JP2002164278A - Coating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the discharge controllability and the consumption efficiency of a coating liquid, at the same time. SOLUTION: A one-inlet port/two-outlet port passage changer 80 has a junction of a resist liquid passage between a resist liquid tank 78 and a resist nozzle 62. The tank 78 is connected to an inlet port IN of the passage changer 80 through a piping 82 and a pump 84 and a filter 86 are provided on the way of the piping 82. In the passage changer 80 a first outlet port OUT1 is connected to a resist inlet part of the resist nozzle 62 via a piping 88 and a second outlet port OUT2 is connected to the container interior of the resist liquid tank 78 via a piping 90. A pressure control valve 92 is provided on the way of the piping 90 and a controller 100 controls the pump 84, the passage changer 80 and the control valve 92.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
(Liquid Crystal Display) and a coating apparatus for forming a coating film on a substrate by supplying a predetermined coating liquid from a nozzle to a substrate to be processed in a manufacturing process of a semiconductor device or the like.

[0002]

2. Description of the Related Art Conventionally, in a lithography process in a manufacturing process of an LCD or a semiconductor device, a so-called spin coating method has been commonly or frequently used to apply a resist solution onto a substrate to be processed (glass substrate, semiconductor substrate). I have. However, in the conventional general spin coating method, since the substrate to be processed is rotated at a high speed, there is a problem that a large amount of the resist solution is scattered out of the substrate by centrifugal force and is wasted or discarded. is there.

Therefore, as a new resist coating method instead of the spin coating method, as shown in FIG. 12, the resist nozzle 2 is moved relative to the substrate 1 to be processed, for example, in a right-angle zigzag manner or while scanning. A technique (spinless method) has been proposed in which the resist liquid R is applied to the substrate 1 with a desired film thickness without requiring high-speed rotation by continuously discharging R in a thin linear shape. . The resist nozzle 2 used in this spinless method has a very small diameter (for example, 1 mm).
It has a discharge port (of about 00 μm) and is configured to discharge the resist liquid R at a considerably high pressure.

[0004]

In the spinless method as described above, when the resist liquid R is applied with a substantially uniform film thickness from one end of the substrate 1 to be processed, as shown in FIG. 2 is set to be larger than the area of the substrate 1 to be processed, and the resist liquid R is continuously ejected while the resist nozzle 2 is once out of the substrate 1 near the turn of each line scan. I have to.
The resist liquid R discharged outside the substrate to be processed 1 is supplied to a resist receiving portion or a collecting portion (not shown) disposed around the substrate.
It has been thrown away after being received, and it is completely useless.

As described above, the reason why the resist liquid R is unnecessarily discharged from the resist nozzle 2 outside the substrate to be processed 1 is that the internal pressure propagation speed or the responsiveness in the resist liquid supply system is small in the above-described fine diameter discharge method. When the supply of the resist liquid R is stopped, the discharge of the resist nozzle 2 does not immediately stop even when the supply of the resist liquid R is stopped, but when the supply of the resist liquid R is started, the discharge from the resist nozzle 2 does not immediately start (or suddenly comes out). To begin). That is, there is a trade-off between the discharge controllability of the resist liquid and the consumption efficiency, and the former (discharge controllability) is prioritized. However, at the expense of the latter (consumption efficiency), the superiority of the spinless method over the spin coating method has diminished.

The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a coating apparatus capable of reducing the consumption of a coating liquid for obtaining a desired coating film.

Another object of the present invention is to provide a coating apparatus capable of performing discharge control with excellent responsiveness even in a method of discharging a coating liquid with a small diameter.

Another object of the present invention is to provide a coating apparatus which can simultaneously improve the controllability of the application liquid discharge and the consumption efficiency.

[0009]

In order to achieve the above object, a coating apparatus of the present invention comprises a nozzle for discharging a predetermined coating liquid toward a substrate to be processed, and a coating apparatus for storing the coating liquid. A liquid reservoir, a first flow path connecting the coating liquid storage part to a predetermined flow path branch point, a second flow path connecting the flow path branch point and a discharge port of the nozzle, A third flow path connecting the road branch point and the coating liquid storage section; and a coating liquid for sending the coating liquid from the coating liquid storage section to the flow path branch point side via the first flow path. The configuration includes a supply unit and a control unit for controlling the flow of the coating liquid in the second and third flow paths.

[0010] In the coating apparatus of the present invention, the flow of the coating liquid from the coating liquid reservoir is divided into the first flow path or the second flow path at the flow path branch point.
Can be selectively switched over. For example,
When discharging the coating liquid from the nozzle, the second flow path may be shut off and the first flow path may be brought into a flowing state. When the discharge of the application liquid is stopped, the first flow path may be shut off and the second flow path may be passed. When the second flow path is in a flowing state, the coating liquid is guided to the coating liquid storage section via the second flow path. This makes it possible to start and stop the application liquid ejection quickly and stably while maintaining the operation of the application liquid supply unit (application liquid supply operation).

