JP2000286458A5 - - Google Patents

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Publication number
JP2000286458A5
JP2000286458A5 JP2000072414A JP2000072414A JP2000286458A5 JP 2000286458 A5 JP2000286458 A5 JP 2000286458A5 JP 2000072414 A JP2000072414 A JP 2000072414A JP 2000072414 A JP2000072414 A JP 2000072414A JP 2000286458 A5 JP2000286458 A5 JP 2000286458A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000072414A
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Japanese (ja)
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JP4055322B2 (ja
JP2000286458A (ja
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Publication date
Application filed filed Critical
Publication of JP2000286458A publication Critical patent/JP2000286458A/ja
Publication of JP2000286458A5 publication Critical patent/JP2000286458A5/ja
Application granted granted Critical
Publication of JP4055322B2 publication Critical patent/JP4055322B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000072414A 1998-01-26 2000-03-15 半導体発光装置 Expired - Fee Related JP4055322B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1226098 1998-01-26
JP10-12260 1998-01-26

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1753599A Division JP3241338B2 (ja) 1998-01-26 1999-01-26 半導体発光装置

Publications (3)

Publication Number Publication Date
JP2000286458A JP2000286458A (ja) 2000-10-13
JP2000286458A5 true JP2000286458A5 (enrdf_load_stackoverflow) 2006-03-09
JP4055322B2 JP4055322B2 (ja) 2008-03-05

Family

ID=11800411

Family Applications (2)

Application Number Title Priority Date Filing Date
JP1753599A Expired - Lifetime JP3241338B2 (ja) 1998-01-26 1999-01-26 半導体発光装置
JP2000072414A Expired - Fee Related JP4055322B2 (ja) 1998-01-26 2000-03-15 半導体発光装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP1753599A Expired - Lifetime JP3241338B2 (ja) 1998-01-26 1999-01-26 半導体発光装置

Country Status (1)

Country Link
JP (2) JP3241338B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8328376B2 (en) 2005-12-22 2012-12-11 Cree, Inc. Lighting device

