JP2000235636A - 欠陥情報を利用した情報媒体 - Google Patents

欠陥情報を利用した情報媒体

Info

Publication number
JP2000235636A
JP2000235636A JP35222599A JP35222599A JP2000235636A JP 2000235636 A JP2000235636 A JP 2000235636A JP 35222599 A JP35222599 A JP 35222599A JP 35222599 A JP35222599 A JP 35222599A JP 2000235636 A JP2000235636 A JP 2000235636A
Authority
JP
Japan
Prior art keywords
card
semiconductor chip
light
defect
code signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP35222599A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000235636A5 (enrdf_load_stackoverflow
Inventor
Kazuo Takeda
一男 武田
Aritoshi Sugimoto
有俊 杉本
Takanori Ninomiya
隆典 二宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP35222599A priority Critical patent/JP2000235636A/ja
Publication of JP2000235636A publication Critical patent/JP2000235636A/ja
Publication of JP2000235636A5 publication Critical patent/JP2000235636A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
    • G06K19/083—Constructional details
    • G06K19/086—Constructional details with markings consisting of randomly placed or oriented elements, the randomness of the elements being useable for generating a unique identifying signature of the record carrier, e.g. randomly placed magnetic fibers or magnetic particles in the body of a credit card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP35222599A 1998-12-14 1999-12-10 欠陥情報を利用した情報媒体 Pending JP2000235636A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35222599A JP2000235636A (ja) 1998-12-14 1999-12-10 欠陥情報を利用した情報媒体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-354155 1998-12-14
JP35415598 1998-12-14
JP35222599A JP2000235636A (ja) 1998-12-14 1999-12-10 欠陥情報を利用した情報媒体

Publications (2)

Publication Number Publication Date
JP2000235636A true JP2000235636A (ja) 2000-08-29
JP2000235636A5 JP2000235636A5 (enrdf_load_stackoverflow) 2006-03-23

Family

ID=26579590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35222599A Pending JP2000235636A (ja) 1998-12-14 1999-12-10 欠陥情報を利用した情報媒体

Country Status (1)