The control means can control the flow of the coating liquid in the second and third flow paths in a correlated or independent manner. In the aspect in which the nozzle is relatively moved with respect to the substrate to be processed, the flow of the coating liquid in the second and third flow paths may be controlled according to the position of the nozzle with respect to the substrate to be processed. In a mode in which the application liquid ejection operation of the nozzle is controlled in a predetermined sequence, the flow of the application liquid in the second and third flow paths may be controlled in accordance with the sequence.

Preferably, the control means includes first and second valves provided in the second and third flow paths, respectively, and a coating mode for supplying a coating liquid from a nozzle to a coating region set on the substrate to be processed. During the process, the first valve is opened and the second valve is closed. Immediately before and immediately after the start of the application mode, the second valve is opened and the first valve is closed. Good. The first or second valve may be of an on / off control type, a flow control type, or a pressure control type.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 shows a coating and developing system as an example of a system into which the coating apparatus of the present invention can be incorporated. This coating and developing system is installed in a clean room, and performs, for example, cleaning, resist coating, pre-baking, developing and post-baking in a photolithography process in an LCD manufacturing process, for example, using an LCD substrate as a substrate to be processed. is there. The exposure processing is performed by an external exposure apparatus (not shown) installed adjacent to this system.

The coating and developing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, and an interface unit (I / O).
/ F) 14.

A cassette station (C / S) 10 installed at one end of the system has a cassette stage 16 on which a predetermined number of, for example, four cassettes C accommodating a plurality of substrates G can be placed, and a cassette stage 16 on this stage 16. And a transfer mechanism 20 for loading and unloading the substrate G with respect to the cassette C. The transfer mechanism 20 has a unit capable of holding the substrate G, for example, a transfer arm, is operable in four axes of X, Y, Z, and θ, and is a process station (P / S) described later.
The transfer of the substrate G to and from the main transfer device 38 on the 12th side can be performed.

The process station (P / S) 12
The cleaning process unit 22, the coating process unit 24, and the developing process unit 26 are sequentially changed from the cassette station (C / S) 10 side to the substrate relay unit 23, the chemical solution supply unit 25.
And are provided in a horizontal row with (and sandwiching) a space 27 therebetween.

The cleaning process section 22 includes two scrubber cleaning units (SCRs) 28 and two upper and lower ultraviolet irradiation /
It includes a cooling unit (UV / COL) 30, a heating unit (HP) 32, and a cooling unit (COL).

The coating process unit 24 includes a resist coating unit (CT) 40 and a reduced-pressure drying unit (VD) 42
And the edge remover unit (ER) 44 and the upper and lower 2
Stage type adhesion / cooling unit (AD / COL) 4
6, upper and lower two-stage heating / cooling unit (HP / COL)
48 and a heating unit (HP) 50.

The developing process section 26 includes three developing units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 55, and a heating unit (HP) 5
3 is included.

At the center of each of the process sections 22, 24, and 26, transport paths 36, 52, and 58 are provided in the longitudinal direction, and the main transport devices 38, 54, and 60 move along each transport path, and Each unit in the unit is accessed to carry in / out or carry in the substrate G. In this system, in each of the process units 22, 24, and 26, a spinner system unit (SCR, CT, DEV, etc.) is disposed on one side of the transport paths 36, 52, and 58, and heat treatment or heat treatment is performed on the other side. Irradiation treatment system unit (HP, CO
L, UV, etc.).

An interface (I / F) 14 installed at the other end of the system has an extension (substrate transfer section) 57 on the side adjacent to the process station 12.
And a buffer stage 56, and a transport mechanism 59 on the side adjacent to the exposure apparatus.

FIG. 2 shows a processing procedure in the coating and developing system. First, the cassette station (C
/ S) 10, the transport mechanism 20 takes out one substrate G from the predetermined cassette C on the stage 16 and
It is transferred to the main transfer device 38 of the cleaning process section 22 of the process station (P / S) 12 (step S1).

In the cleaning process section 22, the substrate G
First, they are sequentially carried into an ultraviolet irradiation / cooling unit (UV / COL) 30, subjected to dry cleaning by ultraviolet irradiation in the upper ultraviolet irradiation unit (UV), and then cooled to a predetermined temperature in the lower cooling unit (COL). (Step S2). This ultraviolet irradiation cleaning removes organic substances on the substrate surface. This improves the wettability of the substrate G,
The cleaning effect in the scrubbing cleaning in the next step can be enhanced.

