JP2000252243A5 - - Google Patents
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- Publication number
- JP2000252243A5 JP2000252243A5 JP1999352885A JP35288599A JP2000252243A5 JP 2000252243 A5 JP2000252243 A5 JP 2000252243A5 JP 1999352885 A JP1999352885 A JP 1999352885A JP 35288599 A JP35288599 A JP 35288599A JP 2000252243 A5 JP2000252243 A5 JP 2000252243A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- protective film
- forming agent
- film forming
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 40
- 239000003795 chemical substances by application Substances 0.000 description 38
- 238000005498 polishing Methods 0.000 description 34
- 230000001681 protective effect Effects 0.000 description 28
- 239000002904 solvent Substances 0.000 description 15
- 239000007864 aqueous solution Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 229910044991 metal oxide Inorganic materials 0.000 description 10
- 150000004706 metal oxides Chemical class 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000012141 concentrate Substances 0.000 description 9
- 239000007800 oxidant agent Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 4
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35288599A JP2000252243A (ja) | 1998-12-28 | 1999-12-13 | 金属用研磨液及びそれを用いた研磨方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37260898 | 1998-12-28 | ||
| JP10-372608 | 1998-12-28 | ||
| JP35288599A JP2000252243A (ja) | 1998-12-28 | 1999-12-13 | 金属用研磨液及びそれを用いた研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000252243A JP2000252243A (ja) | 2000-09-14 |
| JP2000252243A5 true JP2000252243A5 (enrdf_load_stackoverflow) | 2007-02-22 |
Family
ID=26579726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35288599A Pending JP2000252243A (ja) | 1998-12-28 | 1999-12-13 | 金属用研磨液及びそれを用いた研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000252243A (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100463315B1 (ko) * | 1998-12-28 | 2005-01-07 | 히다치 가세고교 가부시끼가이샤 | 금속용 연마액 재료, 금속용 연마액, 그 제조방법 및그것을 사용한 연마방법 |
| JP4614497B2 (ja) * | 1999-07-13 | 2011-01-19 | 花王株式会社 | 研磨液組成物 |
| KR100490963B1 (ko) | 1999-07-13 | 2005-05-24 | 카오카부시키가이샤 | 연마액 조성물 |
| TWI257126B (en) * | 2002-07-25 | 2006-06-21 | Hitachi Chemical Co Ltd | Slurry and polishing method |
| JP4667013B2 (ja) * | 2003-11-14 | 2011-04-06 | 昭和電工株式会社 | 研磨組成物および研磨方法 |
| US7348276B2 (en) | 2005-03-30 | 2008-03-25 | Fujitsu, Limited | Fabrication process of semiconductor device and polishing method |
| JP5433936B2 (ja) * | 2006-10-11 | 2014-03-05 | 日立化成株式会社 | 金属用研磨液とその製造方法及び金属用研磨液を用いた被研磨膜の研磨方法 |
| EP2401237A1 (en) * | 2009-02-26 | 2012-01-04 | PPT Research, Inc. | Corrosion inhibiting compositions |
| CN108527012A (zh) * | 2018-05-21 | 2018-09-14 | 浙江工业大学 | 一种利用液态金属抛光液进行大平面抛光的装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0864594A (ja) * | 1994-08-18 | 1996-03-08 | Sumitomo Metal Ind Ltd | 配線の形成方法 |
| JPH10163141A (ja) * | 1996-12-02 | 1998-06-19 | Fujimi Inkooporeetetsudo:Kk | 銅の研磨用組成物 |
| US6309560B1 (en) * | 1996-12-09 | 2001-10-30 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
| CN1165975C (zh) * | 1997-04-30 | 2004-09-08 | 美国3M公司 | 对半导体晶片表面进行平整的方法 |
-
1999
- 1999-12-13 JP JP35288599A patent/JP2000252243A/ja active Pending
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