JP2000269337A5 - - Google Patents

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Publication number
JP2000269337A5
JP2000269337A5 JP1999075097A JP7509799A JP2000269337A5 JP 2000269337 A5 JP2000269337 A5 JP 2000269337A5 JP 1999075097 A JP1999075097 A JP 1999075097A JP 7509799 A JP7509799 A JP 7509799A JP 2000269337 A5 JP2000269337 A5 JP 2000269337A5
Authority
JP
Japan
Prior art keywords
wiring
insulating film
semiconductor device
young
modulus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999075097A
Other languages
English (en)
Japanese (ja)
Other versions
JP4460669B2 (ja
JP2000269337A (ja
Filing date
Publication date
Priority claimed from JP07509799A external-priority patent/JP4460669B2/ja
Priority to JP07509799A priority Critical patent/JP4460669B2/ja
Application filed filed Critical
Priority to TW089104379A priority patent/TW490710B/zh
Priority to KR10-2000-0013954A priority patent/KR100429750B1/ko
Priority to US09/531,011 priority patent/US6414394B1/en
Publication of JP2000269337A publication Critical patent/JP2000269337A/ja
Priority to US10/085,067 priority patent/US6580171B2/en
Publication of JP2000269337A5 publication Critical patent/JP2000269337A5/ja
Publication of JP4460669B2 publication Critical patent/JP4460669B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP07509799A 1999-03-19 1999-03-19 半導体装置 Expired - Fee Related JP4460669B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP07509799A JP4460669B2 (ja) 1999-03-19 1999-03-19 半導体装置
TW089104379A TW490710B (en) 1999-03-19 2000-03-10 Semiconductor device
KR10-2000-0013954A KR100429750B1 (ko) 1999-03-19 2000-03-20 반도체 장치
US09/531,011 US6414394B1 (en) 1999-03-19 2000-03-20 Semiconductor device
US10/085,067 US6580171B2 (en) 1999-03-19 2002-03-01 Semiconductor wiring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07509799A JP4460669B2 (ja) 1999-03-19 1999-03-19 半導体装置

Publications (3)

Publication Number Publication Date
JP2000269337A JP2000269337A (ja) 2000-09-29
JP2000269337A5 true JP2000269337A5 (enExample) 2006-04-27
JP4460669B2 JP4460669B2 (ja) 2010-05-12

Family

ID=13566336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP07509799A Expired - Fee Related JP4460669B2 (ja) 1999-03-19 1999-03-19 半導体装置

Country Status (4)

Country Link
US (2) US6414394B1 (enExample)
JP (1) JP4460669B2 (enExample)
KR (1) KR100429750B1 (enExample)
TW (1) TW490710B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164428A (ja) * 2000-11-29 2002-06-07 Hitachi Ltd 半導体装置およびその製造方法
JP2002299441A (ja) * 2001-03-30 2002-10-11 Jsr Corp デュアルダマシン構造の形成方法
JP4731456B2 (ja) 2006-12-19 2011-07-27 富士通セミコンダクター株式会社 半導体装置
JP2012530362A (ja) * 2009-06-19 2012-11-29 アイメック 金属／有機誘電体界面でのクラックの低減
TWI414047B (zh) * 2010-03-17 2013-11-01 財團法人工業技術研究院 電子元件封裝結構及其製造方法
KR101906408B1 (ko) * 2011-10-04 2018-10-11 삼성전자주식회사 반도체 패키지 및 그 제조 방법
US9397051B2 (en) * 2013-12-03 2016-07-19 Invensas Corporation Warpage reduction in structures with electrical circuitry
JP6540650B2 (ja) * 2016-10-19 2019-07-10 株式会社村田製作所 半導体装置およびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3092675B2 (ja) * 1990-09-28 2000-09-25 東ソー株式会社 オキシナイトライドガラス及びその製造方法
US5689136A (en) * 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
JPH07326671A (ja) 1994-05-31 1995-12-12 Texas Instr Inc <Ti> 半導体装置の製造方法
JP3305211B2 (ja) * 1996-09-10 2002-07-22 松下電器産業株式会社 半導体装置及びその製造方法
US5945203A (en) * 1997-10-14 1999-08-31 Zms Llc Stratified composite dielectric and method of fabrication
US6001747A (en) * 1998-07-22 1999-12-14 Vlsi Technology, Inc. Process to improve adhesion of cap layers in integrated circuits
US6037668A (en) * 1998-11-13 2000-03-14 Motorola, Inc. Integrated circuit having a support structure

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