Next, the substrate G is provided with a scrubber cleaning unit (S
One of the CRs 28 undergoes a scrubbing cleaning process to remove particulate contamination from the substrate surface (step S3).
After the scrubbing cleaning, the substrate G is heated by a heating unit (H
(P) 32 undergoes dehydration by heating (step S)
4) Then, the substrate is cooled to a certain substrate temperature by the cooling unit (COL) 34 (step S5). Thus, the pre-processing in the cleaning process unit 22 is completed, and the substrate G is transported by the main transport unit 38 to the coating process unit 24 via the substrate transfer unit 23.

In the coating processing section 24, the substrate G
First, the adhesion / cooling unit (AD / COL) 4
6 in sequence, and the first adhesion unit (A
In D), a hydrophobizing treatment (HMDS) is performed (step S).
6) Then, the substrate is cooled to a constant substrate temperature in the next cooling unit (COL) (step S7).

Thereafter, the substrate G is coated with a resist solution in a resist coating unit (CT) 40, and then subjected to a drying process under reduced pressure in a reduced-pressure drying unit (VD) 42, and then in an edge remover unit (ER) 44 Excess (unnecessary) resist on the periphery is removed (step S
8).

Next, the substrate G is placed on a heating / cooling unit (H
P / COL) 48, and the first heating unit (HP) performs baking (pre-bake) after coating (step S9), and then cools to a constant substrate temperature by the cooling unit (COL) (step S9). Step S10). In addition,
The heating unit (HP) 50 can be used for baking after the application.

After the coating process, the substrate G is transferred to the interface (I / F) 14 by the main transfer device 54 of the coating process unit 24 and the main transfer device 60 of the development process unit 26.
To the exposure apparatus from there (step S
11). The exposure device exposes a resist on the substrate G to a predetermined circuit pattern. Then, the substrate G after the pattern exposure is transferred from the exposure apparatus to the interface unit (I / F) 14.
Is returned to. The transfer mechanism 59 of the interface unit (I / F) 14 transfers the substrate G received from the exposure apparatus via the extension 57 to the process station (P / S) 1.
(Step S11).

In the developing process section 26, the substrate G
One of the developing units (DEV) 52 undergoes a developing process (step S12), and then is sequentially loaded into one of the heating / cooling units (HP / COL) 55, and is post-baked in the first heating unit (HP). Is performed (step S13), and then cooled to a certain substrate temperature by the cooling unit (COL) (step S14). A heating unit (HP) 53 can be used for this post-baking.

The substrate G that has been subjected to a series of processing in the developing process section 26 is returned to the cassette station (C / S) 10 by the transfer devices 60, 54, and 38 in the process station (P / S) 24. Stored in one of the cassettes C by the transport mechanism 20 (step S
1).

In this coating and developing system, the present invention can be applied to the resist coating unit (CT) of the coating processing section 24. An embodiment in which the present invention is applied to a resist coating unit (CT) will be described below with reference to FIGS.

FIG. 3 shows the configuration of the nozzle scanning mechanism in the resist coating unit (CT) according to the first embodiment of the present invention. Resist application unit (CT) of this embodiment
In order to apply a resist solution to a desired thickness on the substrate G by a spinless method, a resist nozzle 6
2 has a nozzle scanning mechanism 64 for driving the nozzle 2 in the XY directions.

As shown in FIG. 3, the substrate G is placed substantially horizontally on the stage 66 in the resist coating unit (CT). The stage G is loaded /
A plurality of lift pins (not shown) that can move up and down to support the substrate G in a horizontal posture from below at the time of unloading are provided.

In the nozzle scanning mechanism 64, the stage 6
6, a pair of Y guide rails 68 and 70 extending in the Y direction are arranged on both sides in the X direction, and an X guide rail 72 extending between the Y guide rails 68 and 70 in the X direction.
Are movably mounted in the Y direction. A Y-direction drive unit 74 disposed at a predetermined position, for example, one end of the Y guide rail 68, moves the X guide rail 72 along the Y guide rails 68 and 70 via a transmission mechanism (not shown) such as an endless belt. Drive in the direction. Further, a carriage (transport body) 76 that can move in the X direction along the X guide rail 72 in a self-propelled manner or an externally driven manner, for example, is provided.
2 are installed. The resist nozzle 62 has a resist liquid introduction unit for introducing a resist liquid from a resist liquid supply unit (not shown in FIG. 3) described later, and a fine nozzle (for example, about 100 μm) for vertically discharging the introduced resist liquid. Or it has a plurality of discharge ports.