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JP2000208822A (ja) * 1999-01-11 2000-07-28 Matsushita Electronics Industry Corp 半導体発光装置
JP2001196642A (ja) * 2000-01-11 2001-07-19 Toyoda Gosei Co Ltd 発光装置
JP2002133925A (ja) * 2000-10-25 2002-05-10 Sanken Electric Co Ltd 蛍光カバー及び半導体発光装置
JP2002226551A (ja) * 2001-01-31 2002-08-14 Matsushita Electric Ind Co Ltd 発光ダイオード
US6730942B2 (en) 2002-01-24 2004-05-04 Toyoda Gosei Co., Ltd. Light emitting apparatus
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US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
AU2003276867A1 (en) 2002-09-19 2004-04-08 Cree, Inc. Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor
TW200427111A (en) 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
JP4586967B2 (ja) * 2003-07-09 2010-11-24 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
TWI373150B (en) 2003-07-09 2012-09-21 Shinetsu Chemical Co Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device
US20050104072A1 (en) 2003-08-14 2005-05-19 Slater David B.Jr. Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
US7029935B2 (en) 2003-09-09 2006-04-18 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
US7183587B2 (en) 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
JP4803339B2 (ja) 2003-11-20 2011-10-26 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP4300418B2 (ja) 2004-04-30 2009-07-22 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
US20060097385A1 (en) 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US7322732B2 (en) 2004-12-23 2008-01-29 Cree, Inc. Light emitting diode arrays for direct backlighting of liquid crystal displays
US7304694B2 (en) 2005-01-12 2007-12-04 Cree, Inc. Solid colloidal dispersions for backlighting of liquid crystal displays
US8441179B2 (en) 2006-01-20 2013-05-14 Cree, Inc. Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
TWI491062B (zh) 2006-01-20 2015-07-01 Cree Inc 空間分離發光膜以偏移固態發光器的光譜內容
EP2027412B1 (en) 2006-05-23 2018-07-04 Cree, Inc. Lighting device
JP4636275B2 (ja) 2006-07-18 2011-02-23 信越化学工業株式会社 シリコーン樹脂組成物で封止された半導体装置及び該半導体装置封止用シリコーン樹脂タブレット
JP2011009346A (ja) * 2009-06-24 2011-01-13 Shin-Etsu Chemical Co Ltd 光半導体装置
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
US8466611B2 (en) 2009-12-14 2013-06-18 Cree, Inc. Lighting device with shaped remote phosphor
JP5549568B2 (ja) 2009-12-15 2014-07-16 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び当該組成物で封止した光半導体装置
JP5826767B2 (ja) 2010-01-25 2015-12-02 エルジー・ケム・リミテッド シリコーン樹脂
EP2530123B1 (en) 2010-01-25 2015-11-11 LG Chem, Ltd. Curable composition
CN104479359B (zh) 2010-01-25 2018-04-03 Lg化学株式会社 可固化组合物
JP5489280B2 (ja) 2010-04-07 2014-05-14 信越化学工業株式会社 光半導体封止用エポキシ組成物
JP5640476B2 (ja) 2010-06-08 2014-12-17 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び発光装置
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
KR101539486B1 (ko) 2011-01-06 2015-07-24 주식회사 엘지화학 경화성 조성물
CN103403097B (zh) 2011-01-06 2015-07-22 Lg化学株式会社 可固化组合物
CN103415572B (zh) 2011-01-06 2015-07-29 Lg化学株式会社 可固化组合物
CN103429665B (zh) 2011-01-06 2015-04-22 Lg化学株式会社 可固化组合物
EP2706095B1 (en) 2011-05-04 2021-03-03 LG Chem, Ltd. Curable composition
CN103608408B (zh) 2011-06-17 2016-04-13 Lg化学株式会社 可固化组合物
CN103827216B (zh) 2011-07-22 2016-03-16 Lg化学株式会社 可固化组合物
JP5893874B2 (ja) 2011-09-02 2016-03-23 信越化学工業株式会社 光半導体装置
CN104066795B (zh) 2011-11-25 2016-06-08 Lg化学株式会社 可固化组合物
JP5885368B2 (ja) 2011-11-25 2016-03-15 エルジー・ケム・リミテッド 硬化性組成物
JP5871413B2 (ja) 2011-11-25 2016-03-01 エルジー・ケム・リミテッド 硬化性組成物
KR101560037B1 (ko) 2011-11-25 2015-10-15 주식회사 엘지화학 경화성 조성물
WO2013077706A1 (ko) 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
CN103987785B (zh) 2011-11-25 2017-03-29 Lg化学株式会社 可固化组合物
JP6203189B2 (ja) 2011-11-25 2017-09-27 エルジー・ケム・リミテッド 硬化性組成物
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
CN104508048B (zh) 2012-07-27 2017-08-25 Lg化学株式会社 可固化组合物
TWI558741B (zh) 2012-07-27 2016-11-21 Ｌｇ化學股份有限公司 可固化組成物
EP2878638B1 (en) 2012-07-27 2019-05-22 LG Chem, Ltd. Hardening composition
KR101560047B1 (ko) 2012-07-27 2015-10-15 주식회사 엘지화학 경화성 조성물
CN104487517B (zh) 2012-07-27 2017-06-13 Lg化学株式会社 可固化组合物
EP2878637B1 (en) 2012-07-27 2018-09-26 LG Chem, Ltd. Hardening composition
KR101560042B1 (ko) 2012-07-27 2015-10-15 주식회사 엘지화학 경화성 조성물
CN105102540B (zh) 2013-04-04 2017-09-05 株式会社Lg化学 可固化组合物
CN105102543B (zh) 2013-04-04 2017-07-21 株式会社Lg化学 可固化组合物
WO2014163442A1 (ko) 2013-04-04 2014-10-09 주식회사 엘지화학 경화성 조성물
EP2960295B1 (en) 2013-04-04 2020-01-08 LG Chem, Ltd. Curable composition
KR101591170B1 (ko) 2013-04-04 2016-02-02 주식회사 엘지화학 경화성 조성물
WO2015115812A1 (ko) 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
WO2015115810A1 (ko) 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
WO2015115811A1 (ko) 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
EP3101052B1 (en) 2014-01-28 2019-11-27 LG Chem, Ltd. Cured product
WO2015115808A1 (ko) 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
JP2016111210A (ja) * 2014-12-08 2016-06-20 信越化学工業株式会社 ダイボンド材を用いた導電接続方法及び光半導体装置
KR101880211B1 (ko) 2015-12-30 2018-07-20 주식회사 엘지화학 경화성 조성물
KR102113481B1 (ko) 2016-04-20 2020-05-21 주식회사 엘지화학 경화성 조성물

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8328376B2 (en) 2005-12-22 2012-12-11 Cree, Inc. Lighting device

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