JP2000216334A5 - - Google Patents
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- Publication number
- JP2000216334A5 JP2000216334A5 JP1999015557A JP1555799A JP2000216334A5 JP 2000216334 A5 JP2000216334 A5 JP 2000216334A5 JP 1999015557 A JP1999015557 A JP 1999015557A JP 1555799 A JP1555799 A JP 1555799A JP 2000216334 A5 JP2000216334 A5 JP 2000216334A5
- Authority
- JP
- Japan
- Prior art keywords
- spherical
- semiconductor
- semiconductors
- spherical semiconductors
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 claims description 88
- 239000000853 adhesive Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11015557A JP2000216334A (ja) | 1999-01-25 | 1999-01-25 | 半導体装置 |
| US09/489,985 US6476461B2 (en) | 1999-01-25 | 2000-01-21 | Arrangement of stacked, spherically-shaped semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11015557A JP2000216334A (ja) | 1999-01-25 | 1999-01-25 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000216334A JP2000216334A (ja) | 2000-08-04 |
| JP2000216334A5 true JP2000216334A5 (enExample) | 2004-09-30 |
Family
ID=11892076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11015557A Withdrawn JP2000216334A (ja) | 1999-01-25 | 1999-01-25 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6476461B2 (enExample) |
| JP (1) | JP2000216334A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076249A (ja) * | 2000-08-28 | 2002-03-15 | Dainippon Printing Co Ltd | クラスタ球状半導体 |
| JP6042956B1 (ja) * | 2015-09-30 | 2016-12-14 | オリジン電気株式会社 | 半田付け製品の製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4451968A (en) | 1981-09-08 | 1984-06-05 | Texas Instruments Incorporated | Method and device for providing an ohmic contact of high resistance on a semiconductor at low temperatures |
| JPH0780383B2 (ja) * | 1989-08-28 | 1995-08-30 | 三菱電機株式会社 | メモリカード |
| JP2944449B2 (ja) | 1995-02-24 | 1999-09-06 | 日本電気株式会社 | 半導体パッケージとその製造方法 |
| KR100377825B1 (ko) | 1996-10-09 | 2003-07-16 | 나가다 죠스게 | 반도체디바이스 |
| US5955776A (en) | 1996-12-04 | 1999-09-21 | Ball Semiconductor, Inc. | Spherical shaped semiconductor integrated circuit |
| KR100234719B1 (ko) | 1997-03-14 | 1999-12-15 | 김영환 | 에리어 어레이 패키지 및 그 제조방법 |
| US6046910A (en) | 1998-03-18 | 2000-04-04 | Motorola, Inc. | Microelectronic assembly having slidable contacts and method for manufacturing the assembly |
| US5877943A (en) | 1998-03-26 | 1999-03-02 | Ball Semiconductor, Inc. | Clustering adapter for spherical shaped devices |
| JPH11354661A (ja) * | 1998-06-09 | 1999-12-24 | Shinko Electric Ind Co Ltd | 球状ｉｃ用のパッケージ、球状ｉｃ用の回路基板及び半導体装置 |
| US6052517A (en) * | 1998-06-30 | 2000-04-18 | Ball Semiconductor, Inc. | Spherical cell design for VLSI circuit design on a spherical semiconductor |
-
1999
- 1999-01-25 JP JP11015557A patent/JP2000216334A/ja not_active Withdrawn
-
2000
- 2000-01-21 US US09/489,985 patent/US6476461B2/en not_active Expired - Fee Related
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