FIG. 4 shows the resist coating unit (C)
The configuration of the main part of the resist coating unit in T) is shown.
The resist coating section has a fluid circuit and an electric control system for supplying and controlling the resist liquid R to the resist nozzle 62.

In the circuit of the resist fluid system in this embodiment, a one-input port / two-output port type having a branch point of a resist liquid flow path between a resist liquid tank (resist liquid storage part) 78 and a resist nozzle 62 is provided. Channel switching unit 8
0 is provided.

The resist liquid tank 78 and the input port IN of the flow path switching section 80 are connected by a pipe 82.
A pump 84 and a filter 86 are provided halfway.
The pump 84 supplies the resist solution R from the resist solution tank 78.
And sucks up the resist solution R to the flow path switching unit 80.
At a predetermined pressure. The filter 86 removes foreign matter from the resist solution R.

In the flow path switching section 80, the first output port OUT 1 is connected to the resist introduction section of the resist nozzle 62 via a pipe 88, and the second output port OUT 2 is connected via a pipe 90 to the inside of the container of the resist liquid tank 78. Connected to. A pressure control valve 92 is provided in the middle of the pipe 90.

In the above-mentioned fluid system, the pump 84, the flow path switching section 80 and the pressure control valve 92 are controlled by a control section 100 composed of, for example, a microcomputer. More specifically, the suction / discharge operation of the pump 84 is controlled by the control unit 1 through a pump driving unit, for example, the driving motor 102.
00. The flow path switching unit 80 includes an electromagnetic valve or a solenoid valve that can selectively switch between a flow path on the first output port OUT1 side and a flow path on the second output port OUT2 side, as described later. The opening / closing operation of the valve or the valve position is controlled by the control unit 100. The pressure control valve 92 is, for example, an electromagnetic proportional valve, and adjusts the pressure of the resist solution R returning from the flow path switching unit 80 to the resist solution tank 78 in real time under the control of the control unit 100.

A pressure sensor (not shown) for detecting the pressure in the pipe 90 (resist liquid return flow path) or the pressure in the pipe 88 or the resist nozzle 62 (resist liquid discharge flow path) is provided. The control unit 10 uses the sensor output signal as a monitor signal or a feedback signal.
It is also possible to give 0.

The control unit 100 controls the operation of the nozzle scanning mechanism 64. The drive unit of the nozzle scanning mechanism 64 may be constituted by, for example, a step motor. Control unit 10
A position sensor 104 may be provided to allow 0 to monitor or feed back the position of the resist nozzle 62. The position sensor 104 is, for example, a rotary encoder or an X encoder attached to a drive motor of an XY drive section (74, 76) in the nozzle scanning mechanism 64.
It may be constituted by a linear encoder or the like attached to the Y guide rails (68, 70, 72).

FIG. 5 shows an example of the configuration of the flow path switching section 80. In this configuration example, a flow path branch point BG is provided in a block-shaped main body 106 made of, for example, stainless steel, and the first flow path 1 connecting the input port IN and the branch point BG is provided.
08, a second flow path 110 connecting the branch point BG and the first output port OUT1, and a branch point BG and the second output port O
A third flow path 112 connecting the UT2 is formed. Solenoid valves 114 and 116 for opening and closing the second flow path 110 and the third flow path 112, respectively, are attached to the main body 106.

Each of the solenoid valves 114 and 116 has, for example, a poppet 114 with respect to a valve seat 114a and 116a.
A valve for opening and closing the valve by separating and contacting the b and 116b is provided. A solenoid for sucking and driving the poppets 114b and 116b against the coil springs 114c and 116c is attached to the external valve driving units 114d and 116d. Built-in. Control signals CS1 and CS2 for controlling the opening and closing of the solenoid valves 114 and 116 are supplied to the valve driving units 114d and 116d by the control unit 100 (FIG. 4).
Given by In this embodiment, the control unit 100 can independently control the opening and closing of each solenoid valve 114, 116. Therefore, not only can the two solenoid valves 114 and 116 be switched to the complementary open / closed state (one is open and the other is closed), but also it can be simultaneously opened or closed.

FIG. 6 shows the procedure of the resist coating process in this embodiment (particularly, the control procedure of the control unit 100).
7 and 8 show the operation of the resist coating process in this embodiment.

The substrate G before the coating process is carried into the resist coating unit (CT) by the main transfer device 54 (FIG. 1), and the substrate G is placed on the stage 66 (FIG. 3) by the lift pins (not shown). After the mounting, a resist coating process is performed.

