changing the size of the driven pulley 50a and the driven pulley 66b. Furthermore, although an example using an LCD substrate has been described, the present invention is not limited to this example, and can be applied to a case where processing is performed on a semiconductor wafer.

[0068]

According to the first to tenth aspects of the present invention,
After the solvent of the processing liquid is applied to the substrate, the processing liquid diffuses over it, so the processing liquid can be evenly diffused to the periphery of the substrate, and the uniform thickness of the processing liquid on the substrate Can be formed. In addition, when the processing liquid is supplied onto the substrate, the rotation of the substrate is stopped.
It is possible to suppress scattering of the processing liquid from above the substrate. As a result, external contamination can be prevented. In addition, since the solvent of the processing liquid is supplied while being shifted from the center of the substrate, the amount of the solvent of the processing liquid is smaller than in the conventional case.

According to the second and fourth aspects of the present invention,
In order to supply the processing liquid after reducing the solvent of the processing liquid on the substrate, the processing liquid can be suitably applied to the substrate.

According to the third, fourth, and eighth aspects of the present invention,
When the processing liquid is supplied onto the stopped substrate and the processing liquid is diffused by rotating the substrate, the processing liquid does not scatter outside the processing apparatus and is not contaminated because the lid is closed. Therefore, it is possible to suppress a decrease in yield.

Further, according to the present invention, in order to simultaneously supply the processing liquid and the solvent of the processing liquid to the substrate, the processing liquid and the solvent of the processing liquid are separately supplied to the substrate. It is possible to improve the throughput as compared with the case.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an overview of a coating and developing apparatus provided with a coating film forming apparatus for performing a method of forming a resist film according to an embodiment.

FIG. 2 is an explanatory diagram showing an internal configuration of a coating film forming apparatus that performs a method of forming a resist film according to an embodiment.

FIG. 3 is an explanatory view showing a configuration of a rotating cup and a lid of the coating film forming apparatus of FIG. 2;

FIG. 4 is an explanatory view from a plane showing an arrangement of the coating film forming apparatus of FIG. 2;

FIG. 5 is an explanatory diagram showing a configuration of a solvent supply nozzle and a resist liquid supply nozzle of the coating film forming apparatus of FIG. 2;

FIG. 6 is an explanatory diagram showing how the coating film forming apparatus of FIG. 2 supplies a solvent and a resist solution to an LCD substrate.

FIG. 7 is an explanatory view showing a state in which a solvent is supplied from a solvent supply nozzle of FIG. 5 to an LCD substrate.

FIG. 8 is a view showing the liquid crystal display shown in FIG.
FIG. 3 is an explanatory diagram illustrating a state in which a resist solution is supplied to a substrate.

FIG. 9 is a flowchart for explaining a method of forming a resist film according to the embodiment.

FIG. 10 is an explanatory diagram of a modified example of the resist liquid supply nozzle of FIG. 5;

FIG. 11 is an enlarged sectional view showing a solvent supply nozzle capable of supplying a solvent to the LCD substrate in a ring shape.

FIG. 12 is an explanatory diagram showing a state where a solvent is supplied onto an LCD substrate by the solvent supply nozzle of FIG. 11;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 coating / developing apparatus 22 coating film forming apparatus 32 spin chuck 55 rotating cup 71 lid 90 processing liquid supply mechanism 91 solvent supply nozzle 92 resist liquid supply nozzle A solvent B resist liquid C temperature control liquid G LCD substrate

Claims (10)

[Claims] In a method of supplying a processing liquid onto a substrate, diffusing the processing liquid by rotating the substrate, and forming a film of the processing liquid on the substrate, a solvent of the processing liquid is supplied from the center of the substrate. Supplying the solvent to the shifted position, rotating the substrate to diffuse the solvent onto the substrate, and then supplying the processing liquid to the center of the substrate while the substrate is stopped,
And thereafter rotating the substrate to diffuse the treatment liquid onto the substrate. 2. A method of supplying a processing liquid onto a substrate, diffusing the processing liquid by rotating the substrate, and forming a film of the processing liquid on the substrate, wherein a solvent of the processing liquid is removed from the center of the substrate. Supplying the solvent to a displaced position, rotating the substrate and diffusing the solvent onto the substrate, reducing the amount of the solvent on the substrate, and then removing the processing liquid while the substrate is stopped. A method for forming a film, comprising: a step of supplying to a center of a substrate; and thereafter, a step of rotating the substrate to diffuse a processing liquid onto the substrate. 3. A rotary mounting table for rotating a substrate, a processing container accommodating the rotary mounting table and having an opening on a top surface through which the substrate can pass, and a lid capable of closing the opening. In a method of forming a film of a processing liquid on a substrate using a film forming apparatus provided with the method, a solvent of the processing liquid is supplied to a position deviated from the center of the substrate while the lid is opened, and the substrate is removed. Rotating to diffuse the solvent onto the substrate;
Thereafter, a step of supplying the processing liquid to the center of the substrate with the substrate stopped, and thereafter, a step of rotating the substrate with the lid closed to diffuse the processing liquid onto the substrate. A film forming method. 4. A rotary mounting table for rotating a substrate, a processing container which accommodates the rotary mounting table and has on its upper surface an opening through which the substrate can pass, and a lid which can close the opening. In a method of forming a film of a processing liquid on a substrate using a film forming apparatus provided with the method, a solvent of the processing liquid is supplied to a position deviated from the center of the substrate while the lid is opened, and the substrate is removed. Rotating to diffuse the solvent onto the substrate;
Thereafter, a step of reducing the amount of the solvent on the substrate, a step of supplying the processing liquid to the center of the substrate while the substrate is stopped, and a step of rotating the substrate with the lid closed, and A step of diffusing the compound onto a substrate. 5. The film forming method according to claim 1, wherein the solvent of the processing liquid is supplied annularly around the center of the substrate. 6. The film forming method according to claim 1, wherein the solvent of the processing liquid is supplied to the entire peripheral portion of the substrate. 7. A method of supplying a processing liquid onto a substrate, diffusing the processing liquid by rotating the substrate, and forming a film of the processing liquid on the substrate, wherein a solvent of the processing liquid is removed from the center of the substrate. Supplying the processing liquid to the shifted position and supplying the processing liquid to the center of the substrate; and thereafter, rotating the substrate to diffuse the processing liquid and the solvent of the processing liquid onto the substrate. A film forming method. 8. A rotary mounting table for rotating a substrate, a processing container accommodating the rotary mounting table and having an opening on an upper surface through which the substrate can pass, and a lid capable of closing the opening. A method of forming a film of a processing liquid on a substrate using a film forming apparatus provided with the method, wherein a solvent of the processing liquid is supplied to a position deviated from the center of the substrate while the lid is opened, and Film formation, comprising the steps of: supplying a processing liquid to the center; and then rotating the substrate with the lid closed to diffuse the processing liquid and the solvent of the processing liquid onto the substrate. Method. 9. The film forming method according to claim 7, wherein the solvent of the processing liquid is supplied annularly around the center of the substrate, and the processing liquid is supplied to the center of the substrate. 10. The film forming method according to claim 7, wherein the solvent of the processing liquid is supplied to the entire periphery of the substrate and the processing liquid is supplied to the center of the substrate.