JP2000208617A5 - - Google Patents
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- Publication number
- JP2000208617A5 JP2000208617A5 JP1999010772A JP1077299A JP2000208617A5 JP 2000208617 A5 JP2000208617 A5 JP 2000208617A5 JP 1999010772 A JP1999010772 A JP 1999010772A JP 1077299 A JP1077299 A JP 1077299A JP 2000208617 A5 JP2000208617 A5 JP 2000208617A5
- Authority
- JP
- Japan
- Prior art keywords
- plug
- via hole
- layer wiring
- interlayer insulating
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 description 21
- 239000011229 interlayer Substances 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- 239000002184 metal Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11010772A JP2000208617A (ja) | 1999-01-19 | 1999-01-19 | 半導体集積回路及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11010772A JP2000208617A (ja) | 1999-01-19 | 1999-01-19 | 半導体集積回路及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000208617A JP2000208617A (ja) | 2000-07-28 |
| JP2000208617A5 true JP2000208617A5 (enExample) | 2006-03-02 |
Family
ID=11759634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11010772A Pending JP2000208617A (ja) | 1999-01-19 | 1999-01-19 | 半導体集積回路及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000208617A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6611010B2 (en) | 1999-12-03 | 2003-08-26 | Kabushiki Kaisha Toshiba | Semiconductor device |
| JP5364743B2 (ja) * | 2011-03-01 | 2013-12-11 | 株式会社東芝 | 半導体装置 |
-
1999
- 1999-01-19 JP JP11010772A patent/JP2000208617A/ja active Pending
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