The control unit 100 initializes (step A1)
, The nozzle scanning mechanism 64 is controlled to set the registration nozzle 62 at the initial position (X0, Y0). Further, the flow path switching unit 80 is controlled to close the flow path on the first output port OUT1 side and open the flow path on the second output port OUT2 side. At this point, the operation of the pump 84 (discharge operation) may be started by controlling the pump driving unit 102. Thus, the flow path switching unit 8 is supplied from the pump 84 via the pipe 82.
The resist solution R sent to 0 is returned to the resist solution tank 78 via the pipe 90 without being supplied to the resist nozzle 62 side. The control unit 100 includes a pressure control valve 92
And the pressure of the resist solution R flowing through the pipe 90 can be adjusted to a desired value, for example, the same value as the pressure in the pipe 88 when the resist liquid R is discharged from the resist nozzle 62.
By such pressure control, the flow rate of the resist solution R returned to the resist solution tank 78 can be suppressed, and the operation and effect of preventing generation of bubbles due to the inflow of the resist solution R can be obtained.

Next, the control unit 100 controls the nozzle scanning mechanism 6
4 by controlling the X driving section 76 of the resist nozzle 62.
The movement of one line in the direction is started (step A2). Then, when the resist nozzle 62 has moved to a predetermined position X1 (precisely, the nozzle discharge port) just before reaching one end of the substrate G (step A3),
In order to start the discharge of the resist liquid R from the resist nozzle 62, the flow path switching unit 80 is controlled to control the first output port O
Open the flow path on the UT1 side and set the second output port OU
The flow path on the T2 side is closed (step A4). The resist solution R, which has been flowing from the flow path switching unit 80 to the resist liquid tank 78 side via the pipe 90 until then, when the flow path direction is switched by the flow path switching unit 80 as described above, the piping 88 is connected. Through the resist nozzle 62 through the
From the discharge port at a predetermined pressure. Thus, the resist nozzle 62 moves at a constant speed in the X direction while discharging the resist liquid R onto the substrate G.

When the resist nozzle 62 reaches a predetermined position X2 set near the other end of the substrate G by the line scanning in the X direction as described above (step A5), the control unit 100
Stops the discharge of the resist liquid R from the resist nozzle 62 (step A6). Therefore, the flow path switching unit 80
To close the flow path on the first output port OUT1 side and open the flow path on the second output port OUT2 side.
As a result, the resist liquid R sent from the pump 84 to the flow path switching unit 80 via the pipe 82 is supplied to the flow path switching unit 8.
At 0, the liquid is guided to the flow path on the second output port OUT2 side, and returns to the resist liquid bottle 78 via the pipe 90.
For this reason, the residual pressure in the resist nozzle 62 is very low, and the resist liquid R is immediately cut off.

The control unit 100 controls the X of the nozzle scanning mechanism 64
By controlling the drive unit 76, the movement of the resist nozzle 62 for one line in the X direction at the predetermined turn-back position X0 is completed (steps A7 and A8). Usually, it takes a certain deceleration time to stop the movement of the resist nozzle 62,
The deceleration may be started just before the turning position X0.

Next, the control unit 100 controls the nozzle scanning mechanism 6
4 by controlling the Y driving unit 74 to move the resist nozzle 62 at a return position X0 by a certain distance or pitch yc in the Y direction.
(Step A9). Next, the moving operation of the resist nozzle 62 and the discharging operation of the resist liquid R in the X direction in the direction opposite to the previous line are controlled in the same sequence as described above with the turning position X0 as the start point (steps A10 → A11 → A2). ‥).

According to the above-described resist coating operation,
As shown in FIGS. 7 and 8, while the resist nozzle 62 is scanning over the substrate G, the resist liquid R is continuously discharged from the resist nozzle 62, and the resist nozzle 62 is out of the substrate G. During this time, the discharge of the resist liquid R can be interrupted. Therefore, the amount of the resist liquid R which is discharged and discarded outside the substrate G is reduced as much as possible, and the efficiency of using the resist liquid can be greatly improved.

In this embodiment, while the discharge of the resist solution R is interrupted, the resist solution tank 78 → the pipe 8
2 → flow path switching section 80 → pipe 90 → resist liquid tank 78
Since the resist liquid R circulates and flows through the fluid circuit of FIG. 1, and since the flow path switching unit 80 is located in front of the resist nozzle 62, the discharge start and stop of the resist liquid R in the resist nozzle 62 are stopped. Can be controlled at a high response speed. This makes it possible to simultaneously achieve the controllability of the discharge of the resist solution, the accuracy of the coating process and the efficiency of the resist solution consumption.