Country Link
JP (1) JP2000235636A (enrdf_load_stackoverflow)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006068987A (ja) * 2004-09-01 2006-03-16 Toppan Printing Co Ltd 偽造防止担体およびその認証方法
JP2006095834A (ja) * 2004-09-29 2006-04-13 Toppan Printing Co Ltd 情報読み取り方法
JP2007008498A (ja) * 2005-06-29 2007-01-18 Hitachi Ltd 無線ｉｃタグを内包した結束バンド
WO2007072796A1 (ja) * 2005-12-19 2007-06-28 International Frontier Technology Laboratory, Inc. 放射性物質チップにより真贋判別可能なカード
AT504658B1 (de) * 2007-01-26 2008-07-15 Czak Christian Dkfm Sicherungsobjekt
JP2008176607A (ja) * 2007-01-19 2008-07-31 Tdk Corp メモリカードの特定方法
JP2011509449A (ja) * 2007-12-20 2011-03-24 コミサリア ア レネルジー アトミック エ オ ゼネルジー アルテルナティブ 有機ダイオードベースの識別・認証装置の製造方法、装置、及び使用方法
US9460316B2 (en) 2013-06-13 2016-10-04 Kabushiki Kaisha Toshiba Authentication device, authentication method, and computer program product
US9712166B2 (en) 2015-03-17 2017-07-18 Kabushiki Kaisha Toshiba Data generating device and authentication system
JP2017130759A (ja) * 2016-01-19 2017-07-27 株式会社東芝 情報処理システムおよび半導体素子
US9794073B2 (en) 2014-12-26 2017-10-17 Kabushiki Kaisha Toshiba Information processing system and semiconductor device
US9852281B2 (en) 2014-09-19 2017-12-26 Kabushiki Kaisha Toshiba Authentication system, authentication device, and authentication method
US9950553B2 (en) 2016-06-10 2018-04-24 Master Dynamic Limited Process of forming an identification marking, and an identification marking formed by way of such a process
US9983818B2 (en) 2013-09-18 2018-05-29 Toshiba Memory Corporation Individual identification device, storage device, individual identification system, method of individual identification, and program product
US10218518B2 (en) 2016-09-12 2019-02-26 Kabushiki Kaisha Toshiba Authentication server, authentication system, and authentication method
US10298407B2 (en) 2016-03-16 2019-05-21 Kabushiki Kaisha Toshiba Data generation apparatus, electronic device, and authentication system
JP7286029B1 (ja) * 2022-03-30 2023-06-02 三菱電機株式会社 半導体デバイス、半導体デバイスの製造方法及び半導体デバイスの識別方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259096A (ja) * 1985-09-10 1987-03-14 カシオ計算機株式会社 Ｉｃカ−ド
JPH0573738A (ja) * 1991-04-16 1993-03-26 Nhk Spring Co Ltd 対象物の識別構造
WO1997035162A1 (fr) * 1996-03-15 1997-09-25 Hitachi, Ltd. Procede et dispositif permettant de mesurer les defauts d'un cristal a partir de la surface de ce dernier
JPH10326334A (ja) * 1997-05-23 1998-12-08 Nisetsuto Kk Ｉｃカードおよびその認証装置
JPH11190702A (ja) * 1997-12-26 1999-07-13 Hitachi Ltd ウエハ検査装置
JPH11223607A (ja) * 1998-02-06 1999-08-17 Hitachi Ltd 結晶欠陥計測方法及び結晶欠陥計測装置
JPH11237225A (ja) * 1997-11-28 1999-08-31 Hitachi Ltd 欠陥検査装置
JPH11241996A (ja) * 1998-02-26 1999-09-07 Hitachi Ltd 結晶欠陥計測装置およびその方法
JPH11513831A (ja) * 1995-10-23 1999-11-24 ギーゼッケ ウント デフリエント ゲーエムベーハー データキャリアの信頼性試験方法
JPH11514466A (ja) * 1995-09-19 1999-12-07 シュラムバーガー アンデュストリエ ソシエテ アノニム 集積回路に関連した暗号キーを決定する方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259096A (ja) * 1985-09-10 1987-03-14 カシオ計算機株式会社 Ｉｃカ−ド
JPH0573738A (ja) * 1991-04-16 1993-03-26 Nhk Spring Co Ltd 対象物の識別構造
JPH11514466A (ja) * 1995-09-19 1999-12-07 シュラムバーガー アンデュストリエ ソシエテ アノニム 集積回路に関連した暗号キーを決定する方法
JPH11513831A (ja) * 1995-10-23 1999-11-24 ギーゼッケ ウント デフリエント ゲーエムベーハー データキャリアの信頼性試験方法
WO1997035162A1 (fr) * 1996-03-15 1997-09-25 Hitachi, Ltd. Procede et dispositif permettant de mesurer les defauts d'un cristal a partir de la surface de ce dernier
JPH10326334A (ja) * 1997-05-23 1998-12-08 Nisetsuto Kk Ｉｃカードおよびその認証装置
JPH11237225A (ja) * 1997-11-28 1999-08-31 Hitachi Ltd 欠陥検査装置
JPH11190702A (ja) * 1997-12-26 1999-07-13 Hitachi Ltd ウエハ検査装置
JPH11223607A (ja) * 1998-02-06 1999-08-17 Hitachi Ltd 結晶欠陥計測方法及び結晶欠陥計測装置
JPH11241996A (ja) * 1998-02-26 1999-09-07 Hitachi Ltd 結晶欠陥計測装置およびその方法