In this embodiment, the resist nozzle 6
In order to further smooth the start and stop of the discharge of the resist liquid R in Step 2, a speed control may be applied to the opening and closing operations of the two solenoid valves 114 and 116 in the flow path switching unit 80, or a time difference may be provided. For example, at the start of discharge, the opening / closing operation (closing → opening) of the solenoid valve 114 on the discharge flow path side is controlled by the solenoid valve 116 on the return flow path side.
May be performed at a timing slightly earlier than the opening / closing operation (open → close). Conversely, when the discharge is stopped, the opening / closing operation of the solenoid valve 116 on the return flow path side (closed → open) is more than the opening / closing operation of the solenoid valve 114 on the discharge flow path side (open → closed).
May be executed at a slightly earlier timing.

Further, from the viewpoint of the response of the start and stop of the discharge of the coating liquid, the shorter the flow path between the flow path switching unit 80 and the resist nozzle 62, the more preferable. Therefore, a configuration in which the pipe 88 is omitted and the flow path switching unit 80 is directly connected to the resist nozzle 62, or a configuration in which the two (80, 62) are integrated as shown in FIG.

In the configuration example of FIG. 9, the first output port OUT
1, a nozzle hole of the resist nozzle 62 is formed. The number of the nozzle holes may be one or plural (for example, in a line at a constant pitch). In order to increase the pressure propagation speed between the branch point BG and the nozzle hole (OUT1), the flow path 1
A configuration in which 10 is as narrow as possible is preferred. In this manner, in accordance with the narrowing of the flow path on the first output port OUT1 side (increase in pressure loss), the flow path of the second output port OUT2 side may be similarly narrowed as shown in FIG. In this case, the pressure regulating valve 92 can be omitted. In this way, it is possible to reduce the number of components, reduce the number of control mechanisms, and improve the reliability of the apparatus.

In the spinless method of this embodiment, in order to apply the resist liquid R with a substantially uniform film thickness from end to end of the substrate G, a small amount of the resist nozzle is provided outside the substrate G. It is often inevitable that the resist liquid R is unnecessarily discharged from the nozzle 62. In this case, the resist solution R is placed on the stage 66 around the substrate G.
A receiving member or a cover member (not shown) for receiving the sheet may be provided.

A mechanism for supplying a solvent onto the substrate G together with or prior to the discharge (supply) of the resist liquid R so that the resist liquid R discharged from the resist nozzle 62 is diffused on the substrate G. (Not shown) may be provided. Further, in order to stably maintain the flow of the resist liquid R discharged in a linear form having a small diameter from the resist nozzle 62, a mechanism for controlling the space around the resist nozzle 62 to a solvent atmosphere of a predetermined concentration may be provided.

FIG. 10 shows a configuration of a characteristic portion of a resist coating unit (CT) according to the second embodiment of the present invention. In the second embodiment, the first step is to place the substrate G on the spin chuck 118 and supply the resist liquid R roughly distributed on the stationary substrate G; The second step of spin-rotating the substrate G in order to widen the R and level the coating film (uniform film thickness) is sequentially performed. In the first step, the XY scanning mechanism (FIG. 3) and the resist coating unit (FIG. 4) in the first embodiment can be used.

In a conventional general spin coating method, a resist solution is dropped on the center of a substrate and then 2,000 to 3,000 rpm.
In contrast to the above spinning at a high speed, this second
In the method of the embodiment, the resist solution is distributed to a large extent on the substrate and then spinned at a low speed of, for example, about 1000 rpm, so that the amount of the resist solution flying outside the substrate can be reduced.

In FIG. 10, the rotation shaft 118a of the spin chuck 118 is operatively connected to a rotation drive unit (not shown) provided in the drive unit 120. A chuck suction port (not shown) provided on the upper surface of the spin chuck 118 is connected to a negative pressure source, for example, a vacuum pump (not shown) via an air passage penetrating through the rotating shaft 118a. The drive unit 120 includes a spin chuck 118.
There is also provided a lifting drive (not shown) for raising and lowering the. At the time of loading / unloading the substrate G, the spin chuck 118 rises and the external transport device, that is, the main transport device 54
(FIG. 1) and the substrate G are exchanged.

A rotating cup 122 is rotatably provided so as to surround the spin chuck 118, and a drain cup 124 is fixedly disposed outside the rotating cup 122. The upper surfaces of both cups 122 and 124 are open. The bottom of the rotation cup 122 is operatively connected to a rotation drive unit in the drive unit 126 via a cylindrical support member 126.

A lid 130 that can be moved up and down by a robot arm 128 is disposed above the rotating cup 122. The resist nozzle 62 above the rotating cup 122
Is scanned, that is, during the step of supplying the resist solution R onto the substrate G (first step), the lid 130 is retracted above the nozzle scanning mechanism 64. After the first step is completed, the lid 130 comes down to close the upper surface of the rotating cup 122 in the step of performing the leveling of the coating film (the second step). Although not shown, the upper surfaces of the lid 130 and the rotating cup 122 are configured to engage with each other. When the spin chuck 118, the rotation cup 122 and the lid 130 rotate together by the rotation of the driving unit 120, the resist liquid R is spread on the substrate G by centrifugal force, and the resist scattered outside the substrate G is dispersed. Liquid R is received in rotating cup 122. A ring-shaped seal member 131 for sealing the bottom surface of the rotating cup 122 is attached to the lower surface of the spin chuck 118.

The resist solution R collected in the rotating cup 122 is guided to the drain cup 124 through a drain port 132 formed in the outer peripheral edge of the bottom of the cup 122, and is discharged from the drain port 134 at the bottom of the drain cup 124. It is sent to a processing unit (not shown). During the spin rotation, air flows out from the drain port 134 and the rotating cup 1
A suitable air inlet (not shown) may be provided on the upper portion of the rotating cup 122 or on the lid 130 to prevent a negative pressure inside the interior 22. The air that has flowed into the drain cup 124 from the side of the rotating cup 122 is
4 is discharged to an exhaust system (not shown) from an exhaust port 136 formed on the outer peripheral surface.

In the first step of the second embodiment, the resist solution R may be supplied to the substrate G with a certain wide distribution on the substrate G as described above, and it is not necessary to apply the resist solution R uniformly over the entire surface of the substrate. Therefore, for example, as shown in FIG. 10A, the resist nozzle 62 can be scanned on the substrate G without leaving the substrate G outside. Further, in such a right-angle zigzag scanning pattern, as shown in FIG.
The discharge of the resist liquid R may be continued even in the section (movement in the Y direction).

In this case, according to the resist coating processing section (FIG. 4) of this embodiment, the control section 100 controls the opening and closing operation of both solenoid valves 114 and 116 in the flow path switching section 80 and the pressure control in the resist liquid return flow path. By appropriately controlling the pressure adjusting function of the valve 92 and, if necessary, the discharge pressure of the pump 84, fluctuations in the resist liquid supply rate on the substrate G in the vicinity of the turn-back portion UY can be minimized.

In the above embodiment, it is possible to replace the pressure control valve 92 in the resist liquid return flow path with a flow control valve. In addition, both solenoid valves 114 and 116 in the flow path switching unit 80 may have a separate valve structure separated from each other, and each may be configured as a pressure control valve or a flow control valve. Also,
Although the precision of the resist liquid discharge control is lower than that of the above embodiment, it is also possible to omit either the solenoid valve 116 or the pressure (flow rate) control valve 92 on the resist liquid return flow path side. Both (11
6, 92) can be omitted. Alternatively, it is possible to provide a valve only on the resist liquid return flow path side and omit the valve (114) on the resist liquid discharge flow path side.

The XY nozzle scanning mechanism (64) and the right-angle zigzag scanning pattern in the above-described embodiment are merely examples, and do not limit the technical idea of the present invention.
Various configurations or types of scanning mechanisms can be used, and any scanning pattern can be selected.

The present invention can be applied to any application for supplying a coating liquid onto a substrate to be processed using a resist nozzle. Is also applicable. In that case, the flow path switching unit may be controlled according to a temporal sequence. As the coating liquid in the present invention, for example, a liquid such as an interlayer insulating material, a dielectric material, and a wiring material can be used in addition to the resist liquid. The substrate to be processed in the present invention is not limited to the LCD substrate, but may be a semiconductor wafer, a CD substrate, a glass substrate, a photomask, a printed substrate, or the like.

[0070]

As described above, according to the coating apparatus of the present invention, the consumption of the coating liquid for obtaining a desired coating film can be greatly reduced, and the method for discharging the coating liquid in a small diameter can be achieved. This also makes it possible to perform ejection control with excellent responsiveness. Further, it is possible to simultaneously improve the controllability of the application liquid ejection and the consumption efficiency.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a coating and developing processing system to which a substrate processing apparatus of the present invention can be applied.

FIG. 2 is a flowchart illustrating a processing procedure in the coating and developing processing system according to the embodiment.

FIG. 3 is a perspective view showing a configuration of a nozzle scanning mechanism in the resist coating unit (CT) according to the first embodiment of the present invention.

FIG. 4 is a block diagram illustrating a configuration of a main part of a resist coating unit in a resist coating unit (CT) according to the embodiment.

FIG. 5 is a cross-sectional view illustrating a configuration example of a flow path switching unit according to the embodiment.

FIG. 6 is a flowchart illustrating a procedure of a resist coating process in the embodiment.

FIG. 7 is a plan view schematically showing the operation of a resist coating process in the embodiment.

FIG. 8 is a perspective view schematically showing an operation of a resist coating process in the embodiment.