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006068987A (ja) * 2004-09-01 2006-03-16 Toppan Printing Co Ltd 偽造防止担体およびその認証方法
JP2006095834A (ja) * 2004-09-29 2006-04-13 Toppan Printing Co Ltd 情報読み取り方法
JP2007008498A (ja) * 2005-06-29 2007-01-18 Hitachi Ltd 無線ｉｃタグを内包した結束バンド
WO2007072796A1 (ja) * 2005-12-19 2007-06-28 International Frontier Technology Laboratory, Inc. 放射性物質チップにより真贋判別可能なカード
JP2008176607A (ja) * 2007-01-19 2008-07-31 Tdk Corp メモリカードの特定方法
AT504658B1 (de) * 2007-01-26 2008-07-15 Czak Christian Dkfm Sicherungsobjekt
JP2011509449A (ja) * 2007-12-20 2011-03-24 コミサリア ア レネルジー アトミック エ オ ゼネルジー アルテルナティブ 有機ダイオードベースの識別・認証装置の製造方法、装置、及び使用方法
US9460316B2 (en) 2013-06-13 2016-10-04 Kabushiki Kaisha Toshiba Authentication device, authentication method, and computer program product
US9983818B2 (en) 2013-09-18 2018-05-29 Toshiba Memory Corporation Individual identification device, storage device, individual identification system, method of individual identification, and program product
US9852281B2 (en) 2014-09-19 2017-12-26 Kabushiki Kaisha Toshiba Authentication system, authentication device, and authentication method
US9794073B2 (en) 2014-12-26 2017-10-17 Kabushiki Kaisha Toshiba Information processing system and semiconductor device
US9712166B2 (en) 2015-03-17 2017-07-18 Kabushiki Kaisha Toshiba Data generating device and authentication system
JP2017130759A (ja) * 2016-01-19 2017-07-27 株式会社東芝 情報処理システムおよび半導体素子
US10298407B2 (en) 2016-03-16 2019-05-21 Kabushiki Kaisha Toshiba Data generation apparatus, electronic device, and authentication system
US9950553B2 (en) 2016-06-10 2018-04-24 Master Dynamic Limited Process of forming an identification marking, and an identification marking formed by way of such a process
US10218518B2 (en) 2016-09-12 2019-02-26 Kabushiki Kaisha Toshiba Authentication server, authentication system, and authentication method
JP7286029B1 (ja) * 2022-03-30 2023-06-02 三菱電機株式会社 半導体デバイス、半導体デバイスの製造方法及び半導体デバイスの識別方法
WO2023188115A1 (ja) * 2022-03-30 2023-10-05 三菱電機株式会社 半導体デバイス、半導体デバイスの製造方法及び半導体デバイスの識別方法

Similar Documents

Publication Publication Date Title
US6760472B1 (en) Identification method for an article using crystal defects
JP2000235636A (ja) 欠陥情報を利用した情報媒体
US4476468A (en) Secure transaction card and verification system
CN100483453C (zh) 生物特征认证方法和生物特征认证装置
AU736113B2 (en) Personal identification authenticating with fingerprint identification
EP1679666B1 (en) Renewal method and renewal apparatus for a medium having biometric authentication functions
US20070027819A1 (en) Authenticity Verification
KR101734856B1 (ko) 지문인식과 연동되는 사진정보가 표출되는 융합카드
TWI470561B (zh) The card can be judged by the pictographic chip
CN101647030A (zh) 指纹识别设备以及包括指纹识别设备的卡的用户认证方法
FR2613102A1 (fr) Systeme pour emettre des cartes a circuits integres, procede pour l'assurer et systeme pour prevenir l'emission de cartes integrees
KR20070024511A (ko) 인증 확인 방법, 제품 및 장치
JP2002535782A (ja) 光学データ記憶装置を用いる、電子キャッシュカードおよびデジタル身分証明カードの有効性確認方法
GB1561714A (en) Frud resistant documents and tapes for making same
GB1570195A (en) Secure property document and apparatus for reading the same
KR20180038351A (ko) 지문인식과 연동되는 융합카드의 인증시스템
JP2001506029A (ja) 電子キャッシュカードのための偽造防止有効性確認方法およびシステム
EP4032023B1 (en) Adhesive label
KR101732544B1 (ko) 지문인식과 연동되는 융합카드의 인증시스템
JP2000182019A (ja) Ｉｃカードの識別用データ確認方法
JPS59140580A (ja) キ−カ−ドおよびキ−カ−ドを用いた使用者適格識別方法
JP3453162B2 (ja) ホログラムコードの読取装置および方法、ならびにホログラムおよびホログラム付きカード
KR101822901B1 (ko) 지문인식과 연동되는 플랙시블디스플레이에 의하여 사진정보가 표출되는 융합카드 및 그 인증처리방법
JP4644483B2 (ja) 磁気記録媒体の認証方法、磁気記録媒体の認証システム、および認証可能な磁気記録媒体
KR101813888B1 (ko) 지문인식과 연동되는 플랙시블디스플레이에 의하여 사진정보가 표출되는 융합카드

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060206

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060206

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20060206

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080819

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080826

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20081224