FIG. 9 is a cross-sectional view illustrating a configuration of a modified example of the flow path switching unit in the embodiment.

FIG. 10 is a partial cross-sectional front view showing a configuration of a characteristic portion in a resist coating unit (CT) according to a second embodiment of the present invention.

FIG. 11 is a plan view schematically showing the operation of a resist coating process in the embodiment.

FIG. 12 is a perspective view schematically showing the operation of a resist coating process according to the related art.

[Explanation of symbols]

 Reference Signs List 40 resist coating unit (CT) 62 resist nozzle 64 nozzle scanning mechanism 78 resist liquid tank 80 flow path switching unit 82, 88, 90 piping 84 pump 92 pressure control valve 100 control unit 114, 116 solenoid valve 118 spin chuck 120 driving unit 122 Rotating cup 130 lid

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B05D 7/00 G03F 7/16 501 G03F 7/16 501 H01L 21/30 564Z F-term (Reference) 2H025 AA18 AB16 AB20 EA04 4D075 AC04 AC84 AC91 DA06 DB13 DC22 4F042 AA06 BA12 CA01 CB02 CB08 CB19 CB20 5F046 JA01 JA03

Claims (12)

[Claims] A nozzle for discharging a predetermined coating liquid toward a substrate to be processed; a coating liquid storage section for storing the coating liquid; and a connection between the coating liquid storage section and a predetermined flow path branch point. A first flow path, a second flow path connecting the flow path branch point and the discharge port of the nozzle, a third flow path connecting the flow path branch point and the coating liquid storage unit, A coating liquid supply means for sending the coating liquid from the coating liquid storage section to the flow path branch point side via the first flow path; and a flow of the coating liquid in the second and third flow paths. A coating device having control means for controlling the coating device. 2. A nozzle for discharging a predetermined application liquid toward a substrate to be processed, a driving unit for moving the nozzle relatively to the substrate to be processed, and storing the application liquid. A coating liquid storage section, a first flow path connecting the coating liquid storage section to a predetermined flow path branch point, a second flow path connecting the flow path branch point and a discharge port of the nozzle, A third flow path connecting the flow path branch point and the coating liquid storage section; and a coating for sending the coating liquid from the coating liquid storage section to the flow path branch point side via the first flow path. A coating apparatus, comprising: a liquid supply unit; and a control unit that controls a flow of the coating liquid in the second and third flow paths according to a position of the nozzle with respect to the substrate to be processed. 3. A nozzle for discharging a predetermined coating liquid toward a substrate to be processed, sequence control means for controlling an operation of discharging the coating liquid from the nozzle in a predetermined sequence, and storing the coating liquid. A first flow path connecting the coating liquid storage part and a predetermined flow path branch point; a second flow path connecting the flow path branch point and the discharge port of the nozzle; A third flow path connecting the flow path branch point and the coating liquid storage section, and a third flow path for sending the coating liquid from the coating liquid storage section to the flow path branch point side via the first flow path. Coating liquid supply means; and
And a control means for controlling the flow of the coating liquid in the third flow path. 4. The control device according to claim 1, wherein the control means includes a first valve provided in the second flow path and a second valve provided in the third flow path. The coating device according to any one of claims 1 to 3. 5. The apparatus according to claim 1, wherein the control unit opens the first valve during the application mode in which the application liquid is supplied from the nozzle to an application area set on the substrate to be processed, and the second valve is opened. The coating according to claim 4, wherein the valve is closed, and the first valve is closed and the second valve is open immediately before and immediately after the start of the coating mode. apparatus. 6. The coating apparatus according to claim 4, wherein said control means controls each open / close state of said first and second valves independently. 7. The method according to claim 4, wherein the first valve includes a first on-off valve for turning on / off the flow of the coating liquid in the second flow path. A coating device according to any one of the above. 8. The apparatus according to claim 4, wherein said first valve includes a first flow control valve for flowing said coating liquid at a desired flow rate in said second flow path. A coating device according to any one of the above. 9. The apparatus according to claim 4, wherein said first valve includes a first pressure control valve for flowing said coating liquid at a desired pressure in said second flow path. A coating device according to any one of the above. 10. The apparatus according to claim 4, wherein the second valve includes a second on-off valve for selectively turning on and off the flow of the coating liquid in the third flow path. 10. The coating device according to any one of 9 above. 11. The apparatus according to claim 4, wherein said second valve includes a second flow control valve for flowing said coating liquid at a desired flow rate in said third flow path. A coating device according to any one of the above. 12. The apparatus according to claim 4, wherein said second valve includes a second pressure control valve for flowing said coating liquid at a desired pressure in said third flow path. A coating device according to any one of the above.